SE0002619D0 - Method, apparatus and use - Google Patents

Method, apparatus and use

Info

Publication number
SE0002619D0
SE0002619D0 SE0002619A SE0002619A SE0002619D0 SE 0002619 D0 SE0002619 D0 SE 0002619D0 SE 0002619 A SE0002619 A SE 0002619A SE 0002619 A SE0002619 A SE 0002619A SE 0002619 D0 SE0002619 D0 SE 0002619D0
Authority
SE
Sweden
Prior art keywords
jetting
add
substrate
viscous medium
predetermined
Prior art date
Application number
SE0002619A
Other languages
English (en)
Other versions
SE0002619L (sv
SE518640C2 (sv
Inventor
William Holm
Nils Jacobsson
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0002619A priority Critical patent/SE518640C2/sv
Publication of SE0002619D0 publication Critical patent/SE0002619D0/sv
Priority to JP2002508879A priority patent/JP5198709B2/ja
Priority to DE60135467T priority patent/DE60135467D1/de
Priority to PCT/SE2001/001567 priority patent/WO2002005608A1/en
Priority to AU2001271170A priority patent/AU2001271170A1/en
Priority to EP01950142A priority patent/EP1314342B1/en
Priority to AT01950142T priority patent/ATE406085T1/de
Priority to US09/901,592 priority patent/US7757391B2/en
Publication of SE0002619L publication Critical patent/SE0002619L/sv
Publication of SE518640C2 publication Critical patent/SE518640C2/sv
Priority to US11/502,477 priority patent/US7600548B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ink Jet (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
SE0002619A 2000-07-11 2000-07-11 Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning SE518640C2 (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SE0002619A SE518640C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
AT01950142T ATE406085T1 (de) 2000-07-11 2001-07-06 Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat
AU2001271170A AU2001271170A1 (en) 2000-07-11 2001-07-06 Method, apparatus and use of applying viscous medium on a substrate
DE60135467T DE60135467D1 (de) 2000-07-11 2001-07-06 Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat
PCT/SE2001/001567 WO2002005608A1 (en) 2000-07-11 2001-07-06 Method, apparatus and use of applying viscous medium on a substrate
JP2002508879A JP5198709B2 (ja) 2000-07-11 2001-07-06 粘性媒体を基板に塗布する方法、装置および使用
EP01950142A EP1314342B1 (en) 2000-07-11 2001-07-06 Method, apparatus and use of applying viscous medium on a substrate
US09/901,592 US7757391B2 (en) 2000-07-11 2001-07-11 Method for applying viscous medium on a substrate
US11/502,477 US7600548B2 (en) 2000-07-11 2006-08-11 Method and apparatus for applying viscous medium onto a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0002619A SE518640C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning

Publications (3)

Publication Number Publication Date
SE0002619D0 true SE0002619D0 (sv) 2000-07-11
SE0002619L SE0002619L (sv) 2002-03-08
SE518640C2 SE518640C2 (sv) 2002-11-05

Family

ID=20280455

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0002619A SE518640C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning

Country Status (8)

Country Link
US (2) US7757391B2 (sv)
EP (1) EP1314342B1 (sv)
JP (1) JP5198709B2 (sv)
AT (1) ATE406085T1 (sv)
AU (1) AU2001271170A1 (sv)
DE (1) DE60135467D1 (sv)
SE (1) SE518640C2 (sv)
WO (1) WO2002005608A1 (sv)

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JP2015109397A (ja) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
JP6155468B2 (ja) * 2013-12-06 2017-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
KR20170092529A (ko) * 2014-09-09 2017-08-11 마이크로닉 아베 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스
CN112040760B (zh) * 2014-11-20 2022-04-01 株式会社高迎科技 检查装置及具有其的部件贴装系统
DE102016116201B4 (de) * 2016-08-31 2018-06-21 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker
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Also Published As

Publication number Publication date
SE0002619L (sv) 2002-03-08
JP2004502539A (ja) 2004-01-29
US7757391B2 (en) 2010-07-20
WO2002005608A1 (en) 2002-01-17
ATE406085T1 (de) 2008-09-15
AU2001271170A1 (en) 2002-01-21
SE518640C2 (sv) 2002-11-05
US20070137558A1 (en) 2007-06-21
DE60135467D1 (de) 2008-10-02
US7600548B2 (en) 2009-10-13
EP1314342B1 (en) 2008-08-20
JP5198709B2 (ja) 2013-05-15
US20020015780A1 (en) 2002-02-07
EP1314342A1 (en) 2003-05-28

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