JP5198709B2 - 粘性媒体を基板に塗布する方法、装置および使用 - Google Patents
粘性媒体を基板に塗布する方法、装置および使用 Download PDFInfo
- Publication number
- JP5198709B2 JP5198709B2 JP2002508879A JP2002508879A JP5198709B2 JP 5198709 B2 JP5198709 B2 JP 5198709B2 JP 2002508879 A JP2002508879 A JP 2002508879A JP 2002508879 A JP2002508879 A JP 2002508879A JP 5198709 B2 JP5198709 B2 JP 5198709B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- screen printing
- viscous medium
- additional
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ink Jet (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619-5 | 2000-07-11 | ||
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
PCT/SE2001/001567 WO2002005608A1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004502539A JP2004502539A (ja) | 2004-01-29 |
JP5198709B2 true JP5198709B2 (ja) | 2013-05-15 |
Family
ID=20280455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002508879A Expired - Lifetime JP5198709B2 (ja) | 2000-07-11 | 2001-07-06 | 粘性媒体を基板に塗布する方法、装置および使用 |
Country Status (8)
Country | Link |
---|---|
US (2) | US7757391B2 (de) |
EP (1) | EP1314342B1 (de) |
JP (1) | JP5198709B2 (de) |
AT (1) | ATE406085T1 (de) |
AU (1) | AU2001271170A1 (de) |
DE (1) | DE60135467D1 (de) |
SE (1) | SE518640C2 (de) |
WO (1) | WO2002005608A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE518642C2 (sv) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
JP4618085B2 (ja) * | 2005-09-30 | 2011-01-26 | 株式会社日立プラントテクノロジー | はんだペースト印刷システム |
EP1963042A1 (de) * | 2005-11-14 | 2008-09-03 | Mydata Automation AB | Strahlvorrichtung und verfahren zur verbesserung der leistung einer strahlvorrichtung durch verwendung eines strömungssensors zur messung des luftstroms |
JP4869776B2 (ja) * | 2006-04-28 | 2012-02-08 | ヤマハ発動機株式会社 | 印刷検査装置及び印刷装置 |
US7823762B2 (en) * | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
KR100807090B1 (ko) * | 2007-03-28 | 2008-02-26 | 에스엔유 프리시젼 주식회사 | 기판 지지장치와 이를 이용한 엘씨디 셀의 씰패턴 검사장치 |
DE102009053575B4 (de) * | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste |
US9398697B2 (en) | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
EP3032933B8 (de) * | 2013-08-07 | 2018-11-14 | FUJI Corporation | Elektronische bauteilbestückungseinrichtung und übertragungsbestätigungsverfahren |
JP6155468B2 (ja) * | 2013-12-06 | 2017-07-05 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
JP2015109397A (ja) * | 2013-12-06 | 2015-06-11 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
DE102014202170A1 (de) * | 2014-02-06 | 2015-08-20 | Ekra Automatisierungssysteme Gmbh | Vorrichtung und Verfahren zum Bedrucken von Substraten |
US11076490B2 (en) | 2014-09-09 | 2021-07-27 | Mycronic AB | Method and device for applying solder paste flux |
CN112040760B (zh) * | 2014-11-20 | 2022-04-01 | 株式会社高迎科技 | 检查装置及具有其的部件贴装系统 |
DE102016116201B4 (de) * | 2016-08-31 | 2018-06-21 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker |
US11544836B2 (en) * | 2021-03-18 | 2023-01-03 | Inventec (Pudong) Technology Corporation | Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof |
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GB1270926A (en) * | 1968-04-05 | 1972-04-19 | Johnson Matthey Co Ltd | Improvements in and relating to a method of making metal articles |
US3738760A (en) * | 1971-10-13 | 1973-06-12 | Plastic Kote Co | Paint touch-up container |
US3962487A (en) * | 1975-02-03 | 1976-06-08 | Texas Instruments Incorporated | Method of making ceramic semiconductor elements with ohmic contact surfaces |
US4239827A (en) * | 1979-01-15 | 1980-12-16 | Union Carbide Corporation | Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate |
FR2552345B1 (fr) * | 1983-09-27 | 1985-12-20 | Sames Sa | Appareillage de peinture electrostatique a pulverisateur pneumatique sur support mobile, reglable en fonctionnement |
JPH07109935B2 (ja) | 1989-01-27 | 1995-11-22 | オムロン株式会社 | 半田不良の自動修正方法およびその装置 |
SE465713B (sv) * | 1990-02-12 | 1991-10-21 | Mydata Automation Ab | Anordning foer att utlaegga pastor och lim |
JPH03297102A (ja) * | 1990-04-17 | 1991-12-27 | Cmk Corp | プリント配線板におけるカーボン抵抗体の形成方法 |
JPH04239797A (ja) | 1991-01-23 | 1992-08-27 | Sharp Corp | スクリーン印刷装置 |
US5097516A (en) * | 1991-02-28 | 1992-03-17 | At&T Bell Laboratories | Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging |
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
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JPH05183263A (ja) * | 1992-01-07 | 1993-07-23 | Matsushita Electric Ind Co Ltd | クリーム半田供給工法 |
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SE518642C2 (sv) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
-
2000
- 2000-07-11 SE SE0002619A patent/SE518640C2/sv unknown
-
2001
- 2001-07-06 DE DE60135467T patent/DE60135467D1/de not_active Expired - Lifetime
- 2001-07-06 EP EP01950142A patent/EP1314342B1/de not_active Expired - Lifetime
- 2001-07-06 WO PCT/SE2001/001567 patent/WO2002005608A1/en active Application Filing
- 2001-07-06 AT AT01950142T patent/ATE406085T1/de not_active IP Right Cessation
- 2001-07-06 AU AU2001271170A patent/AU2001271170A1/en not_active Abandoned
- 2001-07-06 JP JP2002508879A patent/JP5198709B2/ja not_active Expired - Lifetime
- 2001-07-11 US US09/901,592 patent/US7757391B2/en not_active Expired - Fee Related
-
2006
- 2006-08-11 US US11/502,477 patent/US7600548B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7600548B2 (en) | 2009-10-13 |
US20070137558A1 (en) | 2007-06-21 |
JP2004502539A (ja) | 2004-01-29 |
AU2001271170A1 (en) | 2002-01-21 |
SE518640C2 (sv) | 2002-11-05 |
SE0002619D0 (sv) | 2000-07-11 |
US7757391B2 (en) | 2010-07-20 |
SE0002619L (sv) | 2002-03-08 |
ATE406085T1 (de) | 2008-09-15 |
DE60135467D1 (de) | 2008-10-02 |
US20020015780A1 (en) | 2002-02-07 |
WO2002005608A1 (en) | 2002-01-17 |
EP1314342A1 (de) | 2003-05-28 |
EP1314342B1 (de) | 2008-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080625 |
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