JP5205724B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP5205724B2
JP5205724B2 JP2006213929A JP2006213929A JP5205724B2 JP 5205724 B2 JP5205724 B2 JP 5205724B2 JP 2006213929 A JP2006213929 A JP 2006213929A JP 2006213929 A JP2006213929 A JP 2006213929A JP 5205724 B2 JP5205724 B2 JP 5205724B2
Authority
JP
Japan
Prior art keywords
light
light emitting
recess
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006213929A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008041917A (ja
JP2008041917A5 (https=
Inventor
育也 新居
宏明 宇川
伸英 笠江
俊公 高尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006213929A priority Critical patent/JP5205724B2/ja
Priority to US11/882,603 priority patent/US7815343B2/en
Publication of JP2008041917A publication Critical patent/JP2008041917A/ja
Publication of JP2008041917A5 publication Critical patent/JP2008041917A5/ja
Application granted granted Critical
Publication of JP5205724B2 publication Critical patent/JP5205724B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006213929A 2006-08-04 2006-08-04 発光装置 Active JP5205724B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006213929A JP5205724B2 (ja) 2006-08-04 2006-08-04 発光装置
US11/882,603 US7815343B2 (en) 2006-08-04 2007-08-02 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006213929A JP5205724B2 (ja) 2006-08-04 2006-08-04 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012110401A Division JP5327356B2 (ja) 2012-05-14 2012-05-14 発光装置

Publications (3)

Publication Number Publication Date
JP2008041917A JP2008041917A (ja) 2008-02-21
JP2008041917A5 JP2008041917A5 (https=) 2009-09-03
JP5205724B2 true JP5205724B2 (ja) 2013-06-05

Family

ID=39050542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006213929A Active JP5205724B2 (ja) 2006-08-04 2006-08-04 発光装置

Country Status (2)

Country Link
US (1) US7815343B2 (https=)
JP (1) JP5205724B2 (https=)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4783718B2 (ja) * 2006-11-27 2011-09-28 新光電気工業株式会社 照明装置
US7652297B2 (en) * 2007-09-11 2010-01-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device
CN101493216B (zh) * 2008-01-24 2011-11-09 富士迈半导体精密工业（上海）有限公司 发光二极管光源模组
JP5358104B2 (ja) * 2008-02-25 2013-12-04 豊田合成株式会社 発光装置
JP5236406B2 (ja) * 2008-03-28 2013-07-17 ローム株式会社 半導体発光モジュールおよびその製造方法
KR101526567B1 (ko) * 2008-05-07 2015-06-10 엘지이노텍 주식회사 발광 다이오드 패키지
JP2010020962A (ja) * 2008-07-09 2010-01-28 Kanehirodenshi Corp Ｌｅｄランプ
US20100067240A1 (en) * 2008-09-16 2010-03-18 John Selverian Optical Cup For Lighting Module
US8183585B2 (en) * 2008-09-16 2012-05-22 Osram Sylvania Inc. Lighting module
US8022626B2 (en) * 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
US8188486B2 (en) * 2008-09-16 2012-05-29 Osram Sylvania Inc. Optical disk for lighting module
KR101047603B1 (ko) * 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
DE102009012517A1 (de) * 2009-03-10 2010-09-16 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US8610156B2 (en) 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
EP2436059B1 (en) * 2009-05-27 2017-03-29 Koninklijke Philips N.V. Sealed thin-film device, method of and system for repairing a sealing layer applied to a thin-film device
TWI370216B (en) * 2009-06-29 2012-08-11 Lextar Electronics Corp Led lighting device
US20120267674A1 (en) * 2009-09-24 2012-10-25 Kyocera Corporation Mounting substrate, light emitting body, and method for manufacturing mounting substrate
KR20110039080A (ko) * 2009-10-09 2011-04-15 알티반도체 주식회사 백라이트 유닛 및 그 제조 방법
CN102044600A (zh) * 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
USD661262S1 (en) * 2009-10-26 2012-06-05 Nichia Corporation Light emitting diode
JP5311674B2 (ja) * 2010-01-14 2013-10-09 パナソニック株式会社 発光装置
KR101121151B1 (ko) * 2010-03-19 2012-03-20 주식회사 대원이노스트 Ｌｅｄ 모듈 및 그 제조 방법
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
CN105720180B (zh) * 2010-04-09 2018-05-29 罗姆股份有限公司 Led模块
KR101298406B1 (ko) * 2010-05-17 2013-08-20 엘지이노텍 주식회사 발광소자
KR101039994B1 (ko) 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
USD643821S1 (en) * 2010-07-05 2011-08-23 Samsung Led Co., Ltd. Base for light emitting diode
TWI449866B (zh) * 2010-09-30 2014-08-21 Hon Hai Prec Ind Co Ltd Led照明裝置
JP5570018B2 (ja) * 2010-10-23 2014-08-13 シチズン電子株式会社 Ｌｅｄモジュール
US9041046B2 (en) 2011-03-15 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for a light source
US20120236529A1 (en) * 2011-03-15 2012-09-20 Avago Technologies Ecbu Ip(Singapore) Pte. Ltd. Method And Apparatus For A Light Source
US20140003074A1 (en) * 2011-03-16 2014-01-02 Katsuhiko Kishimoto Wavelength conversion member and method for manufacturing the same, and light-emitting device, illuminating device, and headlight
DE102011105010A1 (de) * 2011-06-20 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
JPWO2013011628A1 (ja) * 2011-07-19 2015-02-23 パナソニック株式会社 発光装置及びその製造方法
US10211380B2 (en) * 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) * 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
CN103000782B (zh) * 2011-09-13 2016-09-07 展晶科技(深圳)有限公司 发光二极管封装结构
ES2693677T3 (es) * 2011-11-17 2018-12-13 Lumens Co., Ltd. Paquete de un dispositivo emisor de luz y retroiluminación que incluye el mismo
USD710809S1 (en) * 2012-01-12 2014-08-12 Dominant Opto Technologies Sdn. Bhd. Light emitting diode
US8872218B2 (en) * 2012-04-06 2014-10-28 Nichia Corporation Molded package and light emitting device
WO2014033768A1 (ja) * 2012-08-27 2014-03-06 パイオニア株式会社 半導体装置および半導体装置の製造方法
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
KR102042150B1 (ko) 2012-09-13 2019-11-07 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR102019499B1 (ko) * 2012-11-05 2019-09-06 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
KR101413596B1 (ko) * 2012-12-07 2014-07-02 주식회사 루멘스 발광장치 및 이를 구비하는 백라이트 유닛
JP6203503B2 (ja) * 2013-02-18 2017-09-27 スタンレー電気株式会社 半導体発光装置
JP6107229B2 (ja) * 2013-02-27 2017-04-05 日亜化学工業株式会社 発光装置
JP2014177592A (ja) * 2013-03-15 2014-09-25 Toshiba Corp 蛍光体およびそれを用いた発光装置
JP6476567B2 (ja) 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
US8919982B2 (en) * 2013-05-24 2014-12-30 Gabriel Pulido, JR. Lighting system for clothing
US11041118B2 (en) 2013-08-29 2021-06-22 Nichia Corporation Fluoride fluorescent material and method for producing the same as well as light emitting device using the same
WO2015033633A1 (ja) * 2013-09-03 2015-03-12 株式会社村田製作所 垂直共振面発光レーザ素子、それを備えた半導体ウエハおよび発光モジュール、ならびに垂直共振面発光レーザ素子の製造方法
US9755116B2 (en) * 2014-03-14 2017-09-05 Nichia Corporation Method of manufacturing light emitting device
US9680067B2 (en) * 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
TW201543720A (zh) * 2014-05-06 2015-11-16 新世紀光電股份有限公司 封裝結構及其製備方法
JP6374339B2 (ja) 2015-03-26 2018-08-15 日亜化学工業株式会社 発光装置
JP6485220B2 (ja) * 2015-05-27 2019-03-20 トヨタ紡織株式会社 車両用内装材
JP6536325B2 (ja) * 2015-09-30 2019-07-03 日亜化学工業株式会社 発光装置
USD845917S1 (en) * 2016-04-18 2019-04-16 Citizen Electronics Co., Ltd. Light emitting diode
JP1567062S (https=) * 2016-04-18 2017-01-16
USD845918S1 (en) 2016-04-18 2019-04-16 Citizen Electronics Co., Ltd. Light emitting diode
JP6728931B2 (ja) * 2016-04-21 2020-07-22 セイコーエプソン株式会社 光源装置およびプロジェクター
JP2020109850A (ja) * 2016-10-31 2020-07-16 日亜化学工業株式会社 発光装置の製造方法
JP1581164S (https=) 2016-12-15 2017-07-10
JP6555243B2 (ja) 2016-12-16 2019-08-07 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP6885055B2 (ja) * 2016-12-26 2021-06-09 日亜化学工業株式会社 充填材、樹脂組成物、パッケージ、発光装置及びそれらの製造方法
JP6435011B2 (ja) * 2017-04-26 2018-12-05 ローム株式会社 Ｌｅｄモジュール
JP6521017B2 (ja) * 2017-09-29 2019-05-29 日亜化学工業株式会社 発光装置
JP6760321B2 (ja) * 2018-03-20 2020-09-23 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP7082280B2 (ja) * 2018-03-30 2022-06-08 日亜化学工業株式会社 発光装置
DE102018132542A1 (de) * 2018-12-17 2020-06-18 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung und herstellungsverfahren
JP7227478B2 (ja) * 2019-03-20 2023-02-22 日亜化学工業株式会社 樹脂パッケージおよび発光装置
JP7277760B2 (ja) 2019-08-19 2023-05-19 日亜化学工業株式会社 発光装置及びその製造方法
KR102042271B1 (ko) * 2019-08-21 2019-11-07 엘지이노텍 주식회사 발광 소자 및 조명 시스템

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624380A (ja) * 1985-06-29 1987-01-10 Toshiba Corp 発光ダイオ−ド装置
JP2582096Y2 (ja) * 1992-09-16 1998-09-30 三洋電機株式会社 発光ダイオードランプ
DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
JP3802724B2 (ja) * 2000-01-31 2006-07-26 ローム株式会社 発光表示装置およびその製法
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
JP2002314139A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
KR100923804B1 (ko) * 2001-09-03 2009-10-27 파나소닉 주식회사 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법
JP2003101078A (ja) * 2001-09-25 2003-04-04 Toyoda Gosei Co Ltd 発光装置
JP2003324215A (ja) * 2002-04-30 2003-11-14 Toyoda Gosei Co Ltd 発光ダイオードランプ
DE10223988A1 (de) * 2002-05-29 2003-12-18 Siemens Ag Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP2003017755A (ja) * 2002-06-13 2003-01-17 Nichia Chem Ind Ltd 発光装置
TWI237546B (en) 2003-01-30 2005-08-01 Osram Opto Semiconductors Gmbh Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component
JP2006032885A (ja) * 2003-11-18 2006-02-02 Sharp Corp 光源装置およびそれを用いた光通信装置
JP2005197369A (ja) * 2004-01-05 2005-07-21 Toshiba Corp 光半導体装置
TWI223890B (en) * 2004-02-06 2004-11-11 Opto Tech Corp Light-emitting diode device with multi-lead pins
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
KR100665298B1 (ko) * 2004-06-10 2007-01-04 서울반도체 주식회사 발광장치
US20050280354A1 (en) * 2004-06-16 2005-12-22 Shin-Lung Liu Light emitting diode
JP4521227B2 (ja) * 2004-07-14 2010-08-11 株式会社東芝 窒素を含有する蛍光体の製造方法
JP2006319238A (ja) * 2005-05-16 2006-11-24 Koito Mfg Co Ltd 発光装置および車両用灯具
EP1890343A4 (en) * 2005-06-07 2014-04-23 Fujikura Ltd SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
KR100631992B1 (ko) * 2005-07-19 2006-10-09 삼성전기주식회사 측면 방출형 이중 렌즈 구조 ｌｅｄ 패키지

Also Published As

Publication number Publication date
JP2008041917A (ja) 2008-02-21
US7815343B2 (en) 2010-10-19
US20080037252A1 (en) 2008-02-14

Similar Documents

Publication Publication Date Title
JP5205724B2 (ja) 発光装置
JP3991961B2 (ja) 側面発光型発光装置
JP4269709B2 (ja) 発光装置およびその製造方法
US9660151B2 (en) Method for manufacturing light emitting device
JP4992250B2 (ja) 発光装置
EP2482346B1 (en) Light emitting device
US8476657B2 (en) Light-emitting device
CN107665940B (zh) 发光装置及其制造方法
JP5540466B2 (ja) 発光装置及びその製造方法
US20040256706A1 (en) Molded package and semiconductor device using molded package
JP3972889B2 (ja) 発光装置およびそれを用いた面状光源
JP5644352B2 (ja) 発光装置及びその製造方法
JP2017054894A (ja) 発光装置
US11450790B2 (en) Light emitting device
JP4059293B2 (ja) 発光装置
JP4611937B2 (ja) 表面実装型発光装置及びその製造方法
CN107408610A (zh) 发光器件
JP2011146480A (ja) 発光装置および発光装置の製造方法
JP2019212699A (ja) 発光装置
JP6354809B2 (ja) 発光装置の製造方法及び複合基板
JP5327356B2 (ja) 発光装置
JP2003037293A (ja) チップ部品型発光素子とその製造方法
JP2006269778A (ja) 光学装置
JP2020127026A (ja) 発光装置の製造方法及び発光装置
JP5515693B2 (ja) 発光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090715

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090715

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120313

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120514

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130122

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130204

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160301

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5205724

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250