JP5292066B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP5292066B2 JP5292066B2 JP2008296460A JP2008296460A JP5292066B2 JP 5292066 B2 JP5292066 B2 JP 5292066B2 JP 2008296460 A JP2008296460 A JP 2008296460A JP 2008296460 A JP2008296460 A JP 2008296460A JP 5292066 B2 JP5292066 B2 JP 5292066B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- layer
- film
- region
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008296460A JP5292066B2 (ja) | 2007-12-05 | 2008-11-20 | 表示装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007314123 | 2007-12-05 | ||
| JP2007314123 | 2007-12-05 | ||
| JP2008296460A JP5292066B2 (ja) | 2007-12-05 | 2008-11-20 | 表示装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012237398A Division JP2013080228A (ja) | 2007-12-05 | 2012-10-29 | 表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009157354A JP2009157354A (ja) | 2009-07-16 |
| JP2009157354A5 JP2009157354A5 (enExample) | 2011-12-15 |
| JP5292066B2 true JP5292066B2 (ja) | 2013-09-18 |
Family
ID=40720688
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008296460A Active JP5292066B2 (ja) | 2007-12-05 | 2008-11-20 | 表示装置 |
| JP2012237398A Withdrawn JP2013080228A (ja) | 2007-12-05 | 2012-10-29 | 表示装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012237398A Withdrawn JP2013080228A (ja) | 2007-12-05 | 2012-10-29 | 表示装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8039840B2 (enExample) |
| JP (2) | JP5292066B2 (enExample) |
| CN (2) | CN102683355B (enExample) |
| TW (2) | TWI567466B (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8114720B2 (en) * | 2008-12-25 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101460868B1 (ko) | 2009-07-10 | 2014-11-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN104992984B (zh) | 2009-07-31 | 2019-08-16 | 株式会社半导体能源研究所 | 半导体装置、显示模块及电子装置 |
| TWI529914B (zh) * | 2009-08-07 | 2016-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| CN105428424A (zh) * | 2009-09-16 | 2016-03-23 | 株式会社半导体能源研究所 | 晶体管及显示设备 |
| KR101687311B1 (ko) * | 2009-10-07 | 2016-12-16 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| KR101803554B1 (ko) * | 2009-10-21 | 2017-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제작방법 |
| US8187929B2 (en) * | 2009-11-04 | 2012-05-29 | Cbrite, Inc. | Mask level reduction for MOSFET |
| US9129868B2 (en) * | 2009-11-04 | 2015-09-08 | Cbrite Inc. | Mask level reduction for MOFET |
| CN102652330B (zh) * | 2009-12-09 | 2014-09-17 | 夏普株式会社 | 半导体装置及其制造方法 |
| US8053818B2 (en) * | 2009-12-18 | 2011-11-08 | Palo Alto Research Center Incorporated | Thin film field effect transistor with dual semiconductor layers |
| KR101042957B1 (ko) | 2010-03-19 | 2011-06-20 | 삼성모바일디스플레이주식회사 | 트랜지스터 기판, 및 이의 제조 방법 |
| US8603841B2 (en) * | 2010-08-27 | 2013-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing methods of semiconductor device and light-emitting display device |
| JP5848918B2 (ja) | 2010-09-03 | 2016-01-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| WO2012029596A1 (en) * | 2010-09-03 | 2012-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9142568B2 (en) | 2010-09-10 | 2015-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting display device |
| US8647919B2 (en) * | 2010-09-13 | 2014-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting display device and method for manufacturing the same |
| KR101640293B1 (ko) | 2010-10-07 | 2016-07-15 | 샤프 가부시키가이샤 | 반도체 장치, 표시 장치, 및 반도체 장치 및 표시 장치의 제조 방법 |
| JP5912467B2 (ja) * | 2010-12-10 | 2016-04-27 | 株式会社半導体エネルギー研究所 | 光電変換回路及び表示装置 |
| KR101770969B1 (ko) * | 2011-01-21 | 2017-08-25 | 삼성디스플레이 주식회사 | 터치 센싱 기판 및 이의 제조 방법 |
| KR20130026891A (ko) * | 2011-09-06 | 2013-03-14 | 엘지전자 주식회사 | 이동 단말기 및 그것의 전력 관리 장치 |
| JP6076038B2 (ja) | 2011-11-11 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| TWI489560B (zh) * | 2011-11-24 | 2015-06-21 | Au Optronics Corp | 畫素結構及其製作方法 |
| JP6033071B2 (ja) | 2011-12-23 | 2016-11-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6306278B2 (ja) * | 2012-04-09 | 2018-04-04 | Jsr株式会社 | 半導体素子、半導体基板、感放射線性樹脂組成物、保護膜および表示素子 |
| KR101938761B1 (ko) * | 2012-05-23 | 2019-01-16 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 이를 포함하는 유기 발광 표시 장치 및 그 제조 방법 |
| TWI493726B (zh) * | 2012-06-05 | 2015-07-21 | E Ink Holdings Inc | 薄膜電晶體結構及其陣列基板 |
| CN102790096A (zh) * | 2012-07-20 | 2012-11-21 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、阵列基板、显示装置 |
| WO2014021356A1 (en) | 2012-08-03 | 2014-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN103219284B (zh) * | 2013-03-19 | 2015-04-08 | 北京京东方光电科技有限公司 | Tft阵列基板、tft阵列基板的制作方法及显示装置 |
| US9915848B2 (en) * | 2013-04-19 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| TWI687748B (zh) | 2013-06-05 | 2020-03-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
| KR20150010065A (ko) * | 2013-07-18 | 2015-01-28 | 삼성디스플레이 주식회사 | 산화물 반도체 소자의 제조 방법 및 산화물 반도체 소자를 포함하는 표시 장치의 제조 방법 |
| JP6168915B2 (ja) * | 2013-08-22 | 2017-07-26 | キヤノン株式会社 | 半導体装置の製造方法 |
| TWI553835B (zh) * | 2014-02-26 | 2016-10-11 | 友達光電股份有限公司 | 主動基板以及顯示面板 |
| KR102503719B1 (ko) * | 2016-05-03 | 2023-02-24 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
| KR102464900B1 (ko) * | 2016-05-11 | 2022-11-09 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| JP6873753B2 (ja) * | 2017-03-09 | 2021-05-19 | パナソニック液晶ディスプレイ株式会社 | 液晶表示装置 |
| CN109256418A (zh) * | 2017-07-14 | 2019-01-22 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制备方法、阵列基板和显示装置 |
| CN108280317B (zh) * | 2018-04-27 | 2024-02-13 | 深圳市爱协生科技股份有限公司 | 显示驱动集成电路结构及制作方法 |
| CN109087894A (zh) * | 2018-07-17 | 2018-12-25 | 武汉华星光电半导体显示技术有限公司 | 柔性显示器 |
| TWI819745B (zh) * | 2022-08-11 | 2023-10-21 | 友達光電股份有限公司 | 近眼顯示裝置及其製造方法 |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2668935B2 (ja) | 1988-05-10 | 1997-10-27 | 松下電器産業株式会社 | マトリクス型画像表示装置用半導体装置およびその製造方法 |
| JPH03249735A (ja) | 1990-02-28 | 1991-11-07 | Sanyo Electric Co Ltd | 薄膜トランジスタの製造方法 |
| JPH04369623A (ja) | 1991-06-19 | 1992-12-22 | Toshiba Corp | アクティブマトリクス型液晶表示装置 |
| JP3286930B2 (ja) | 1995-07-03 | 2002-05-27 | 富士通株式会社 | 薄膜トランジスタマトリクス基板 |
| JP2803713B2 (ja) | 1995-12-08 | 1998-09-24 | 日本電気株式会社 | アクティブマトリクス基板及びその製造方法 |
| JP3622934B2 (ja) | 1996-07-31 | 2005-02-23 | エルジー フィリップス エルシーディー カンパニー リミテッド | 薄膜トランジスタ型液晶表示装置 |
| TW379360B (en) * | 1997-03-03 | 2000-01-11 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
| JP3208658B2 (ja) | 1997-03-27 | 2001-09-17 | 株式会社アドバンスト・ディスプレイ | 電気光学素子の製法 |
| JP3544280B2 (ja) * | 1997-03-27 | 2004-07-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR100244447B1 (ko) | 1997-04-03 | 2000-02-01 | 구본준 | 액정 표시 장치 및 그 액정 표시 장치의 제조 방법 |
| JP4302194B2 (ja) * | 1997-04-25 | 2009-07-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6307214B1 (en) * | 1997-06-06 | 2001-10-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor thin film and semiconductor device |
| US6452211B1 (en) * | 1997-06-10 | 2002-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor thin film and semiconductor device |
| JP4027465B2 (ja) * | 1997-07-01 | 2007-12-26 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその製造方法 |
| JP3390633B2 (ja) * | 1997-07-14 | 2003-03-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3844566B2 (ja) * | 1997-07-30 | 2006-11-15 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6197624B1 (en) * | 1997-08-29 | 2001-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Method of adjusting the threshold voltage in an SOI CMOS |
| JP4050377B2 (ja) * | 1997-10-31 | 2008-02-20 | セイコーエプソン株式会社 | 液晶装置及び電子機器並びに投射型表示装置 |
| US6294441B1 (en) * | 1998-08-18 | 2001-09-25 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
| JP4156115B2 (ja) | 1998-12-25 | 2008-09-24 | シャープ株式会社 | マトリクス配線基板及び液晶表示装置用基板 |
| WO2000059041A1 (fr) | 1999-03-30 | 2000-10-05 | Seiko Epson Corporation | Procede de fabrication d'un transistor en couches minces |
| US6524876B1 (en) * | 1999-04-08 | 2003-02-25 | Samsung Electronics Co., Ltd. | Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same |
| JP2001051303A (ja) * | 1999-08-05 | 2001-02-23 | Fujitsu Ltd | 液晶表示装置及びその製造方法 |
| JP2002116712A (ja) | 2000-10-04 | 2002-04-19 | Advanced Display Inc | 表示装置および表示装置の製造方法 |
| JP4048711B2 (ja) * | 2000-11-15 | 2008-02-20 | カシオ計算機株式会社 | 薄膜トランジスタパネル |
| JP2002151699A (ja) | 2000-11-15 | 2002-05-24 | Casio Comput Co Ltd | アクティブマトリクス型液晶表示装置 |
| US7071037B2 (en) * | 2001-03-06 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2002289857A (ja) * | 2001-03-23 | 2002-10-04 | Toshiba Corp | マトリクスアレイ基板の製造方法 |
| KR100732877B1 (ko) * | 2001-08-21 | 2007-06-27 | 엘지.필립스 엘시디 주식회사 | 엑스레이 영상 감지소자 및 그의 제조 방법 |
| US7209192B2 (en) * | 2001-09-26 | 2007-04-24 | Samsung Electronics Co., Ltd. | Thin film transistor array panel for liquid crystal display and method for manufacturing the same |
| KR100835974B1 (ko) * | 2001-12-24 | 2008-06-09 | 엘지디스플레이 주식회사 | 횡전계방식 액정표시장치용 어레이기판과 그 제조방법 |
| JP2003243327A (ja) | 2002-02-20 | 2003-08-29 | Seiko Epson Corp | 電子デバイス、配線形成方法および配線形成装置 |
| KR20030075046A (ko) | 2002-03-15 | 2003-09-22 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치 및 그 제조 방법 |
| US7038239B2 (en) * | 2002-04-09 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| JP3989761B2 (ja) | 2002-04-09 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| US7167217B2 (en) * | 2002-08-23 | 2007-01-23 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
| US7183146B2 (en) * | 2003-01-17 | 2007-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| US20040174483A1 (en) | 2003-03-07 | 2004-09-09 | Yayoi Nakamura | Liquid crystal display device having auxiliary capacitive electrode |
| JP4182779B2 (ja) * | 2003-03-07 | 2008-11-19 | カシオ計算機株式会社 | 表示装置およびその製造方法 |
| TWI336921B (en) * | 2003-07-18 | 2011-02-01 | Semiconductor Energy Lab | Method for manufacturing semiconductor device |
| US7211454B2 (en) * | 2003-07-25 | 2007-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate |
| JP4483235B2 (ja) * | 2003-09-01 | 2010-06-16 | カシオ計算機株式会社 | トランジスタアレイ基板の製造方法及びトランジスタアレイ基板 |
| TWI366701B (en) | 2004-01-26 | 2012-06-21 | Semiconductor Energy Lab | Method of manufacturing display and television |
| KR101121620B1 (ko) * | 2004-06-05 | 2012-02-28 | 엘지디스플레이 주식회사 | 표시 소자용 박막 트랜지스터 기판 및 그 제조 방법 |
| CN101880859B (zh) * | 2005-01-12 | 2013-03-27 | 出光兴产株式会社 | 溅射标靶 |
| CN1743933A (zh) * | 2005-09-27 | 2006-03-08 | 广辉电子股份有限公司 | 像素结构及其制造方法 |
| KR100818887B1 (ko) * | 2005-12-14 | 2008-04-02 | 엘지.필립스 엘시디 주식회사 | 액정 표시장치 및 그 제조 방법 |
| US8212953B2 (en) | 2005-12-26 | 2012-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5121221B2 (ja) | 2005-12-26 | 2013-01-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20090207329A1 (en) * | 2006-03-24 | 2009-08-20 | Sharp Kabushiki Kaisha | Liquid crystal display |
| TWI603307B (zh) * | 2006-04-05 | 2017-10-21 | 半導體能源研究所股份有限公司 | 半導體裝置,顯示裝置,和電子裝置 |
| JP4862777B2 (ja) * | 2007-08-10 | 2012-01-25 | カシオ計算機株式会社 | 表示装置 |
-
2008
- 2008-11-20 JP JP2008296460A patent/JP5292066B2/ja active Active
- 2008-12-02 TW TW097146801A patent/TWI567466B/zh active
- 2008-12-02 TW TW100143555A patent/TWI450008B/zh active
- 2008-12-03 US US12/327,107 patent/US8039840B2/en not_active Expired - Fee Related
- 2008-12-05 CN CN201210133227.4A patent/CN102683355B/zh active Active
- 2008-12-05 CN CN200810186986.0A patent/CN101452176B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101452176B (zh) | 2012-06-20 |
| US20120032177A1 (en) | 2012-02-09 |
| US20090146150A1 (en) | 2009-06-11 |
| CN102683355A (zh) | 2012-09-19 |
| TWI567466B (zh) | 2017-01-21 |
| JP2009157354A (ja) | 2009-07-16 |
| TW200947084A (en) | 2009-11-16 |
| TW201213993A (en) | 2012-04-01 |
| JP2013080228A (ja) | 2013-05-02 |
| US8039840B2 (en) | 2011-10-18 |
| US8878184B2 (en) | 2014-11-04 |
| CN101452176A (zh) | 2009-06-10 |
| TWI450008B (zh) | 2014-08-21 |
| CN102683355B (zh) | 2015-01-28 |
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