JP4618085B2 - Solder paste printing system - Google Patents

Description

  The present invention relates to a screen printing apparatus, and more particularly to a solder paste printing system.

  As a conventional screen printing machine, there is one shown in Patent Document 1. This screen printing machine includes a substrate carry-in conveyor, a substrate carry-out conveyor, a stage portion provided with a lift mechanism, a mask having a transfer pattern as an opening, a squeegee, a squeegee lift mechanism and a squeegee head provided with a horizontal movement mechanism, and these mechanisms After the substrate is placed on the stage and placed on the stage, the stage is raised to bring the substrate close to the mask, and the mask is opened while the mask is in contact with the substrate by the squeegee. The part is filled with paste such as cream solder, the stage is further lowered, the paste is transferred onto the substrate by separating the substrate and the mask, and then the substrate is taken out of the apparatus for printing.

  Patent Document 2 proposes a method of measuring the thickness from the amount of extension of the extension member by contacting the extension member with a printed matter on the printing table in order to measure the thickness of the substrate.

Japanese Patent Laid-Open No. 5-200975 JP 2004-338248 A

  In the above prior art, it is handled that the printing result can be printed accurately by controlling the amount of solder paste. However, the conventional soldering process using screen printing has been done with the degree of wear depending on the number of times the squeegee and metal mask are used, the state of the solder paste to be supplied, the viscosity, the supply amount, the change in the supply position, and the metal mask cleaning status Printing defects may occur due to changes in temperature, humidity during printing, positional displacement due to differences in manufacturing accuracy between the printed circuit board and the metal mask, warping or twisting of the printed circuit board, and the like.

  For this reason, after solder paste printing, there is an increasing need to use an apparatus for inspecting solder appearance for the purpose of observing the appearance of solder printing and eliminating defective products. In particular, in recent years, many electronic parts called CSP and BGA have been adopted, and these electronic parts cannot be inspected by a soldering appearance inspection device because the terminal part is behind the part after the parts are mounted. In addition, it is necessary to inspect the appearance of solder printing immediately after printing the solder paste.

  In addition, even if it is OK to observe the appearance of the solder print after printing the solder paste, when the electronic component is mounted, the electronic component is lifted due to a mismatch in the amount of solder and mounting pressure, or due to a difference in accuracy between the solder printing position and the mounting position. Since there are defects, such as solder ball generation, it is also necessary to inspect the appearance after soldering. As a result, it is necessary to go back to the previous process, change the printing conditions, or remove the defective solder paste, and take time to set it up. In addition, there is a problem that a situation where production efficiency and yield are poor continues for a long time.

  Therefore, the present invention monitors the state of the cause of deterioration of the yield caused by the solder paste printing process before printing the solder paste for the defect caused by the solder paste printing process, and the production due to the influence of the occurrence of the defect, etc. The object is to provide a solder paste printing system that predicts and detects quality, issues quality forecasts and warnings, and removes and processes the cause of defects at an early stage to improve production efficiency and yield.

To achieve the above object, the present invention, the printing unit for applying solder paste through a mask on the substrate surface, and stores a processing method for the element and each element due to failure as a new knowledge accumulated a storage means for storing Te, before the solder paste printing, monitoring means for monitoring and checking the state of the element due to failure, predicted to determine whether each element there is a risk of generating defective And analyzing means for issuing a quality forecast or warning to the operator based on the analysis result and removing the cause of failure.

Furthermore, and printed solder visual inspection means into the solder paste printing system, comprising a soldering visual inspection means, and feeding back the inspection information to the printing unit, by using held as new knowledge, corresponding to the new products and parts In order to provide optimal solder paste printing, the communication means that communicates the information of the results of inspection by the inspection means to the printing device, and the information of the results of inspection by the inspection means are analyzed, and new defect cases are newly acquired. further comprising a re-analysis means for performing additional memory from time to time organized storage means and wherein a.
Further, in the solder paste printing system, a plurality of dispenser units for partially applying the solder paste and a soldering failure portion are provided on the downstream side of the printing apparatus so that the defective portion can be automatically repaired from the inspection result. A feature is that a plurality of rework units to be corrected are arranged.

  Before printing is performed, the cause of printing failure is monitored, a failure prediction is issued, and the cause of failure is eliminated to improve the printing yield. In addition, by accumulating and analyzing inspection information after printing, accumulating new defect information data, it is possible to improve the accuracy of defect prediction and expand the range of detection failure modes, and correct defects. When possible, the defect is automatically corrected to improve the printing yield.

  FIG. 1 shows the arrangement of each device of the solder paste printing system of the present invention.

  As a representative example of the printing system of the present invention, in addition to the screen printing unit 20, an inspection unit 30 for inspecting a result printed by a screen printing unit (hereinafter referred to as a printing unit) 20, and in some cases, an inspection unit 30. Is provided with a plurality of dispenser units 40 for repairing when a defective and repairable printing state is detected.

  Conventionally, when solder paste is applied, cream solder to be applied in the printing unit is supplied to the mask and preparation is completed.After teaching the recognition mark position, automatic operation is started, and after solder paste printing, it is sent to the downstream device. The substrate was being transported. On the other hand, as in the present invention, the storage means for storing / accumulating / storing the elements caused by the occurrence of defects and the processing method for each element as new knowledge, and the occurrence of defects before performing solder paste printing A monitoring means that grasps and inspects the status of the elements to be analyzed, an analysis means that determines whether or not each element may cause a defect, and a quality forecast / alarm to the operator based on the result of the analysis. By providing the processing means for removing the factor, it is possible to automatically predict the production quality and repair it before printing, thereby maintaining the production quality and preventing the failure from flowing downstream. Further, by combining the printing unit 20 and the inspection unit 30, new defect information data can be accumulated.

  There are the following representative items as factors resulting from printing defects. (1) Wear condition of squeegee and mask, (2) Mask damage, insufficient tension, clogging of opening, (3) Solder condition (supply amount, supply height, supply position, supply width, presence of air) (4) Solder state (viscosity, tackiness, temperature, degree of drying), (5) Environment temperature and humidity in the printing unit, and (6) Dimensional variation, warpage, and twist of the production board.

  As the processing method for each element, there are the following representative methods. (1) Replacing the squeegee / mask with a new one, (2) Replacing the mask with a new one or cleaning the clogged portion, (3) and (4) Supplying new solder or rolling operation after collecting old solder, (5 ) Temperature / humidity control, (6) Sorting / discharging defective substrates.

  The wear condition of the squeegee mask of (1) conventionally depends on visual confirmation of the actual product by a skilled person, or after supplying solder paste to the printing unit 20 and performing several trial printings, there is a problem with the printing result. Production was started after confirming that there was no visual inspection or another inspection method.

  In the method of the present invention, for the squeegee mask and substrate type used in the production, the number of times of use is counted by the monitoring means such as a printed sheet counter, and the occurrence of defects is detected as past defect rate occurrence statistical information. Information on the number of times of use at the time is input and stored in the storage means, and based on the stored information, the analysis means compares and analyzes the past number of defects and the current number of uses, and the estimated failure rate information is used as a quality forecast. By displaying on the monitor of the printing unit, the operator can easily determine whether production can be started without any problems.

  As an example of product type management such as applied squeegee and mask material, the squeegee, mask and identification information (three-dimensional bar code etc.) marked on the production substrate are automatically read by an information reader provided in the printing unit or It can be easily managed by manual input.

  The use limit of the squeegee and the mask is conventionally controlled by the number of printed shots produced or the period of use. For example, the squeegee material / hardness and mask are determined based on the identification information for the number of shots and the period of use. Using the analysis method in the printing unit as a related coefficient, such as the material density, board thickness, and the mounting density information such as the narrowly adjacent mounting status of the production application board, create a failure rate prediction diagram, By comparison, it is possible to display estimated defect rate information as a quality forecast at the present time.

  In addition, the target failure rate for the production board type set and input in advance by the administrator function is compared with the current situation against the failure occurrence rate prediction diagram. By displaying a squeegee replacement recommendation mark as a quality forecast on the monitor, the operator can start production after exchanging the applicable squeegee or mask with a new product without performing trial printing or confirming production.

  Next, with regard to (2) mask damage and clogging of the opening, it is possible to perform OK / NG determination by recognizing the shape of each print pattern using a recognition camera provided in the printing unit. Further, it is possible to determine whether the tension is OK or NG by pressing a predetermined position of the mask with a tension measuring rod provided in the print head with a predetermined thrust and measuring the reaction force generated at this time with a load cell. The methods devised in this document are not only simple OK / NG determination, but the monitoring means by the recognition camera measures the actual area of the opening and the actual reaction force of the tension, and the information is accumulated by the accumulating means. By comparing the statistical data with the production result information of the SMT line, a failure occurrence prediction diagram is created by the analysis unit of the printing unit, and the quality forecast is displayed. In any case, measurement can be performed before the start of production to estimate the occurrence of printing defects at the present time, and display the quality forecast on the monitor of the printing unit, thereby contributing to prevention of the occurrence of defects. When clogging of the mask opening is detected, an arbitrary clogging portion on the mask can be automatically cleaned by a plate cleaning device as a processing means.

  Also, in (3), is the supplied solder paste an amount that can be applied without any problem? Is there a problem with the position of the supplied solder paste? Etc. have been regularly visually monitored by an operator. On the other hand, according to the method described in Patent Document 1, a printing machine has been devised in which an alarm is issued and the paste can be replenished without the need to monitor the paste amount. However, is air mixed in the supplied solder paste? Without confirmation, it is practically difficult to prevent poor printing.

  Therefore, a large opening is arranged in the vicinity of the printing stroke end of the mask, and the printing unit 20 is provided with a mask on which a transparent material is attached so that the solder does not fall on this portion and the solder state can be monitored from the lower part. Using the recognition camera, the state of solder (supply amount, supply position, supply width, presence / absence of air contamination) before the start of production is monitored by monitoring the supply state of solder onto the mask through the transparent material from the bottom. It becomes possible to monitor and confirm. Of course, even during automatic operation, monitoring and confirmation can be automated in the same manner at intervals set in advance by printing conditions.

  After confirming the solder state by the monitoring means by the recognition camera, based on the database information of the storage means, the analysis means is used to analyze the cause of failure due to the solder state (supply amount / supply position / supply width). As an example, if the solder supply width dimension does not match the squeegee dimension and the board dimension, a quality forecast is displayed. Furthermore, by installing a solder paste supply syringe as a processing means in the printing unit, an appropriate amount of solder paste can be replenished to a portion where the solder paste is insufficient.

  Furthermore, when it is detected by the monitoring means that bubbles are present inside the solder, a quality forecast is displayed, and as a processing means, a reciprocating squeegee operation is automatically performed using a dummy substrate, so that the bubbles are removed by rolling the solder paste. Can be erased.

  Furthermore, in (4), is there any problem in the viscosity of the supplied solder paste? Has the tacking property of the supplied solder paste been degraded? Is it difficult for even a skilled operator to find a problem, and is there a problem with the temperature of the supplied solder paste? The usual method was to manage the time of leaving the solder paste taken out of the refrigerator. Viscosity and tackiness cannot be directly measured without contact, but viscosity and tackiness are correlated with temperature and degree of drying, and correlation value information is accumulated in the storage means, and temperature and drying as a solder state. As a monitoring means to detect and monitor the degree, the infrared thermography is placed and used in the printing unit, the temperature variation of the surface condition of the supplied solder paste is measured, and the part that dries in pieces and causes printing defects It is possible to constantly monitor whether there is any contact without contact.

  When the deterioration state of the solder is detected by the infrared thermography monitoring means, the quality prediction is displayed by the analysis means, and the yield can be improved by replacing the deteriorated solder before printing failure occurs.

  Further, (5) Regarding the cause of failure due to environmental temperature / humidity change in the printing unit, is there a sudden temperature / humidity change by monitoring means using one or more temperature / humidity sensors arranged inside the printing unit? Is the temperature distribution inside the printing unit uneven? Monitoring is performed constantly, and based on the information stored in the storage means, if the analysis means determines that there is an abnormality, a quality forecast is displayed. Further, the temperature and humidity can be automatically adjusted by providing the printing unit with a temperature and humidity control device so that the temperature and humidity control is automatically performed as the processing means. As another example of the monitoring means, the temperature distribution of the entire surface of the metal mask may be collectively measured by infrared thermography, and the actual data may be stored and used in the storage means.

  Furthermore, (6) the cause of defects due to dimensional variation, warpage, and twisting of the production substrate is determined as NG if the distance between the marks varies more than a predetermined value with respect to the reference dimension when the recognition mark is recognized. A defective board can be determined. Further, warp and twist can be detected by measuring and comparing two or more locations such as a substrate edge portion by applying the method proposed in Patent Document 2.

  When an abnormality is detected by the monitoring means, a quality forecast is displayed by the analysis means, a defective substrate stocker is provided as a processing means, and defective substrates are discharged from the printing unit and managed by sorting them to the production line. It becomes possible not to.

  As described above, the typical failure of (1) to (6) is monitored and detected constantly by the monitoring means by the sensor capable of detecting the elements for the typical printing failure of (1) to (6), and the representative failure of (1) to (6) by the analysis means. After collating and analyzing the database storage means and information on factors and countermeasures, issuing a quality forecast / alarm and judging that it will be defective, the processing means will take care of the defect such as insufficient printing in advance. It is possible to prevent and improve the yield.

  Further, after printing by the printing unit 20, the printing state is inspected by the inspection unit 30, the presence or absence of a defective portion is inspected, and if there is a defective portion, the defect information is sent to the printing unit by communication means not shown. To the repair dispenser unit 40 and repair the defective portion, thereby improving the yield of the printing system. That is, as one of the repair dispensers, in the printing unit, a portion of cream solder to which cream solder has been applied is provided, and at least one of the plurality of dispenser units is provided with a suction citation dispenser. Therefore, there is a configuration that repairs by absorbing excess cream solder. In addition, at least one dispensing unit is provided with a dispenser that supplies the same kind of cream solder as that used for printing only in places where printing solder has not been sufficiently supplied in the printing unit and printing defects have occurred. Then, there is a configuration in which cream solder is additionally applied to the chipped portion.

  As a combination of the above units, as shown in FIG. 1 (a), the printing unit 20 and the inspection unit 30 are integrated to measure the substrate manufacturing dimensional accuracy before starting printing. If a defect is predicted, an alarm is immediately issued to reject the defective product, which can be discharged to a defective product inspection stocker, although not shown. Furthermore, since the state immediately after printing can be immediately observed and inspected by the inspection unit, a more accurate inspection can be performed at a stage where the surface state of the solder paste does not change due to temperature, wind, or the like.

  As shown in FIG. 1B, the printing unit 20 and the inspection unit 30 are integrated, and one or a plurality of dispenser units 40 are connected to the downstream side of the inspection unit 30, thereby preventing printing defects and the like. Can be applied, and different types of cream solder can be applied to reduce the printing cost. In addition, by providing a plurality of dispenser units, it is possible to shorten the tact time by performing only the application of the application range that the dispenser unit has in the same time with different dispenser units. Furthermore, printing that can be performed only on the substrate surface can be applied to the inner surface and bottom surface of the substrate recess. Further, by adopting this configuration, at least one of the plurality of dispenser units 40 is provided with a dispenser for applying an adhesive, so that a printed circuit board in which large parts and chip parts are mixed can be used. It is possible to improve the degree of design freedom in manufacturing. That is, in the past, the component mounting surface is integrated and designed on one side, etc., after the cream solder is printed by the printing unit 20, the adhesive is applied by the dispenser unit 40 and the chip Parts can be retrofitted. That is, dissimilar materials such as a conductive adhesive can be applied even in a narrow area using a dispenser. For this reason, there has been a restriction on circuit design because the mounting area has to be divided according to the conventional chip component surface, large component surface, and production process. However, by combining the printing unit 20 and the dispenser unit 40 as in this system and applying the adhesive with one of the dispenser units, the degree of freedom in design is improved and higher-density mounting becomes possible. It was. Although not shown, it is also possible to arrange a plurality of dispenser units 40 without providing the printing unit 20 and arrange the inspection unit 30 downstream thereof. However, this configuration requires more printing time than the configuration using the printing unit 20, but the problem can be solved by installing a plurality of units and dividing the process. Furthermore, in each of the above-described configurations, by replacing at least one of the plurality of dispenser units 40 with a dispenser for application, by providing a dispenser for suction that removes the cream solder applied on the substrate by suction, Repairing defective substrates on the spot can greatly improve printing yield.

  Further, as shown in FIG. 1C, the printing unit 20, the inspection unit 30 and one or a plurality of dispenser units 40 on the downstream side thereof, the downstream side of the mounting machine 50 and the reflow soldering device 60 on the downstream side. By configuring the inspection unit 30 and the rework unit 70 after soldering to each other, it becomes possible to collect defect factor information resulting from printing on a product for which all the surface mounting processes have been completed. In addition, when rework is possible based on the information of the inspection unit 30 that inspects the soldering appearance, the rework unit 70 can perform spot soldering or the like on a soldering failure site.

  Next, the configuration and operation of each unit will be described.

FIG. 2 shows a cross-sectional configuration of the printing unit, and FIG. 3 shows a top view.
2 or 3, the upper part of the main frame 1 of the printing unit is guided by a pair of guide rails 2, and is skiable so as to be movable in the front-rear direction (perpendicular to the board loading / unloading direction) in the figure. A dihead 3 is provided. The squeegee head 3 drives the motor 22 shown in FIG. 3 and is moved in the front-rear direction of the drawing by a ball screw 4 coupled to the motor shaft. In addition to the squeegee head 3, as shown in FIG. 3, a frame 21 provided with a camera 16 for observing alignment marks provided on both the substrate and the mask is provided.

  A squeegee 5 is mounted on the squeegee head 3. The squeegee 5 can be moved up and down by a squeegee lifting cylinder 6. A plate frame receiver 7 is provided on the main body frame 1, and a plate frame 9 with a screen (mask) 8 having a printing pattern as an opening is set on the plate frame receiver 7. A printing table 10 is provided below the screen mask 8 to place and hold a substrate 15 that is a printing target so as to face the mask. The printing table 10 includes an XYθ table 11 that moves the substrate in the horizontal direction and aligns the substrate with the mask, and a table lifting mechanism that receives the substrate from the conveyor 12 and brings the substrate close to or in contact with the mask surface. (Not shown in particular). A substrate receiving conveyor 12 is provided on the upper surface of the printing table 10. The substrate 15 carried by the substrate carrying conveyor 13 is received on the printing table 10, and when the printing is completed, the substrate 15 is discharged to the substrate carrying conveyor 14.

  The fully automatic screen printing unit has a function of automatically aligning the mask 8 and the substrate 15. That is, the CCD camera 16 images the alignment marks provided on each of the mask 8 and the substrate 15, and performs image processing to obtain a positional deviation amount, and the XYθ table 11 is corrected so as to correct the deviation amount. It is driven and aligned.

  Although not shown, a control device for controlling each drive device, CCD camera, and the like is provided at the bottom of the main body table. Input means for making changes and the like, and a display device for monitoring the printing status and the like are provided.

  Next, the operation of the printing unit of the present invention will be described with reference to FIGS.

  The substrate 15 on which the cream solder is printed is supplied to the substrate receiving conveyor 12 by the substrate carry-in conveyor 13 and fixed at a predetermined position on the printing table 10. Subsequently, the CCD camera 16 takes an image of a position recognition mark (not shown) provided on the substrate 15 and the mask 8 and transfers it to a control unit (not shown). An image processing unit (not shown) in the control unit obtains the amount of positional deviation between the mask 8 and the substrate 15 from the image data, and based on the result, the control unit operates the XYθ table 11 of the printing table 10 to the mask 8. The position of the substrate 15 is corrected. Thereafter, the printing table 10 is raised and the substrate 15 and the mask 8 are brought into contact with each other. Thereafter, the squeegee 5 is lowered onto the mask surface by the squeegee lifting cylinder 6, and the cream solder supplied on the mask 8 by the movement of the squeegee head 3 is filled in the opening of the mask 8 and transferred to the substrate. The squeegee 5 rises after a certain distance stroke in the horizontal direction. Then, the printing table 10 is lowered, the mask 8 and the substrate 15 are separated, and the cream solder filled in the opening of the mask 8 is transferred to the substrate 15.

  And the board | substrate 15 with which the cream solder was printed is sent to the following process through the board | substrate carrying-out conveyor 14. FIG.

  Next, a case where an inspection unit is installed on the next process side will be described.

  FIG. 4 shows the configuration of the inspection unit.

  The inspection unit 30 includes a gate-type frame provided with a linear motor drive type drive mechanism 32 (or a drive mechanism composed of a servo motor and a ball screw) that is movable on the gantry 31 in a direction perpendicular to the substrate transport direction, and the frame. It includes a moving table 37 provided with a drive mechanism including a linear motor 35 (or a servo motor and a ball screw) disposed on the frame so as to be movable in the substrate transport direction, and an imaging camera 36 attached thereto. The camera 36 is arranged at a predetermined interval with respect to the substrate 15 so that the substrate surface can be imaged.

  By the way, the following three states typically occur as a printing defect in what is printed by the printing unit 20 described in FIG. 2 or FIG. (1) A state in which cream solder is not normally printed on the electrode part and a part lacking is present. (2) A state of so-called sagging, bridging, or blurring in which cream solder adheres to the adjacent electrode side or cream solder is applied to the outside of the electrode. (3) A state in which printing is performed with a deviation from the electrode as a whole.

  The inspection unit 30 detects these states to determine what kind of failure it is, and feeds back information to the printing unit by means of communication. By performing ABC evaluation as an example for the failure mode and processing it into broadly classified information, the processing efficiency for matching with the database information of the storage means of the printing unit can be improved, and the processing time can be greatly shortened. Other statistical methods may be adopted as a method other than the ABC evaluation. Furthermore, it is possible to easily implement necessary and sufficient quality forecast information that can be easily judged by an operator from a large amount of inspection information in a three-dimensional inspection unit or the like. Furthermore, depending on the state of failure, the next dispenser unit 40 repairs the defective product as much as possible.

  First, the substrate 15 printed by the printing unit 20 is delivered onto the substrate receiving conveyor 33 of the inspection unit 30 connected to the substrate discharging conveyor 14 of the printing unit 20. The substrate on the substrate receiving conveyor 33 is stopped at a predetermined position and transferred onto the substrate table 38. The substrate table 38 is provided with a substrate holding mechanism 39 (for example, a suction suction mechanism or a mechanical chuck mechanism), and holds the substrate 15 so as not to move. The inspection unit 30 is provided with a control unit 30C for performing image processing from image data picked up by the drive unit and camera of the inspection unit 30 to determine whether printing is good or not, so that the inspection unit 30 can operate alone. It has become. However, when operating alone, the control unit 30C requires a large memory in order to store a plurality of pattern data for printing in advance. If the printing unit 20 or the dispenser unit 40 is linked to the printing unit 20 or the dispenser unit 40, a large memory is not required because printing position data or the like may be received from the control unit on the printing unit 20 or the dispenser unit 40 side.

  Although not shown, a substrate table 38 is not provided, but a stopper that protrudes from the surface of the substrate receiving conveyor 33 to prevent the movement of the substrate 15 is provided, and after the substrate is stopped by the stopper, the receiving conveyor 33 is stopped. By doing so, it is also possible to position the substrate 15 at a predetermined position.

  Next, the substrate positioning mark is observed by the camera 36, the solder application (printing) position applied by the printing unit is obtained from the position, the camera is moved to the solder application position, and the application state is imaged. The captured image is subjected to image processing by an image processing unit provided in the control unit 30C, and it is determined whether or not the solder is normally printed at the regular printing position. By moving the camera, the entire print area is inspected. If the determination result is normal, the printing process ends there. However, if the dispenser unit 40 is provided on the downstream side of the inspection unit 30, only the transport function of the dispenser unit 40 is operated, and the inspected substrate 15 is transported to the outlet of the dispenser unit.

  If it is determined that the inspection unit 30 is defective, the data of which state of defects (1) to (3) described above has occurred is transmitted to the control unit of the printing unit 20. At the same time, the inspection result is displayed on a display device provided in the printing unit 20. Although not shown in the figure, the inspection unit 30 can be provided with an input means for changing inspection conditions and a display device for monitoring the inspection status. The same data is also transmitted to the control unit 40C provided in the dispenser unit 40.

  In the dispenser unit 40, when the defect is the above-described (1) printing defect, the chip is repaired by supplying cream solder to the defective printing part only by the dispenser. In addition, if the defect is drooping, bridging, or blurring as in (2), the substrate is transported to a dispenser unit provided with a suction dispenser, and the defective portion (other than the electrode) of the cream solder is sucked. Repair that part by removing it. Further, if the defect is due to the deviation of (3), it is determined whether or not the repair is possible. If the repair is possible, the same applies to the dispenser unit provided with the suction dispenser as in the case of (2). The substrate is transported, and the cream solder at a location that needs to be repaired is removed by suction. Thereafter, the solder is transported to a dispenser unit provided with a discharge dispenser at the electrode portion, and the cream solder is additionally applied to the electrode at the corresponding location. Further, in the case of the deviation of (3), the amount of deviation is transmitted to the printing unit 20 side, and the administrator determines whether it is a mask defect or a printing error. Have it replaced with a mask. If there is a printing problem (such as misalignment), the printing conditions are corrected.

  The dispenser unit has a configuration shown in FIG. 5 in order to perform the above operation.

  As in the previous inspection unit, a dispenser for suction or cream is used to dispose the gate-shaped frame 44 at a right angle on the substrate receiving conveyor 42 which is a substrate transport path, and to suck and remove cream solder from the printing surface. It is set as the structure provided with either or both of the cream solder discharge dispensers 43 for apply | coating a solder. FIG. 5 shows a configuration in which a discharge dispenser is provided. The suction dispenser and the application dispenser are configured to be detachable. A drive mechanism in which a frame 44 is supported on the main body side of the dispenser unit 40 and a ball screw (not shown) is provided on a servo motor 55 so that the frame 44 can be moved in the substrate transport direction is provided. This drive mechanism may be a linear motor system. The frame 44 is provided with a moving table 47 that holds the dispenser 43 and moves it in a direction perpendicular to the substrate transport direction, and a drive mechanism that includes a servo motor 45 and a ball screw 46 for moving the moving table 47. This drive mechanism may also be a linear motor. The moving table 47 is provided with a Z-axis drive mechanism 48 for moving the table 50 to which the dispenser 46 is attached up and down. Although not shown, the table 50 is provided with a camera for observing the alignment mark of the substrate and a distance sensor for measuring the distance between the substrate 15 and the dispenser 43. Further, a control unit 40C for controlling each device in the unit is provided at the lower part of the unit, and the control unit 40C is configured to be able to exchange signals with the control unit of the printing unit 20 or the inspection unit 30. It is.

  As described above, in the present invention, the quality is predicted by the quality prediction system of the printing unit before printing on the substrate by the normal printing unit, and printing is performed if there is no problem. This enables printing with high efficiency and high yield. Further, the printed board is inspected by the inspection unit, and if there is a defect in the printed portion and the defect can be repaired, it can be repaired by the dispenser unit, and the printing defect can be reduced.

  In addition, since each unit is configured in units, the layout can be easily changed.

  Furthermore, when it is necessary to print using different types of cream solder or adhesive by combining the printing unit and the dispenser unit, it is not necessary to prepare and print multiple different masks. It is possible to contribute to high-density mounting by reducing the printing time by eliminating the work time, and by expanding the degree of freedom of design and process.

  Furthermore, since the conventional printing machine, dispenser device, and inspection device were separately independent, it was necessary to provide a data input device, a display device, a data storage device, etc., respectively. They can be made common and the apparatus can be miniaturized.

It is the figure which showed the example of the combination of each unit. It is sectional drawing of the board | substrate conveyance direction of a printing unit. It is a top view of a printing unit. It is sectional drawing of an inspection unit. It is a perspective view of a dispenser unit.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Printing unit main body, 2 ... Guide rail, 3 ... Frame, 4 ... Servo motor, 5 ... Squeegee, 6 ... Squeegee raising / lowering cylinder, 7 ... Plate frame receptacle, 8 ... Mask, 9 ... Plate frame, 10 ... Printing table, DESCRIPTION OF SYMBOLS 11 ... XY (theta) table, 12 ... Reception conveyor, 13 ... Carry-in conveyor, 14 ... Carry-out conveyor, 15 ... Board | substrate, 16 ... Camera, 20 ... Printing unit, 30 ... Inspection unit, 40 ... Dispenser unit, 50 ... Loading machine, 60 ... Reflow soldering device, 70 ... rework unit.

Claims (7)

In a solder paste printing system that applies solder paste to a substrate surface via a mask,
Squeegee and mask wear due to occurrence of defects, mask damage , lack of tension , clogging of openings, supply amount of solder , supply height , supply position , and supply width , and the presence or absence of aeration, the solder is a viscosity or tacking properties obtained from the temperature and the degree of drying conditions, environmental temperature and in the printing units, humidity and dimensional variation of the production substrate and warpage and, as elements twist storing the processing method for each element as knowledge accumulates, a storage means for storing, prior to performing solder paste printing, monitoring means for know the state of the element due to the failure test, the elements predicted to determine whether there is a risk of generating defects, and analyzing means capable of emitting quality forecast or alarm to the operator based on a result of analysis, failure onset Processing means for removing the factor, inspection means for inspecting the print result after performing the solder paste printing, communication means for communicating information on the result of inspection by the inspection means to the printing apparatus, and information on the result of inspection by the inspection means solder paste printing system characterized by analyzing, with a re-analysis means for performing any time arrange to additionally stored in storage means a new bad case as new knowledge. The solder paste printing system according to claim 1,
After performing solder paste printing, after heating and cooling the solder paste and soldering, an inspection means for inspecting the soldering appearance, a communication means for communicating information on the result of inspection by the inspection means to the printing apparatus, and an inspection means solder paste printing system characterized by comprising a re-analyzing means for analyzing the information of the results of the test carried out at any time arrange to additionally stored in storage means a new bad case as new knowledge. In the solder paste printing system according to claim 1 or 2,
A solder paste printing system, wherein a plurality of dispenser units for partially applying solder paste or a plurality of rework units for correcting defective soldering portions are arranged on the downstream side of the printing apparatus. In the solder paste printing system according to claim 3,
When the inspection unit detects a printing defect due to printing failure, the dispenser unit applies cream solder to the location in order to repair the printing failure portion. In the solder paste printing system according to claim 3,
When the inspection unit detects a sag or bridging of the solder paste or a print defect on the blur, the substrate is transported to a dispenser unit having the suction dispenser among the plurality of dispenser units, and the excess cream solder is sucked there. A solder paste printing system characterized by: In the solder paste printing system according to claim 3,
When the inspection unit detects a printing misalignment, the misaligned substrate, the positional information, and the misalignment amount are transmitted from the inspection unit to the printing unit or the dispenser unit. Solder paste printing system. In the solder paste printing system according to claim 3,
A solder paste printing system, wherein a dispenser of at least one of the plurality of dispenser units supplies a different material other than cream solder such as an adhesive.

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