AU2001271170A1 - Method, apparatus and use of applying viscous medium on a substrate - Google Patents
Method, apparatus and use of applying viscous medium on a substrateInfo
- Publication number
- AU2001271170A1 AU2001271170A1 AU2001271170A AU7117001A AU2001271170A1 AU 2001271170 A1 AU2001271170 A1 AU 2001271170A1 AU 2001271170 A AU2001271170 A AU 2001271170A AU 7117001 A AU7117001 A AU 7117001A AU 2001271170 A1 AU2001271170 A1 AU 2001271170A1
- Authority
- AU
- Australia
- Prior art keywords
- substrate
- viscous medium
- jetting
- add
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ink Jet (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Coating Apparatus (AREA)
Abstract
A method of applying viscous medium on a substrate that is arranged for mounting of components includes providing the substrate arranged for mounting of electronic components thereon and screen printing predetermined amounts of a viscous medium on predetermined positions on the substrate. In addition, the method includes add-on jetting of predetermined additional amounts of viscous medium on predetermined positions on the screen printed substrate. The add-on jetting is non-contact dispensing and the add-on jetting viscous medium is still in viscous form during the add-on jetting.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619 | 2000-07-11 | ||
SE0002619A SE518640C2 (en) | 2000-07-11 | 2000-07-11 | Method, apparatus for applying a viscous medium to a substrate, apparatus for applying additional viscous medium and the use of screen printing |
PCT/SE2001/001567 WO2002005608A1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001271170A1 true AU2001271170A1 (en) | 2002-01-21 |
Family
ID=20280455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001271170A Abandoned AU2001271170A1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
Country Status (8)
Country | Link |
---|---|
US (2) | US7757391B2 (en) |
EP (1) | EP1314342B1 (en) |
JP (1) | JP5198709B2 (en) |
AT (1) | ATE406085T1 (en) |
AU (1) | AU2001271170A1 (en) |
DE (1) | DE60135467D1 (en) |
SE (1) | SE518640C2 (en) |
WO (1) | WO2002005608A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE518642C2 (en) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Method, device for providing a substrate with viscous medium, device for correcting application errors and the use of projecting means for correcting application errors |
JP4618085B2 (en) * | 2005-09-30 | 2011-01-26 | 株式会社日立プラントテクノロジー | Solder paste printing system |
CN101356425B (en) * | 2005-11-14 | 2011-01-26 | 麦德塔自动化股份有限公司 | A jetting apparatus and method of improving the performance of a jetting apparatus |
JP4869776B2 (en) * | 2006-04-28 | 2012-02-08 | ヤマハ発動機株式会社 | Printing inspection apparatus and printing apparatus |
US7823762B2 (en) * | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
KR100807090B1 (en) * | 2007-03-28 | 2008-02-26 | 에스엔유 프리시젼 주식회사 | A device for supporting substrate and examiner for seal pattern of lcd cell using the same |
DE102009053575B4 (en) * | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Method and device for printing a substrate, in particular a printed circuit board, with a printing paste |
US9398697B2 (en) | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
JP6359541B2 (en) * | 2013-08-07 | 2018-07-18 | 株式会社Fuji | Electronic component mounting machine and transfer confirmation method |
JP2015109397A (en) * | 2013-12-06 | 2015-06-11 | パナソニックIpマネジメント株式会社 | Electronic component mounting method and electronic component mounting system |
JP6155468B2 (en) * | 2013-12-06 | 2017-07-05 | パナソニックIpマネジメント株式会社 | Electronic component mounting method and electronic component mounting system |
DE102014202170A1 (en) * | 2014-02-06 | 2015-08-20 | Ekra Automatisierungssysteme Gmbh | Apparatus and method for printing on substrates |
JP2017535066A (en) * | 2014-09-09 | 2017-11-24 | マイクロニック アーベーMycronic Ab | Method and apparatus for applying solder paste flux |
KR20160060590A (en) * | 2014-11-20 | 2016-05-30 | 주식회사 고영테크놀러지 | Inspection apparatus and component mounting system having the same |
DE102016116201B4 (en) * | 2016-08-31 | 2018-06-21 | Asm Assembly Systems Gmbh & Co. Kg | A method of applying paste material to a substrate and supplementing application of paste material to a paste deposit of the substrate, controller, computer program product and screen printer |
US11544836B2 (en) * | 2021-03-18 | 2023-01-03 | Inventec (Pudong) Technology Corporation | Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3580462A (en) | 1967-12-14 | 1971-05-25 | Louis Vanyi | Soldering apparatus |
GB1270926A (en) * | 1968-04-05 | 1972-04-19 | Johnson Matthey Co Ltd | Improvements in and relating to a method of making metal articles |
US3738760A (en) * | 1971-10-13 | 1973-06-12 | Plastic Kote Co | Paint touch-up container |
US3962487A (en) * | 1975-02-03 | 1976-06-08 | Texas Instruments Incorporated | Method of making ceramic semiconductor elements with ohmic contact surfaces |
US4239827A (en) * | 1979-01-15 | 1980-12-16 | Union Carbide Corporation | Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate |
FR2552345B1 (en) * | 1983-09-27 | 1985-12-20 | Sames Sa | ELECTROSTATIC PAINT APPARATUS WITH PNEUMATIC SPRAYER ON MOBILE SUPPORT, ADJUSTABLE IN OPERATION |
JPH07109935B2 (en) | 1989-01-27 | 1995-11-22 | オムロン株式会社 | Method and apparatus for automatically correcting solder defects |
SE465713B (en) * | 1990-02-12 | 1991-10-21 | Mydata Automation Ab | DEVICE FOR PREPARING PASTORS AND LIMS |
JPH03297102A (en) * | 1990-04-17 | 1991-12-27 | Cmk Corp | Formation of carbon resistor in printed wiring board |
JPH04239797A (en) | 1991-01-23 | 1992-08-27 | Sharp Corp | Screen printing device |
US5097516A (en) * | 1991-02-28 | 1992-03-17 | At&T Bell Laboratories | Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging |
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
US5108024A (en) | 1991-06-03 | 1992-04-28 | Motorola, Inc. | Method of inspecting solder joints |
US5159171A (en) * | 1991-09-03 | 1992-10-27 | Motorola, Inc. | Method and apparatus for solder laser printing |
US5320250A (en) | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
JPH05183263A (en) * | 1992-01-07 | 1993-07-23 | Matsushita Electric Ind Co Ltd | Cream solder supplying method |
JP3583462B2 (en) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | Micro soldering apparatus and method for electronic components |
JPH06334321A (en) * | 1993-05-20 | 1994-12-02 | Mitsubishi Electric Corp | Supplying method for cream solder |
JP3288128B2 (en) | 1993-05-21 | 2002-06-04 | 松下電器産業株式会社 | Printing apparatus and printing method |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
DE69322775T2 (en) | 1993-08-12 | 1999-07-22 | Ibm | Inspection procedure for connecting ball set of an integrated circuit module |
JP3034438B2 (en) * | 1994-03-31 | 2000-04-17 | キヤノン株式会社 | Color filter manufacturing equipment |
JP2982617B2 (en) * | 1994-06-27 | 1999-11-29 | 松下電器産業株式会社 | Inspection method of print amount of cream solder |
JP3241251B2 (en) | 1994-12-16 | 2001-12-25 | キヤノン株式会社 | Method of manufacturing electron-emitting device and method of manufacturing electron source substrate |
DE69629864T2 (en) * | 1995-04-03 | 2004-07-15 | Canon K.K. | Method of manufacturing an electron emitting device, an electron source and an image forming apparatus |
US6026176A (en) | 1995-07-25 | 2000-02-15 | Cognex Corporation | Machine vision methods and articles of manufacture for ball grid array inspection |
US6036944A (en) * | 1995-08-08 | 2000-03-14 | Enamelon, Inc. | Processes for the remineralization and mineralization of teeth |
US5639010A (en) * | 1995-08-31 | 1997-06-17 | Ford Motor Company | Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices |
US5839188A (en) * | 1996-01-05 | 1998-11-24 | Alliedsignal Inc. | Method of manufacturing a printed circuit assembly |
JP3310540B2 (en) | 1996-05-22 | 2002-08-05 | 松下電器産業株式会社 | Screen printing method and device |
JPH09326551A (en) * | 1996-06-04 | 1997-12-16 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
US5912732A (en) * | 1996-07-05 | 1999-06-15 | Kabushiki Kaisha Topcon | Surface detecting apparatus |
JPH10128220A (en) * | 1996-10-28 | 1998-05-19 | Suzuki Motor Corp | Coating defect removing device |
US5988480A (en) | 1997-12-12 | 1999-11-23 | Micron Technology, Inc. | Continuous mode solder jet apparatus |
JPH10282322A (en) * | 1997-04-02 | 1998-10-23 | Toray Ind Inc | Correcting method and device for partial defect of substrate as well as manufacture of color filter and device thereof |
JPH10297127A (en) * | 1997-04-28 | 1998-11-10 | Mitsubishi Electric Corp | Sheet for correcting defect of printed pattern, defect correcting device of printed pattern, and defect correcting method therefor |
US6033503A (en) | 1997-05-05 | 2000-03-07 | Steven K. Radowicz | Adhesive sensing assembly for end jointed beam |
US6100787A (en) * | 1997-05-28 | 2000-08-08 | Motorola, Inc. | Multilayer ceramic package with low-variance embedded resistors |
JP3332854B2 (en) * | 1997-06-17 | 2002-10-07 | キヤノン株式会社 | Manufacturing method of color filter |
EP0913857B1 (en) * | 1997-10-30 | 2004-01-28 | ESEC Trading SA | Method and device for positioning the bonding head of a machine for the bonding of semiconductor chips as a carrier material |
US5947022A (en) * | 1997-11-07 | 1999-09-07 | Speedline Technologies, Inc. | Apparatus for dispensing material in a printer |
SE513527C2 (en) | 1998-06-11 | 2000-09-25 | Mydata Automation Ab | Device and method for ejecting small droplets |
JP2000156215A (en) * | 1998-11-19 | 2000-06-06 | Mitsubishi Plastics Ind Ltd | Silicone resin-coated metal composite and manufacture thereof |
SE514859C2 (en) | 1999-01-18 | 2001-05-07 | Mydata Automation Ab | Method and apparatus for examining objects on a substrate by taking pictures of the substrate and analyzing them |
JP3403677B2 (en) * | 1999-09-06 | 2003-05-06 | マイクロ・テック株式会社 | Solder ball forming method |
US6271060B1 (en) * | 1999-09-13 | 2001-08-07 | Vishay Intertechnology, Inc. | Process of fabricating a chip scale surface mount package for semiconductor device |
US6541063B1 (en) | 1999-11-04 | 2003-04-01 | Speedline Technologies, Inc. | Calibration of a dispensing system |
US6411545B1 (en) | 1999-11-19 | 2002-06-25 | John Millard And Pamela Ann Caywood 1989 Revokable Living Trust | Non-volatile latch |
US6613240B2 (en) * | 1999-12-06 | 2003-09-02 | Epion Corporation | Method and apparatus for smoothing thin conductive films by gas cluster ion beam |
JP3758463B2 (en) * | 2000-05-09 | 2006-03-22 | 松下電器産業株式会社 | Screen printing inspection method |
SE518642C2 (en) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Method, device for providing a substrate with viscous medium, device for correcting application errors and the use of projecting means for correcting application errors |
-
2000
- 2000-07-11 SE SE0002619A patent/SE518640C2/en unknown
-
2001
- 2001-07-06 AU AU2001271170A patent/AU2001271170A1/en not_active Abandoned
- 2001-07-06 JP JP2002508879A patent/JP5198709B2/en not_active Expired - Lifetime
- 2001-07-06 DE DE60135467T patent/DE60135467D1/en not_active Expired - Lifetime
- 2001-07-06 EP EP01950142A patent/EP1314342B1/en not_active Expired - Lifetime
- 2001-07-06 AT AT01950142T patent/ATE406085T1/en not_active IP Right Cessation
- 2001-07-06 WO PCT/SE2001/001567 patent/WO2002005608A1/en active Application Filing
- 2001-07-11 US US09/901,592 patent/US7757391B2/en not_active Expired - Fee Related
-
2006
- 2006-08-11 US US11/502,477 patent/US7600548B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE0002619L (en) | 2002-03-08 |
JP2004502539A (en) | 2004-01-29 |
US20020015780A1 (en) | 2002-02-07 |
JP5198709B2 (en) | 2013-05-15 |
US7600548B2 (en) | 2009-10-13 |
DE60135467D1 (en) | 2008-10-02 |
WO2002005608A1 (en) | 2002-01-17 |
SE0002619D0 (en) | 2000-07-11 |
ATE406085T1 (en) | 2008-09-15 |
US20070137558A1 (en) | 2007-06-21 |
EP1314342A1 (en) | 2003-05-28 |
EP1314342B1 (en) | 2008-08-20 |
SE518640C2 (en) | 2002-11-05 |
US7757391B2 (en) | 2010-07-20 |
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