DE60135467D1 - Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat - Google Patents

Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat

Info

Publication number
DE60135467D1
DE60135467D1 DE60135467T DE60135467T DE60135467D1 DE 60135467 D1 DE60135467 D1 DE 60135467D1 DE 60135467 T DE60135467 T DE 60135467T DE 60135467 T DE60135467 T DE 60135467T DE 60135467 D1 DE60135467 D1 DE 60135467D1
Authority
DE
Germany
Prior art keywords
substrate
jetting
add
medium
viscous medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60135467T
Other languages
English (en)
Inventor
William Holm
Nils Jacobsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mycronic Technologies AB
Original Assignee
MyData Automation AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MyData Automation AB filed Critical MyData Automation AB
Application granted granted Critical
Publication of DE60135467D1 publication Critical patent/DE60135467D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ink Jet (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)
DE60135467T 2000-07-11 2001-07-06 Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat Expired - Lifetime DE60135467D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0002619A SE518640C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
PCT/SE2001/001567 WO2002005608A1 (en) 2000-07-11 2001-07-06 Method, apparatus and use of applying viscous medium on a substrate

Publications (1)

Publication Number Publication Date
DE60135467D1 true DE60135467D1 (de) 2008-10-02

Family

ID=20280455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60135467T Expired - Lifetime DE60135467D1 (de) 2000-07-11 2001-07-06 Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat

Country Status (8)

Country Link
US (2) US7757391B2 (de)
EP (1) EP1314342B1 (de)
JP (1) JP5198709B2 (de)
AT (1) ATE406085T1 (de)
AU (1) AU2001271170A1 (de)
DE (1) DE60135467D1 (de)
SE (1) SE518640C2 (de)
WO (1) WO2002005608A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE518642C2 (sv) 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
JP4618085B2 (ja) * 2005-09-30 2011-01-26 株式会社日立プラントテクノロジー はんだペースト印刷システム
CN101356425B (zh) * 2005-11-14 2011-01-26 麦德塔自动化股份有限公司 喷射装置和改善喷射装置性能的方法
JP4869776B2 (ja) * 2006-04-28 2012-02-08 ヤマハ発動機株式会社 印刷検査装置及び印刷装置
US7823762B2 (en) * 2006-09-28 2010-11-02 Ibiden Co., Ltd. Manufacturing method and manufacturing apparatus of printed wiring board
KR100807090B1 (ko) * 2007-03-28 2008-02-26 에스엔유 프리시젼 주식회사 기판 지지장치와 이를 이용한 엘씨디 셀의 씰패턴 검사장치
DE102009053575B4 (de) * 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
US9398697B2 (en) 2013-03-13 2016-07-19 Mycronic AB Methods and devices for jetting viscous medium on workpiece
JP6359541B2 (ja) * 2013-08-07 2018-07-18 株式会社Ｆｕｊｉ 電子部品装着機、および転写確認方法
JP2015109397A (ja) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
JP6155468B2 (ja) * 2013-12-06 2017-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
JP2017535066A (ja) * 2014-09-09 2017-11-24 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ はんだペーストフラックスを塗布するための方法および装置
KR20160060590A (ko) * 2014-11-20 2016-05-30 주식회사 고영테크놀러지 검사 장치 및 이를 갖는 부품 실장 시스템
DE102016116201B4 (de) * 2016-08-31 2018-06-21 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker
US11544836B2 (en) * 2021-03-18 2023-01-03 Inventec (Pudong) Technology Corporation Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3580462A (en) 1967-12-14 1971-05-25 Louis Vanyi Soldering apparatus
GB1270926A (en) * 1968-04-05 1972-04-19 Johnson Matthey Co Ltd Improvements in and relating to a method of making metal articles
US3738760A (en) * 1971-10-13 1973-06-12 Plastic Kote Co Paint touch-up container
US3962487A (en) * 1975-02-03 1976-06-08 Texas Instruments Incorporated Method of making ceramic semiconductor elements with ohmic contact surfaces
US4239827A (en) * 1979-01-15 1980-12-16 Union Carbide Corporation Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate
FR2552345B1 (fr) * 1983-09-27 1985-12-20 Sames Sa Appareillage de peinture electrostatique a pulverisateur pneumatique sur support mobile, reglable en fonctionnement
JPH07109935B2 (ja) 1989-01-27 1995-11-22 オムロン株式会社 半田不良の自動修正方法およびその装置
SE465713B (sv) * 1990-02-12 1991-10-21 Mydata Automation Ab Anordning foer att utlaegga pastor och lim
JPH03297102A (ja) * 1990-04-17 1991-12-27 Cmk Corp プリント配線板におけるカーボン抵抗体の形成方法
JPH04239797A (ja) 1991-01-23 1992-08-27 Sharp Corp スクリーン印刷装置
US5097516A (en) * 1991-02-28 1992-03-17 At&T Bell Laboratories Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
US5108024A (en) 1991-06-03 1992-04-28 Motorola, Inc. Method of inspecting solder joints
US5159171A (en) * 1991-09-03 1992-10-27 Motorola, Inc. Method and apparatus for solder laser printing
US5320250A (en) 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
JPH05183263A (ja) * 1992-01-07 1993-07-23 Matsushita Electric Ind Co Ltd クリーム半田供給工法
JP3583462B2 (ja) * 1993-04-05 2004-11-04 フォード モーター カンパニー 電子成分のための微小はんだ付け装置および方法
JPH06334321A (ja) * 1993-05-20 1994-12-02 Mitsubishi Electric Corp クリームはんだの供給方法
JP3288128B2 (ja) 1993-05-21 2002-06-04 松下電器産業株式会社 印刷装置および印刷方法
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
DE69322775T2 (de) 1993-08-12 1999-07-22 Ibm Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls
JP3034438B2 (ja) * 1994-03-31 2000-04-17 キヤノン株式会社 カラーフィルタの製造装置
JP2982617B2 (ja) * 1994-06-27 1999-11-29 松下電器産業株式会社 クリーム半田の印刷量検査方法
JP3241251B2 (ja) 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
DE69629864T2 (de) * 1995-04-03 2004-07-15 Canon K.K. Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes
US6026176A (en) 1995-07-25 2000-02-15 Cognex Corporation Machine vision methods and articles of manufacture for ball grid array inspection
US6036944A (en) * 1995-08-08 2000-03-14 Enamelon, Inc. Processes for the remineralization and mineralization of teeth
US5639010A (en) * 1995-08-31 1997-06-17 Ford Motor Company Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
JP3310540B2 (ja) 1996-05-22 2002-08-05 松下電器産業株式会社 スクリーン印刷方法とその装置
JPH09326551A (ja) * 1996-06-04 1997-12-16 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体装置
US5912732A (en) * 1996-07-05 1999-06-15 Kabushiki Kaisha Topcon Surface detecting apparatus
JPH10128220A (ja) * 1996-10-28 1998-05-19 Suzuki Motor Corp 塗装欠陥除去装置
US5988480A (en) 1997-12-12 1999-11-23 Micron Technology, Inc. Continuous mode solder jet apparatus
JPH10282322A (ja) * 1997-04-02 1998-10-23 Toray Ind Inc 基板の部分欠陥修正方法およびその装置並びにカラーフィルターの製造方法および製造装置
JPH10297127A (ja) * 1997-04-28 1998-11-10 Mitsubishi Electric Corp 印刷パターンの欠陥修正用シート及び印刷パターンの欠陥修正装置及び印刷パターンの欠陥修正方法
US6033503A (en) 1997-05-05 2000-03-07 Steven K. Radowicz Adhesive sensing assembly for end jointed beam
US6100787A (en) * 1997-05-28 2000-08-08 Motorola, Inc. Multilayer ceramic package with low-variance embedded resistors
JP3332854B2 (ja) * 1997-06-17 2002-10-07 キヤノン株式会社 カラーフィルタの製造方法
EP0913857B1 (de) * 1997-10-30 2004-01-28 ESEC Trading SA Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
SE513527C2 (sv) 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
JP2000156215A (ja) * 1998-11-19 2000-06-06 Mitsubishi Plastics Ind Ltd シリコーン樹脂被覆金属複合体及びその製造方法
SE514859C2 (sv) 1999-01-18 2001-05-07 Mydata Automation Ab Förfarande och anordning för undersökning av objekt på ett substrat genom att ta bilder av substratet och analysera dessa
JP3403677B2 (ja) * 1999-09-06 2003-05-06 マイクロ・テック株式会社 半田ボール形成方法
US6271060B1 (en) * 1999-09-13 2001-08-07 Vishay Intertechnology, Inc. Process of fabricating a chip scale surface mount package for semiconductor device
US6541063B1 (en) 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
US6411545B1 (en) 1999-11-19 2002-06-25 John Millard And Pamela Ann Caywood 1989 Revokable Living Trust Non-volatile latch
US6613240B2 (en) * 1999-12-06 2003-09-02 Epion Corporation Method and apparatus for smoothing thin conductive films by gas cluster ion beam
JP3758463B2 (ja) * 2000-05-09 2006-03-22 松下電器産業株式会社 スクリーン印刷の検査方法
SE518642C2 (sv) 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Also Published As

Publication number Publication date
SE0002619L (sv) 2002-03-08
JP2004502539A (ja) 2004-01-29
US20020015780A1 (en) 2002-02-07
JP5198709B2 (ja) 2013-05-15
US7600548B2 (en) 2009-10-13
AU2001271170A1 (en) 2002-01-21
WO2002005608A1 (en) 2002-01-17
SE0002619D0 (sv) 2000-07-11
ATE406085T1 (de) 2008-09-15
US20070137558A1 (en) 2007-06-21
EP1314342A1 (de) 2003-05-28
EP1314342B1 (de) 2008-08-20
SE518640C2 (sv) 2002-11-05
US7757391B2 (en) 2010-07-20

Similar Documents

Publication Publication Date Title
DE60135467D1 (de) Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat
DE69523471T2 (de) Verfahren zum drucken auf ein einziges substrat in mehreren aufeinanderfolgenden durchgängen und hiernach bedrucktes substrat
DE69737375D1 (de) Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des Verfahrens
HK1044907A1 (zh) 在印刷機中用來分配材料的方法和器械
DE602005015557D1 (de) Verfahren und vorrichtung zum gleichzeitigen untersuchen und reinigen einer schablone
ATE346382T1 (de) Verfahren zur strukturierung einer auf einem trägermaterial aufgebrachten oxidschicht
TW430612B (en) Apparatus and method for embossing and printing elongated substrates
DE502007003587D1 (de) Verfahren und vorrichtug zum bedrucken von gegenständen, insbesondere von kunststoffteilen
ATE281939T1 (de) Verfahren und vorrichtung für tintenstrahldruck mit uv-strahlungshärtbarer tinte
ATE402024T1 (de) Vorrichtung zum personalizieren einer id karte mit web browser
TW200724384A (en) Printing apparatus for liquid crystal display device and pattern forming method using the same
MY140731A (en) Method and apparatus for creating an image on an article, and article resulting therefrom
DE60026919D1 (de) Vorrichtung und Verfahren zur Modulation der Tropfengrösse beim Tintenstrahldrucken
DE602004022816D1 (de) Palladium komplexe für den druck von leiterkarten
CA2404853A1 (en) Photoengraved printed data carrier
TW200518935A (en) System and method for printing an alignment film
DE60235906D1 (de) Erfahren
DE60134139D1 (de) Handgerät zum Auftragen eines Klebe- oder Beschichtungs- oder Farbbands vom Trägermaterial auf eine Oberfläche
YU37498A (sh) Postupak za nanošenje štampanog otiska na posudu, koji se može ukloniti, plastična posuda snabdevena sa štampanim otiskom i nošeni film za štampani otisak
DE50003731D1 (de) Verfahren und vorrichtung zum aufbringen kleiner flüssigkeitsmengen
ATE243621T1 (de) Verfahren und vorrichtung zum aufbringen eines mediums auf ein substrat, system mit mehreren dieser vorrichtungenund anwendung dieser vorrichtung, verfahren und system
NZ299184A (en) Support material, for a painting, comprises masking material applied to a substrate by a printing process and defining non-masked regions
ATE332340T1 (de) Verfahren zum drucken eines substrates und so erhaltener artikel
AU7759498A (en) Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards
ATE552733T1 (de) Tintenstrahldrucksystem

Legal Events

Date Code Title Description
8364 No opposition during term of opposition