JPH0924665A - Method for determining solder printing conditions - Google Patents

Abstract

PROBLEM TO BE SOLVED: To determine printing conditions consistent with input conditions without repeating trials and errors, by determining printing conditions through the retrieval of an actual production condition database and a correlation rule database on the basis of input conditions. SOLUTION: When an operator inputs and sets miscellaneous conditions such as CAD data on an object board, information of a solder to be used, and a variety of squeegee information (#1), a system takes in the specified CAD data, obtains the names of object parts, retrieves the shape information of the object parts from a package database (#2) which accumulates parts information, and obtains dimensional information such as the lead pitch of IC parts. The system retrieves a production condition database on the basis of board dimensions, parts information and solder information (#3), determines printing conditions if there are completely consistent object conditions by a decision at #4 (#5). If there are no object conditions, a focus is placed on candidate printing conditions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder printing condition determining method for determining printing conditions according to the conditions of cream solder used with a target substrate in a cream solder printing machine.

[0002]

2. Description of the Related Art A conventional solder printing condition determining method will be described with reference to FIG. FIG. 6 shows a flow chart of the work of the operator in determining the printing conditions of the conventional cream solder. This work flow chart shows steps up to determining the cream solder printing conditions for the target substrate when a new cream solder, squeegee, or screen is used.

First, an operator sets initial condition data for each printing condition based on his experience so far (step # 21), and executes printing (step # 22). Next, check if there is any scrape remaining on the mask (step # 23),
If yes, the printing pressure is increased (step # 24) and the process returns to step # 22. If there is no scrap left, then the printing state after solder printing is visually confirmed (step # 25), and if the result is a good product, the printing condition is determined as the production condition (step # 26), and mass production is started.

As a result of the visual confirmation in step # 25, if there is bleeding, it is confirmed whether or not solder is attached to the back surface of the screen (step # 27), and if it is attached, the number of cleanings is increased. If there is no bleeding (step # 28), then it is checked whether or not there is bleeding on the entire substrate (step # 29). If there is bleeding on the whole, the printing pressure is weakened (step # 30). When there is no bleeding on the entire substrate, the squeegee speed is decreased (step # 31) and the plate separation speed is decreased (step # 3).
2) Then, return to step # 22.

As a result of the visual confirmation in step # 25, if there is a blur, it is confirmed whether or not the opening is scratched (step # 33), and if there is, the printing pressure is lowered (step # 34). ), If there is not, it is confirmed whether or not a component having the next largest opening is included (step # 35), and if included, the squeegee speed is slowed (step # 36),
If not included, slow down the plate separation speed (step # 3
7), and the process returns to step # 22.

As described above, steps # 24, # 28, # 30, # 31, # 32, # 34,
Change the printing conditions shown in # 36 and # 37, and reprint,
Re-visual confirmation is performed, and the above processing is repeated until a good product is confirmed as a result of the visual confirmation, and the appropriate conditions are determined.

[0007]

However, in such a conventional printing condition determining method, trial and error are repeated until an appropriate condition is determined, and the condition is set in an actual machine, which causes a decrease in the line operating rate. Was there. In addition, the tuning contents of the printing conditions are changed due to the difference in the operator's proficiency level and experience amount, and it is difficult to stabilize the quality.

In view of the above conventional problems, it is an object of the present invention to provide a solder printing condition determining method which can determine a printing condition matching an input condition without repeating trial and error on an actual machine.

[0009]

The solder printing condition determining method of the present invention accumulates the actual production condition database in which the printing condition data used in the production and the correlation rule between the printing conditions and the influencing factors related thereto are accumulated. It is characterized in that a correlation rule database is used to search these databases based on various input information to determine printing conditions.

When inputting various input information, a mounting database recording component information such as dimensions and shape is used, and further CAD data is used.

Further, the actual production condition database is searched based on various input information, and the printing conditions that match the conditions are determined, and when the conditions do not match, the actual production condition database is sequentially created from the target condition having a large influence on the condition determination. The printing condition patterns that are candidates are searched and narrowed down, and the correlation rule database is searched for unmatched printing conditions in the candidate printing condition patterns to determine the printing conditions.

Further, among the information on the solder, the squeegee, and the screen, each database is searched under any one or two or more conditions to narrow down a plurality of candidate print condition patterns, and from the narrowed down print condition patterns, The printing conditions are narrowed down and determined by extracting the conditions that match the various input information.

Further, approximate condition parameter values are extracted from the correlation rule database of the printing conditions and the influencing factors, and action advice regarding the tuning operation of the printing conditions on the actual machine is output from the correlation rule database.

Further, the CAD data including the constraint conditions on the line, the size of the target board, and the name of the target part is loaded,
Considered as a deciding factor when determining printing conditions.

[0015]

According to the solder printing condition determining method of the present invention, when changing the model or the type of solder used, various information relating to them is input, and the printing condition data used for production is accumulated based on them. By searching the production condition database and the correlation rule database that stores the correlation rules between the printing conditions and the influencing factors related to them, and determining the appropriate printing conditions, the printing condition tuning work that was conventionally performed on the printing press can be performed. There is almost no need to do it, and it is possible to improve line availability and stabilize quality.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the solder printing condition determining method of the present invention will be described below with reference to FIGS.

In the present embodiment, the conditions regarding the screen and the squeegee to be used are almost specified in operation, so that the printing conditions of the board type having different board dimensions and solder viscosities are set to be constant.

In this embodiment, the substrate size (150 × 200
× 1.6 mm), the solder viscosity is 300 Pa · s, and the printing conditions are determined when QFP of 0.5 mm pitch is included in the mounted components. In addition, the screen is 0.
The squeegee consists of a 15mm stainless steel sheet.
It is made of urethane rubber with a thickness of 9.5 mm and a hardness of Hs90.

FIG. 1 shows a flow chart of a printing condition determining method in this embodiment, and FIG. 2 shows a detailed flow chart of printing condition determination. Further, FIG. 3 shows an actual production condition database in which printing conditions used for mass production are accumulated, FIG. 4 shows a correlation rule between the printing conditions and a strong influencing factor associated therewith, and FIG. 5 shows a size of a land to be printed and a change in printing speed. And the correlation rules of printing pressure change are shown respectively.

First, the operator inputs and sets various conditions such as CAD data name of the target substrate, solder information (solder viscosity) to be used, squeegee information, screen information, and line tact (step # 1). Then, the system takes in the designated CAD data, acquires the target part name, searches the shape information of the target part from the mounting database that stores the part information such as dimensions and shape (step # 2), and greatly affects the printing conditions. Dimension information such as the lead pitch of IC parts such as QFP is obtained.

Next, based on the board size (board width) obtained from the CAD data, the component information (0.5 mm QFP) obtained from the mounting database, and the used solder information (solder viscosity) specified by the condition input, The production condition database is searched (step # 3), and if there is a completely matching target condition in the determination of step # 4, the printing condition is determined (step # 5).

As a result of the search, when there is no completely matching target condition in the actual production condition database, the actual production condition database is sequentially searched from the target conditions having a large influence of the condition determination, and the print condition patterns as candidates are obtained. The common print condition parameter values are determined (step # 6), and the print condition parameter values that do not match in those print condition patterns are searched in the correlation database of the print conditions and the influencing factors to determine the condition. The print result is inferred by changing the parameters based on the priority, or the data tuning advice is output from the correlation database of the print conditions and the influencing factors (step #
7) Determine optimal parameter values (step #
8).

Next, details of the processing examples in steps # 6 and # 7 will be described with reference to FIG. Since the degree of influence of condition determination increases in the order of parts, board size, and solder, first narrow down the printing condition patterns that are candidates for each part,
Then, the printing condition pattern is narrowed down by the board width and the solder viscosity. That is, in step # 11, the part (0.5 mm
The candidate conditions are narrowed down by QFP). In the actual production condition database shown in FIG. 3, printing condition patterns 1 to 6
Is applicable. Next, in step # 12, the board width (200 m
Use m) to narrow down the candidate conditions. In FIG. 3, there is no applicable condition.

Next, in step # 13, the solder viscosity (30
0 Pa · s) to narrow down the candidate conditions. FIG.
Then, the printing condition patterns 2 and 5 correspond. As described above, several printing condition patterns are narrowed down from the actual production condition database, and the printing condition parameter value common to them is adopted as the primary determination value (step # 14). That is, in FIG. 3, since the printing condition patterns 2 and 5 correspond most, the printing condition parameter values common to them, the plate separation speed, the plate separation distance, and the number of cleanings, are primary determination values.

Next, with respect to the parameters of other printing conditions that could not be determined by the primary determination, the correlation database of the printing conditions and the influencing factors shown in FIG. 4 is searched, and the printing result by the parameter change based on the condition determination priority. Reasoning. In this embodiment, the squeegee speed having the higher condition determination priority is first determined in the correlation database shown in FIG. 4 (step # 15). From FIG. 4, it is 20 mm / sec from the parts, 25 mm / sec from the solder, and 25 mm / sec from the board size. Further, from FIG. 5, it is determined that 20 to 30 mm / sec is appropriate when judged from the change in printing speed. Above, about 25 mm / sec is determined as the optimum value by averaging.

Next, the printing pressure of the second priority is determined (step # 16). From FIG. 4, 0.70 kg / cm ² Judging from the component, when it is determined from the solder 0.8 kg / cm ^2, a 0.75 kg / cm ² Judging from the substrate dimensions. Further, from FIG. 5, it is determined that about 0.75 kg / cm ² is appropriate when judged from the change in printing pressure. From the above, 0.75 kg / cm ² is adopted as the optimum value.

From the above results, as the optimum parameter values of the printing conditions in step # 8 of FIG. 1, the squeegee speed is 25 mm / sec, the printing pressure (left and right, center) 0.75 kg / cm ² , 0.
45 kg / cm ² , plate separation speed 0.1 mm / sec, plate separation distance 0.
1mm and 10 cleanings are decided.

[0028]

According to the solder printing condition determining method of the present invention, as is clear from the above description, when changing the model or the type of solder to be used, various information regarding them is input and based on them. Search the actual production condition database that stores the printing condition data used for production and the correlation rule database that stores the correlation rules between the printing conditions and their related influencing factors, narrow down the conditions that match the target conditions, and extract the correlation rules. By determining the conditions based on
Appropriate printing conditions can be determined offline,
It is almost unnecessary for the operator to repeatedly perform the printing condition tuning work, which has been repeated on the printing press by trial and error, and it is possible to improve the line operation rate and stabilize the quality.

Further, when inputting various input information, if a mounting database in which part information such as dimensions and the like is recorded is used, it becomes easy to input necessary information, and further, by using CAD data, it can be automatically input. Furthermore, the work becomes easier.

[Brief description of drawings]

FIG. 1 is a flowchart of a solder printing condition determining method according to an embodiment of the present invention.

FIG. 2 is a detailed flowchart of printing condition determination in the embodiment.

FIG. 3 is an explanatory view showing a part of the actual production condition database in the form of a diagram.

FIG. 4 is an explanatory diagram that schematically shows a correlation rule between a printing condition and an influencing factor in the embodiment.

FIG. 5 is an explanatory diagram that schematically shows a correlation rule between a print condition and printability in the embodiment.

FIG. 6 is a flowchart of a conventional printing condition determination method.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenichi Sato 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (7)

[Claims] 1. An actual production condition database in which printing condition data used for production is accumulated and a correlation rule database in which correlation rules between printing conditions and related influencing factors are accumulated are used, and these are based on various input information. A solder printing condition determining method, characterized by searching a database to determine printing conditions. 2. The solder printing condition determining method according to claim 1, wherein a mounting database recording component information such as dimensions and shape is used when inputting various input information. 3. The solder printing condition determining method according to claim 2, wherein CAD data is used when inputting various input information. 4. The actual production condition database is searched based on various input information, and the printing conditions that match the conditions are determined. When the conditions do not match, the actual production condition database is sequentially searched from the target condition that has a greater influence on the condition determination. 2. The solder printing condition according to claim 1, wherein the printing condition patterns that are candidates are searched for and narrowed down, and the correlation rule database is searched for mismatching printing conditions in the candidate printing condition patterns to determine the printing conditions. How to decide. 5. A plurality of candidate print condition patterns are narrowed down by searching each database based on any one or two or more conditions among information on solder, squeegee, and screen, and the narrowed print condition patterns are selected. 2. The solder printing condition determining method according to claim 1, wherein the printing conditions are narrowed down and determined by extracting conditions that match various input information. 6. A method of extracting an approximate condition parameter value from a correlation rule database of printing conditions and influencing factors, and outputting action advice regarding tuning work of printing conditions on an actual machine from the correlation rule database. Item 1. The method for determining solder printing conditions according to Item 1. 7. The solder according to claim 1, wherein the CAD data including the constraint condition on the line, the size of the target board, and the name of the target part is taken in and taken into consideration as a determinant in determining the print condition. How to determine printing conditions.