CN101288035B - 可重复热处理的方法和设备 - Google Patents

可重复热处理的方法和设备 Download PDF

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Publication number
CN101288035B
CN101288035B CN2006800381952A CN200680038195A CN101288035B CN 101288035 B CN101288035 B CN 101288035B CN 2006800381952 A CN2006800381952 A CN 2006800381952A CN 200680038195 A CN200680038195 A CN 200680038195A CN 101288035 B CN101288035 B CN 101288035B
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China
Prior art keywords
flash
illumination
temperature
energy
wafer
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Chinese (zh)
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CN101288035A (zh
Inventor
大卫·玛尔科穆·卡穆
谢尔吉·德茨
凯文·麦克唐奈
格雷戈·斯图尔特
蒂尔曼·斯鲁姆
伊戈·鲁迪克
柳博米尔·卡卢杰尔西克
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Beijing E Town Semiconductor Technology Co Ltd
Mattson Technology Inc
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Mattson Technology Inc
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Radiation Pyrometers (AREA)
CN2006800381952A 2005-09-14 2006-09-14 可重复热处理的方法和设备 Active CN101288035B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US71648805P 2005-09-14 2005-09-14
US60/716,488 2005-09-14
PCT/CA2006/001518 WO2007030941A1 (en) 2005-09-14 2006-09-14 Repeatable heat-treating methods and apparatus

Publications (2)

Publication Number Publication Date
CN101288035A CN101288035A (zh) 2008-10-15
CN101288035B true CN101288035B (zh) 2013-06-19

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CN2006800381952A Active CN101288035B (zh) 2005-09-14 2006-09-14 可重复热处理的方法和设备

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US (1) US9482468B2 (enExample)
JP (1) JP5294862B2 (enExample)
CN (1) CN101288035B (enExample)
WO (1) WO2007030941A1 (enExample)

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JP5562572B2 (ja) * 2009-03-30 2014-07-30 大日本スクリーン製造株式会社 熱処理装置および熱処理方法
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JP5847905B2 (ja) * 2014-09-30 2016-01-27 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP6068556B2 (ja) * 2015-05-18 2017-01-25 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP6772258B2 (ja) * 2015-12-30 2020-10-21 マトソン テクノロジー インコーポレイテッドＭａｔｔｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ， Ｉｎｃ． ミリ秒アニールシステムのための予熱方法
CN107557871B (zh) * 2016-07-01 2019-10-25 上海微电子装备（集团）股份有限公司 激光退火装置及方法
KR102227883B1 (ko) 2016-12-14 2021-03-16 베이징 이타운 세미컨덕터 테크놀로지 컴퍼니 리미티드 급속 열 활성화 공정과 함께 플라즈마를 이용하는 원자층 에칭 공정
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JP6987705B2 (ja) * 2018-06-25 2022-01-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7013337B2 (ja) * 2018-06-29 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
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CN115461850A (zh) 2020-02-28 2022-12-09 玛特森技术公司 热处理系统中的工件的基于发射的温度测量
CN112432968B (zh) * 2020-10-21 2022-08-30 中国核动力研究设计院 辐照后反应堆结构材料热导率测试样的制备方法及试样盒
JP7773926B2 (ja) * 2022-03-09 2025-11-20 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN115963874B (zh) * 2023-01-17 2023-07-21 东莞理工学院 一种温度跟踪控制方法

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US9482468B2 (en) 2016-11-01
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WO2007030941A1 (en) 2007-03-22
US20070069161A1 (en) 2007-03-29
JP5294862B2 (ja) 2013-09-18

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