JP5198709B2 - Method, apparatus and use for applying viscous media to a substrate - Google Patents

Method, apparatus and use for applying viscous media to a substrate Download PDF

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Publication number
JP5198709B2
JP5198709B2 JP2002508879A JP2002508879A JP5198709B2 JP 5198709 B2 JP5198709 B2 JP 5198709B2 JP 2002508879 A JP2002508879 A JP 2002508879A JP 2002508879 A JP2002508879 A JP 2002508879A JP 5198709 B2 JP5198709 B2 JP 5198709B2
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Prior art keywords
substrate
screen printing
viscous medium
additional
spraying
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JP2004502539A (en
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ホルム、ウィリアム
ヤコブソン、ニルス
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マイデータ オートメーション アクチボラグ
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ink Jet (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)

Abstract

A method of applying viscous medium on a substrate that is arranged for mounting of components includes providing the substrate arranged for mounting of electronic components thereon and screen printing predetermined amounts of a viscous medium on predetermined positions on the substrate. In addition, the method includes add-on jetting of predetermined additional amounts of viscous medium on predetermined positions on the screen printed substrate. The add-on jetting is non-contact dispensing and the add-on jetting viscous medium is still in viscous form during the add-on jetting.

Description

【0001】
(発明の技術分野)
本発明は粘性媒体を基板に設ける技術分野に関する。特に、本発明は粘性媒体を基板に塗布する方法に関し、前記方法は、所定の量の粘性媒体を基板の所定の位置にスクリーン印刷するステップを含み、さらに粘性媒体を基板に塗布する装置に関し、前記装置は、所定の量の粘性媒体を基板の所定の位置にスクリーン印刷するスクリーン印刷手段を備え、さらに追加の粘性媒体をスクリーン印刷した基板に塗布する装置に関する。
【0002】
(発明の背景)
電子機器生産において、はんだペーストなどの粘性媒体をPCBなどの基板に塗布する最も一般的な方法は、スクリーン印刷を使用することである。粘性媒体付着物の大部分は、この方法で塗布することができる。しかし、特定の環境では、基板の異なる箇所に異なる粘性媒体が必要とされる。このことは問題を引き起こす。粘性媒体の初期塗布後に余分なスクリーン印刷手順を実施することによって粘性媒体を追加する場合、克服すべき幾つかの困難があるからである。さらに、空の円形のパターンなど、スクリーン印刷で達成するのが非常に困難な粘性媒体のパターンを生成することが望ましいことがある
【0003】
例えば、様々な高さを有するチップ構成要素、様々なリード角精度を有する構成要素、または同一平面の要件などに対応するため、塗布した粘性媒体が、基板上の異なる位置で異なる高さになることも望ましいことがある。当技術分野で提示されている後者の問題に対する解決方法は、スクリーン印刷にいわゆる段付きステンシルを使用する。しかし、これらのステンシルは、この解決法の普及を妨げる幾つかの欠点を呈する。
【0004】
また、主に円形の非常に小さい粘性媒体の付着物、つまりドットを、スクリーン印刷によって塗布することは不可能である。ステンシルからの接着力が、基板からの接着と比較して大きくなってしまうからである。その結果、ステンシルを除去すると、非常に小さい付着物がステンレスに付着し、それに追随することになる。この問題は、使用するステンシルを薄くすることによって克服されると想像することができる。しかし、こうすると、付着物の高さ、したがって全体的体積が全体的に減少し、これは望ましくなく、比較的大きい付着物で問題が生じるという望ましくない欠点を有する。
【0005】
最新の技術によると、従来の配量機器を使用することによって上述した問題を解決しようとする努力がなされている。従来のディスペンサを使用することにより、スクリーン印刷では容易に達成されない粘性媒体の前記パターンの生成のため、基板に最初にスクリーン印刷した後、粘性媒体を追加することが可能である。従来のディスペンサでは、基板の異なる位置に異なる高さを有する粘性媒体を塗布することも可能になり得る。しかし、従来のディスペンサは幾つかの欠点を有する。従来の粘性媒体の配量プロセスは比較的時間がかかり、従来に配量で粘性媒体の非常に小さい付着物を塗布することは困難であり、すでに粘性媒体を設けてある基板上の位置に、追加の粘性媒体を塗布することも困難である。
【0006】
(発明の概要)
したがって、本発明の目的は、既にスクリーン印刷によって粘性媒体を初期塗布してある基板に追加の粘性媒体を塗布することに関して、上述した問題に解決法を提供することである。
【0007】
以上および他の目的は、独立請求項で定義された特徴を有する方法および装置を提供することにより、本発明に従って達成される。好ましい実施形態は従属請求項で定義される。
【0008】
本発明の第1の態様によると、基板に粘性媒体を塗布する方法で、所定の量の粘性媒体を基板の所定の位置にスクリーン印刷するステップと、スクリーン印刷した基板の所定の位置に所定の追加量の粘性媒体を付加噴射するステップとを含む方法が提供される。
【0009】
本発明の第2の態様によると、基板に粘性媒体を塗布する装置で、基板の所定の位置に所定量の粘性媒体をスクリーン印刷するスクリーン印刷手段と、スクリーン印刷した基板の所定の位置に所定の追加量の粘性媒体を噴射する噴射手段とを備える装置が提供される。
【0010】
本発明の第3の態様によると、スクリーン印刷した基板に追加の粘性媒体を塗布する装置で、基板の所定の位置に前記追加量の粘性媒体を噴射する噴射手段を備える装置が提供される。
【0011】
本発明の第4の態様によると、基板に粘性媒体を塗布する、スクリーン印刷およびその後の噴射の使用が提供される。
【0012】
本発明の第5の態様によると、スクリーン印刷した基板に追加の粘性媒体を塗布する、粘性媒体噴射の使用が提供される。
【0013】
本出願では、「粘性媒体」という用語は、はんだペースト、フラックス、接着剤、伝導性接着剤、または基板に構成要素を固定するために使用する他の任意の種類の媒体と解釈し、「基板」という用語は、印刷回路基板(PCB)、ボール・グリッド・アレイ(BGA)の基板、チップ・スケール・パッケージ(CSP)、クオッド・フラット・パッケージ(QFP)、およびフリップ・チップなどと解釈するものとする。「噴射」という用語は、粘性媒体が配量チップから出て、基板に接触して粘着し、配量チップが引き離されると基板上に残るという行為である「流体濡れ」などの接触配量プロセスに対して、例えば公開された国際特許出願第99/64167号に記載されているように、粘性媒体の小滴を形成し、ジェット・ノズルから基板にこれを射出するために流体ジェットを使用する非接触配量プロセスと解釈すべきことにも留意されたい。さらに、「付加」という用語は、本明細書では、追加の粘性媒体を塗布することを指す。つまり初期塗布ではない。
【0014】
したがって、本発明は、以前にスクリーン印刷によって粘性媒体が塗布されている基板に追加の粘性媒体を塗布するため、付加噴射を使用するという有利な概念に基づく。
【0015】
噴射を使用することにより、スクリーン印刷に関する上述の問題の幾つかが克服される。第1に、噴射により、最初に塗布したものと異なるタイプまたは種類の粘性媒体を塗布することができる。噴射の使用により、粘性媒体をあらゆる所望のパターンで塗布することもでき、これはスクリーン印刷では不可能である。様々な高さの粘性媒体塗布も、噴射により達成可能である。また、噴射は、より高速で、正確かつ融通性があるという点で、従来の配量より有利である。実際、従来の配量を使用すると、往々にして、噴射の使用と比較して全体的なコンポーネントの装着プロセスにおけるサイクル時間が増加するという障害が生じる。噴射を使用すると、従来の配量を使用する場合より小さいドットの達成が可能であることも判明している。
【0016】
さらに、スクリーン印刷した基板に追加の粘性媒体を塗布するために噴射を使用して獲得される主要な利点の一つは、既に粘性媒体が塗布されている箇所に粘性媒体を塗布することが可能なことである。これにより、噴射器具のノズルが、既に基板に塗布されている粘性媒体によって汚れるという危険がなく、塗布した粘性媒体の高さを特定の位置で容易に増加させることが可能になる。
【0017】
本発明の特定の実施形態によると、基板に粘性媒体を塗布した結果を検査し、前記検査に基づいて塗布のエラーを検出して、前記エラーの少なくとも一部を修正し、ここで前記修正は、基板に追加の粘性媒体を噴射することを含む。つまり、噴射により基板に所定追加量の粘性媒体を塗布されるばかりでなく、通常の粘性媒体塗布におけるエラーの結果として必要と判断される追加量の粘性媒体も塗布される。
【0018】
前記検査は、粘性媒体のスクリーン印刷と付加噴射の間、粘性媒体の付加噴射後、またはその両方で実行することができる。スクリーン印刷と付加噴射の間に検査を実行する場合は、噴射が必要な位置および量を判断するか、付加噴射と噴射修正を順序通りに実行することにより、所定の付加噴射を修正噴射と組み合わせることができる。
【0019】
単一の噴射手段が付加噴射と噴射修正の両方を実行することが好ましく、これによってシステムの物理的複雑さが低下する。あるいは、これを別個の噴射手段で実行する。
【0020】
付加噴射のみの後に検査を実行する場合は、別個の機械で修正を実行することができる。これにより、全体的な粘性媒体塗布プロセスのサイクル時間が短縮されるが、ライン長は増加する。噴射修正に別個の機械を使用する場合は、エラーの検査、評価および判断は、同じ機械で実行することが好ましいが、そうする必要はない。
【0021】
本発明のさらなる実施形態によると、塗布した粘性媒体の修正は、過剰な粘性媒体を除去することも含む。これは、塗布した粘性媒体が多すぎることが検査によって判明した基板の特定の位置のみで実行することが好ましい。これは、任意の位置における粘性媒体の量、塗布した粘性媒体の高さ、塗布した粘性媒体の所期位置からのずれ、または粘性媒体が想定されていない位置に塗布されていることを指す。
【0022】
本発明のさらなる実施形態によると、基板の検査の後、評価を実行して、検出されたエラーの数または程度が、塗布した粘性媒体の修正に相当するようなものであるか判断する。このような評価は、検査が、追加的粘性媒体の付加噴射の実行前か後かに関係なく実行することができる。つまり、大量の補正行為が必要な場合は、単に基板を廃棄する方が経済的かもしれない。これは言うまでもなく、基板のタイプおよび基板にかかる費用によって決定される。修正にその価値がないとされた場合、基板は塗布した粘性媒体を洗浄し、再使用することが好ましい。これに対して、基板の洗浄が経済的でないとされた場合は、基板を廃棄することが好ましい。
【0023】
粘性媒体のスクリーン印刷およびその後の噴射は、本出願では、スクリーン印刷と噴射の両方について、1つの粘性媒体の使用に制限されないことに留意されたい。その結果、幾つかの異なるタイプおよび種類の粘性媒体を使用することができる。例えば、ある粘性媒体でスクリーン印刷を実行し、次に別の粘性媒体で付加噴射を実行する。追加的に、異なる種類の粘性媒体でその後の噴射、付加噴射および/または修正噴射を順番に実行することができる。次に、異なる粘性媒体の望ましくない混合を回避したり、粘性媒体供給の変更および場合によっては噴射手段の洗浄によるサイクル時間の増加を回避したりするために、複数の噴射手段を使用することが好ましい。
【0024】
本発明の以上およびその他の態様、利点および特徴は、例示的実施形態に関する以下の説明から、さらに完全に理解される。
【0025】
本発明の例示的実施形態について、添付図面に関して以下で説明する。
【0026】
(好ましい実施形態の詳細な説明)
図1から図3のブロック図では、太線の矢印は生産ラインを通る基板1の動きを示す。点線のボックスは、単に、ボックス内に描かれた手段または装置を1つの機械に組み込めることを示す。
【0027】
図1から図6を参照すると、本発明の例示的実施形態が図示されている。スクリーン印刷、噴射、塗布結果の検査、はんだペーストの除去、およびコンポーネントの装着に使用する特定の手段については、それ自身が当技術分野で知られている適切な手段、および同様に知られている構造的特徴を使用することができる。したがって、別個の各手段に関する詳細な構造的および機能的説明は省略してある。さらに、以下の例示的実施形態に関する説明の粘性媒体は、はんだペーストである。しかし、本発明ははんだペーストの使用に制限されない。逆に、任意のタイプの粘性媒体を使用することができる。
【0028】
最初に図1から図4を参照すると、本発明の第1の例示的実施形態が図示されている。基板1を、ステップ100でスクリーン印刷機12に移送し、ここでステップ102にてはんだペーストの初期塗布を実行する。次に、基板1をステップ104で機械16に移送し、ステップ106で追加量のはんだペーストの付加噴射を実行する。基板1に付加されるはんだペーストの量、パターン、高さ、タイプなどは、予め決定される。したがって、追加はんだペーストを噴射する前にスクリーン印刷結果を実行する場合は、検査がない。付加噴射ステップの後、基板1をステップ108でコンポーネント装着機18に移送し、ここで電気コンポーネントを基板1に装着する。代替法として、組み合わせたはんだペースト塗布、つまりスクリーン印刷と付加噴射双方の最終結果を検査するステップを含んでもよい。
【0029】
次に図2および図5を参照すると、本発明の別の例示的実施形態が図示されている。この実施形態は、スクリーン印刷結果を検査するため設けた検査手段14も含む。ステップ202でスクリーン印刷した後、基板をステップ204で検査手段14に移送し、これはステップ206で検査を実行する。付加噴射を実行するため、検査結果を記録し、手段16’に中継する。前記検査の結果に関する情報で、噴射手段16’は、初期スクリーン印刷の何らかのエラーにより塗布量が不十分であった基板の位置に、必要な追加はんだペーストの噴射を実行することもできる。したがって、噴射手段16’は、付加噴射と修正を組み合わせた手段16’である。さらに、この実施形態によると、付加噴射および修正手段16’は、基板からある量のはんだペーストを除去する手段も含むことができる。この実施形態によると、基板の選択された位置ではんだペーストの吸引により除去を実行する。検査により、基板1の修正をするに当たらないことが判明した場合は、基板1が、何らの措置も執らずに、付加噴射および修正手段16’を通過する。次に、コンポーネント装着機18に到達する前に、基板1を生産ラインから取り出すだけである。
【0030】
検査手段14は、付加噴射および修正手段16’と同じ機械に組み込み、したがって組み合わせた検査および修正機15を形成することが好ましい。次に、検査手段14を使用して、付加噴射の結果を検査し、基板上の塗布エラーをさらに最小限に抑えることができる。しかし、検査手段14は、当然、別個の機械でもよい。
【0031】
ステップ208の修正および付加噴射の後、基板をステップ210でコンポーネント装着機18に移送する。
【0032】
最後に、図3のブロック図および図6の流れ図は、本発明のさらに別の例示的実施形態を示す。ここでは、スクリーン印刷機12および検査手段14を1台の機械10に組み込む。ステップ300からステップ304で基板1をスクリーン印刷し、その後にスクリーン印刷機および検査手段10でスクリーン印刷結果を検査した後、基板1を付加噴射および修正手段16’に移送する。付加噴射および修正手段16’は、図2の対応する手段16’と同様の機能を有する。基板が付加噴射および修正手段16’に入ると、前記手段16’は、基板1に実行すべき必要な修正がある場合はそれに関する情報を受信している。次に、ステップ308で追加はんだペーストを追加して、塗布エラーを修正し、ステップ310で基板1をコンポーネント装着機18に移送する。この場合も、検査によって基板1にスクリーン印刷による幾つかのエラーがあると判明し、修正する価値があるとされた場合は、基板1を生産ラインから取り出す。この実施形態では、基板1が付加噴射および修正手段16’に到達する前に、これを実行する。
【0033】
当業者には理解されるように、上述したステップは、上記のステップは特定の量の処理、移送、および評価情報を必要とする。しかし、これは、従来の処理手段で実行することができ、それについては図示せず、これ以上説明もしない。
【0034】
本発明を、その例示的実施形態を使用して以上で説明してきたが、添付請求の範囲で規定された本発明の範囲内で、当業者に理解されるようなその変更、改修および組合せを実行することができる。
【図面の簡単な説明】
【図1】 本発明の代替実施形態による配置構成を示すブロック図である。
【図2】 本発明の代替実施形態による配置構成を示すブロック図である。
【図3】 本発明の代替実施形態による配置構成を示すブロック図である。
【図4】 図1で示した代替実施形態の流れ図を示す。
【図5】 図2で示した代替実施形態の流れ図を示す。
【図6】 図3で示した代替実施形態の流れ図を示す。
[0001]
(Technical field of the invention)
The present invention relates to the technical field of providing a viscous medium on a substrate. In particular, the present invention relates to a method for applying a viscous medium to a substrate, the method comprising a step of screen printing a predetermined amount of the viscous medium at a predetermined position on the substrate, and further to an apparatus for applying the viscous medium to the substrate, The apparatus relates to an apparatus that includes a screen printing unit that screen-prints a predetermined amount of viscous medium on a predetermined position of a substrate, and further applies an additional viscous medium to the screen-printed substrate.
[0002]
(Background of the Invention)
In electronic device production, the most common method of applying a viscous medium such as a solder paste to a substrate such as a PCB is to use screen printing. Most of the viscous media deposits can be applied in this way. However, in certain circumstances, different viscous media are required at different locations on the substrate. This causes problems. This is because there are some difficulties to overcome when adding viscous media by performing an extra screen printing procedure after the initial application of the viscous media. In addition, it may be desirable to generate a pattern of viscous media that is very difficult to achieve with screen printing, such as an empty circular pattern.
For example, to accommodate chip components with varying heights, components with varying lead angle accuracy, coplanar requirements, etc., the applied viscous media will have different heights at different locations on the substrate. It may also be desirable. A solution to the latter problem presented in the art uses so-called stepped stencils for screen printing. However, these stencils present several drawbacks that prevent the spread of this solution.
[0004]
Also, it is impossible to apply mainly circular, very small viscous media deposits, ie dots, by screen printing. This is because the adhesive force from the stencil becomes larger than that from the substrate. As a result, when the stencil is removed, very small deposits will adhere to and follow the stainless steel. It can be imagined that this problem can be overcome by thinning the stencil used. However, this reduces the overall height of the deposit, and thus the overall volume, which is undesirable and has the undesirable disadvantage of causing problems with relatively large deposits.
[0005]
According to the state of the art, efforts are made to solve the above-mentioned problems by using conventional dispensing equipment. By using a conventional dispenser, it is possible to add the viscous medium after first screen printing on the substrate to generate the pattern of viscous medium that is not easily achieved by screen printing. Conventional dispensers may also allow viscous media having different heights to be applied at different locations on the substrate. However, conventional dispensers have several drawbacks. The conventional viscous medium dispensing process is relatively time consuming, and it has been difficult to apply very small deposits of viscous medium with conventional dispensing, and at a position on the substrate already provided with the viscous medium, It is also difficult to apply additional viscous media.
[0006]
(Summary of Invention)
Accordingly, it is an object of the present invention to provide a solution to the problems described above with respect to applying additional viscous media to a substrate that has already been initially coated with viscous media by screen printing.
[0007]
These and other objects are achieved according to the present invention by providing a method and apparatus having the features defined in the independent claims. Preferred embodiments are defined in the dependent claims.
[0008]
According to a first aspect of the present invention, in the method of applying a viscous medium to a substrate, a step of screen printing a predetermined amount of the viscous medium at a predetermined position on the substrate, and a predetermined position at a predetermined position on the screen printed substrate. Additional injection of an additional amount of viscous medium.
[0009]
According to the second aspect of the present invention, in the apparatus for applying the viscous medium to the substrate, the screen printing means for screen-printing a predetermined amount of the viscous medium at a predetermined position of the substrate, and the predetermined position at the predetermined position of the screen-printed substrate. And an injection means for injecting an additional amount of viscous medium.
[0010]
According to a third aspect of the present invention, there is provided an apparatus for applying an additional viscous medium to a screen-printed substrate, comprising an injection means for injecting the additional amount of the viscous medium to a predetermined position of the substrate.
[0011]
According to a fourth aspect of the invention, there is provided the use of screen printing and subsequent jetting to apply a viscous medium to a substrate.
[0012]
According to a fifth aspect of the invention, there is provided the use of viscous media jets to apply additional viscous media to a screen printed substrate.
[0013]
In this application, the term “viscous medium” is interpreted as solder paste, flux, adhesive, conductive adhesive, or any other type of medium used to secure components to a substrate, "Is interpreted as printed circuit board (PCB), ball grid array (BGA) board, chip scale package (CSP), quad flat package (QFP), flip chip, etc. And The term "jetting" is a contact metering process such as "fluid wetting", where the viscous medium exits the metering tip, contacts and adheres to the substrate, and remains on the substrate when the metering tip is pulled apart In contrast, a fluid jet is used to form a droplet of viscous media and eject it from a jet nozzle onto a substrate, as described, for example, in published International Patent Application No. 99/64167. Note also that it should be interpreted as a non-contact metering process. Furthermore, the term “addition” refers herein to applying an additional viscous medium. That is, it is not an initial application.
[0014]
The present invention is therefore based on the advantageous concept of using additional jets to apply additional viscous media to a substrate that has previously been coated with viscous media by screen printing.
[0015]
By using jetting, some of the above-mentioned problems with screen printing are overcome. First, it is possible to apply a different type or kind of viscous medium than the one originally applied by spraying. By using jetting, the viscous media can be applied in any desired pattern, which is not possible with screen printing. Various heights of viscous media application can also be achieved by spraying. Also, injection is advantageous over conventional metering in that it is faster, more accurate and flexible. In fact, the use of conventional metering often presents an obstacle in that the cycle time in the overall component mounting process is increased compared to the use of injection. It has also been found that using jets it is possible to achieve smaller dots when using conventional metering.
[0016]
In addition, one of the major advantages gained using jets to apply additional viscous media to screen printed substrates is the ability to apply viscous media where it has already been applied. It is a thing. Thereby, there is no danger that the nozzle of an injection tool will be contaminated by the viscous medium already applied to the substrate, and the height of the applied viscous medium can be easily increased at a specific position.
[0017]
According to a particular embodiment of the invention, the result of applying a viscous medium to the substrate is inspected, and an application error is detected based on the inspection, and at least a part of the error is corrected, wherein the correction is Spraying additional viscous medium onto the substrate. That is, not only a predetermined additional amount of viscous medium is applied to the substrate by spraying, but also an additional amount of viscous medium determined to be necessary as a result of an error in normal viscous medium application.
[0018]
The inspection can be performed during screen printing and additional jetting of viscous media, after additional jetting of viscous media, or both. When performing an inspection between screen printing and additional injection, a predetermined additional injection is combined with a correction injection by determining the position and amount that require injection, or by performing additional injection and injection correction in order. be able to.
[0019]
A single injection means preferably performs both additional injection and injection correction, which reduces the physical complexity of the system. Alternatively, this is performed by a separate injection means.
[0020]
If the inspection is performed only after the additional injection, the correction can be performed on a separate machine. This shortens the overall viscous media application process cycle time, but increases the line length. If a separate machine is used for injection correction, error checking, evaluation and judgment are preferably performed on the same machine, but it is not necessary to do so.
[0021]
According to a further embodiment of the invention, the modification of the applied viscous medium also includes removing excess viscous medium. This is preferably performed only at specific locations on the substrate that have been found by inspection that too much viscous medium has been applied. This means that the amount of the viscous medium at any position, the height of the applied viscous medium, the deviation of the applied viscous medium from the intended position, or the viscous medium being applied to an unintended position.
[0022]
According to a further embodiment of the invention, after inspection of the substrate, an evaluation is performed to determine whether the number or degree of detected error is equivalent to a modification of the applied viscous medium. Such an evaluation can be performed regardless of whether the inspection is performed before or after the additional injection of additional viscous medium. That is, if a large amount of correction is required, it may be more economical to simply discard the substrate. This is of course determined by the type of substrate and the cost of the substrate. If the modification is deemed worthless, the substrate is preferably cleaned and reused for the applied viscous medium. On the other hand, when it is determined that the cleaning of the substrate is not economical, it is preferable to discard the substrate.
[0023]
Note that screen printing and subsequent jetting of viscous media is not limited to the use of one viscous media for both screen printing and jetting in this application. As a result, several different types and types of viscous media can be used. For example, screen printing is performed with a certain viscous medium, and then additional jetting is performed with another viscous medium. Additionally, subsequent injections, additional injections and / or modified injections can be performed in sequence with different types of viscous media. Second, multiple injection means may be used to avoid undesired mixing of different viscous media, or to avoid increased cycle time due to changes in viscous medium supply and possibly cleaning the injection means. preferable.
[0024]
These and other aspects, advantages and features of the present invention will be more fully understood from the following description of exemplary embodiments.
[0025]
Exemplary embodiments of the invention are described below with reference to the accompanying drawings.
[0026]
Detailed Description of Preferred Embodiments
In the block diagrams of FIGS. 1 to 3, thick arrows indicate the movement of the substrate 1 through the production line. The dotted box simply indicates that the means or device drawn in the box can be integrated into one machine.
[0027]
Referring to FIGS. 1-6, an exemplary embodiment of the present invention is illustrated. Specific means used for screen printing, jetting, application result inspection, solder paste removal, and component mounting are suitable means known per se in the art, and likewise Structural features can be used. Accordingly, detailed structural and functional descriptions for each individual means are omitted. Further, the viscous medium described in the following exemplary embodiment is a solder paste. However, the present invention is not limited to the use of solder paste. Conversely, any type of viscous medium can be used.
[0028]
Referring initially to FIGS. 1-4, a first exemplary embodiment of the present invention is illustrated. The substrate 1 is transferred to the screen printer 12 in step 100, where initial application of solder paste is performed in step 102. Next, the substrate 1 is transferred to the machine 16 at step 104, and additional injection of an additional amount of solder paste is executed at step 106. The amount, pattern, height, type, etc. of the solder paste applied to the substrate 1 are determined in advance. Therefore, there is no inspection if the screen printing result is executed before the additional solder paste is sprayed. After the additional injection step, the substrate 1 is transferred to the component mounting machine 18 at step 108 where the electrical components are mounted on the substrate 1. As an alternative, it may also include the step of inspecting the combined solder paste application, ie the final result of both screen printing and additional jetting.
[0029]
With reference now to FIGS. 2 and 5, another exemplary embodiment of the present invention is illustrated. This embodiment also includes inspection means 14 provided for inspecting the screen printing result. After screen printing in step 202, the substrate is transferred to the inspection means 14 in step 204, which performs the inspection in step 206. In order to perform additional injection, the inspection results are recorded and relayed to the means 16 '. With the information regarding the result of the inspection, the spraying means 16 ′ can also spray the necessary additional solder paste on the position of the substrate where the coating amount is insufficient due to some error in the initial screen printing. Therefore, the injection means 16 ′ is a means 16 ′ that combines additional injection and correction. Furthermore, according to this embodiment, the additional jet and correction means 16 ′ can also include means for removing an amount of solder paste from the substrate. According to this embodiment, removal is performed by suction of solder paste at selected locations on the substrate. If it is found by inspection that the substrate 1 is not corrected, the substrate 1 passes through the additional injection and correction means 16 ′ without taking any measures. Next, the substrate 1 is simply taken out of the production line before reaching the component mounting machine 18.
[0030]
The inspection means 14 is preferably integrated into the same machine as the additional injection and correction means 16 ′ and thus forms a combined inspection and correction machine 15. Next, the inspection means 14 can be used to inspect the results of the additional jets to further minimize coating errors on the substrate. However, the inspection means 14 can naturally be a separate machine.
[0031]
After the correction and additional injection in step 208, the substrate is transferred to the component mounter 18 in step 210.
[0032]
Finally, the block diagram of FIG. 3 and the flowchart of FIG. 6 illustrate yet another exemplary embodiment of the present invention. Here, the screen printer 12 and the inspection means 14 are incorporated into one machine 10. After the substrate 1 is screen-printed in steps 300 to 304 and the screen printing result is inspected by the screen printer and the inspection means 10, the substrate 1 is transferred to the additional jet and correction means 16 ′. The additional injection and correction means 16 ′ has the same function as the corresponding means 16 ′ of FIG. When the substrate enters the additional injection and correction means 16 ', said means 16' has received information regarding any necessary corrections to be performed on the substrate 1. Next, an additional solder paste is added in step 308 to correct the application error, and the substrate 1 is transferred to the component mounting machine 18 in step 310. Also in this case, if the inspection reveals that the substrate 1 has some errors due to screen printing and it is worth correcting, the substrate 1 is taken out of the production line. In this embodiment, this is done before the substrate 1 reaches the additional injection and correction means 16 '.
[0033]
As will be appreciated by those skilled in the art, the steps described above require a certain amount of processing, transport, and evaluation information. However, this can be performed by conventional processing means, which are not shown and will not be described further.
[0034]
Although the invention has been described above using exemplary embodiments thereof, modifications, alterations and combinations thereof, as would be understood by a person skilled in the art, are within the scope of the invention as defined in the appended claims. Can be executed.
[Brief description of the drawings]
FIG. 1 is a block diagram illustrating an arrangement according to an alternative embodiment of the present invention.
FIG. 2 is a block diagram illustrating an arrangement according to an alternative embodiment of the present invention.
FIG. 3 is a block diagram illustrating an arrangement according to an alternative embodiment of the present invention.
FIG. 4 shows a flow diagram of the alternative embodiment shown in FIG.
FIG. 5 shows a flow diagram of an alternative embodiment shown in FIG.
6 shows a flow diagram of the alternative embodiment shown in FIG.

Claims (19)

基板に粘性媒体を塗布する方法で、
所定の量の粘性媒体を基板の所定の位置にスクリーン印刷するステップと、
スクリーン印刷した基板の所定の位置に所定の追加量の粘性媒体を追加噴射するステップと、
前記スクリーン印刷するステップの前に、前記追加噴射するステップの前記所定の位置と所定の追加量を決定するステップを含む方法。
In a method of applying a viscous medium to the substrate,
Screen printing a predetermined amount of viscous medium at a predetermined position on the substrate;
Additionally spraying a predetermined additional amount of viscous medium on a predetermined position of the screen printed substrate;
A method comprising the step of determining the predetermined position and a predetermined additional amount of the additional spraying step before the screen printing step.
前記スクリーン印刷および付加噴射の結果を検査するステップと、
前記検査に基づいて、前記スクリーン印刷および付加噴射のエラーを判断するステップと、
修正が必要か判断するステップと、
修正が必要な場合は、前記エラーの少なくとも一部を修正するステップとを含み、前記修正が、スクリーン印刷した基板に追加の粘性媒体を補足的に噴射することを含む、請求項1に記載の方法。
Inspecting the results of the screen printing and additional jetting;
Determining the screen printing and additional jetting errors based on the inspection;
A step to determine if correction is necessary,
2. Correcting at least a portion of the error if correction is necessary, the correction comprising supplementally spraying additional viscous media onto the screen printed substrate. Method.
前記付加噴射の前に前記スクリーン印刷の結果を検査するステップと、
前記検査に基づいて前記スクリーン印刷のエラーを判断するステップと、
修正が必要か判断し、修正が必要な場合は、前記エラーの少なくとも一部を修正するステップとを含み、前記修正が、スクリーン印刷した基板に追加の粘性媒体を補足的に噴射することを含む、請求項1に記載の方法。
Inspecting the result of the screen printing before the additional jet;
Determining an error in the screen printing based on the inspection;
Determining whether a correction is necessary and, if necessary, correcting at least a portion of the error, the correction comprising supplementally spraying additional viscous media onto the screen printed substrate The method of claim 1.
前記補足的噴射が、前記付加噴射の実行に関連して実行される、請求項3に記載の方法。  The method of claim 3, wherein the supplemental injection is performed in connection with performing the additional injection. 前記付加噴射および前記補足的噴射が、同じ噴射手段によって実行される、請求項2から4いずれか1項に記載の方法。  The method according to claim 2, wherein the additional injection and the supplementary injection are performed by the same injection means. 前記修正ステップが、
基板上の位置からある量の粘性媒体を除去するステップを含む、請求項2から5いずれか1項に記載の方法。
The correcting step comprises:
6. A method according to any one of claims 2 to 5, comprising the step of removing an amount of viscous medium from a position on the substrate.
前記修正が必要判断するステップが、
判断したエラーを全て評価し、判断したエラーを修正すべきか決定するステップを含む、請求項2から6いずれか1項に記載の方法。
Determining whether the correction is necessary,
7. A method according to any one of claims 2 to 6, including the step of evaluating all the determined errors and determining whether the determined errors should be corrected.
前記付加噴射で塗布される少なくとも1つの粘性媒体が、スクリーン印刷で塗布した粘性媒体と異なる、請求項1から7いずれか1項に記載の方法。  The method according to claim 1, wherein at least one viscous medium applied by the additional jet is different from a viscous medium applied by screen printing. 基板に粘性媒体を塗布する装置で、
基板の所定の位置に所定量の粘性媒体をスクリーン印刷するスクリーン印刷手段と、
スクリーン印刷した基板の所定の位置に所定の追加量の粘性媒体を噴射する噴射手段とを備え、前記スクリーン印刷をする前に、前記所定の位置と所定の追加量を決定する装置。
A device that applies a viscous medium to a substrate.
Screen printing means for screen printing a predetermined amount of viscous medium at a predetermined position on the substrate;
An apparatus for injecting a predetermined additional amount of viscous medium to a predetermined position of a screen printed substrate, and determining the predetermined position and the predetermined additional amount before performing the screen printing.
前記スクリーン印刷および噴射の結果を検査する検査手段と、
前記検査に基づき、前記スクリーン印刷および噴射のエラーを判断する処理手段と、
前記エラーの少なくとも一部を修正する修正手段を備え、前記修正手段が、スクリーン印刷した基板にある量の粘性媒体を補足的に噴射するよう配置された噴射手段を備える、請求項9に記載の装置。
Inspection means for inspecting the result of the screen printing and jetting;
Processing means for determining an error in the screen printing and jetting based on the inspection;
The correction means according to claim 9, comprising correction means for correcting at least part of the error, the correction means comprising jetting means arranged to supplementarily jet a quantity of viscous medium on the screen printed substrate. apparatus.
前記スクリーン印刷の結果を検査する検査手段と、
前記検査に基づき、前記スクリーン印刷のエラーを判断する処理手段と、
前記エラーの少なくとも一部を修正する修正手段とを備え、前記修正手段が、スクリーン印刷した基板にある量の粘性媒体を補足的に噴射するよう配置された噴射手段を備える、請求項9に記載の装置。
Inspection means for inspecting the result of the screen printing;
Processing means for determining an error in the screen printing based on the inspection;
10. Correcting means for correcting at least a portion of the error, wherein the correcting means comprises spraying means arranged to supplementarily spray a quantity of viscous medium on a screen printed substrate. Equipment.
修正手段が、スクリーン印刷した基板から粘性媒体を除去する除去手段を備える、請求項10または11に記載の装置。  12. Apparatus according to claim 10 or 11, wherein the correction means comprises removal means for removing the viscous medium from the screen printed substrate. 基板の所定の位置に追加量の粘性媒体を噴射する噴射手段および補足的噴射手段が同じ噴射手段である、請求項10から12いずれか1項に記載の装置。  13. The apparatus according to any one of claims 10 to 12, wherein the spraying means for spraying an additional amount of viscous medium to the predetermined position of the substrate and the supplemental spraying means are the same spraying means. スクリーン印刷した基板に追加の粘性媒体を塗布する装置で、基板の所定の位置に前記追加量の粘性媒体を噴射する噴射手段を備え、前記スクリーン印刷をする前に、前記所定の位置と所定の追加量を決定する装置。  An apparatus for applying an additional viscous medium to a screen-printed substrate, comprising spraying means for spraying the additional amount of viscous medium to a predetermined position of the substrate, and before the screen printing, A device that determines the additional amount. 前記スクリーン印刷および噴射の結果を検査する検査手段と、
前記検査に基づき、前記スクリーン印刷および噴射のエラーを判断する処理手段と、
前記エラーの少なくとも一部を修正する修正手段とを備え、前記修正手段が、スクリーン印刷した基板にある量の粘性媒体を補足的に噴射するよう配置された噴射手段を備える、請求項14に記載の装置。
Inspection means for inspecting the result of the screen printing and jetting;
Processing means for determining an error in the screen printing and jetting based on the inspection;
15. Correcting means for correcting at least a portion of the error, the correcting means comprising spraying means arranged to supplementarily spray a quantity of viscous media on a screen printed substrate. Equipment.
前記スクリーン印刷の結果を検査する検査手段と、前記検査に基づき、前記スクリーン印刷のエラーを判断する処理手段と、
前記エラーの少なくとも一部を修正する修正手段とを備え、前記修正手段が、スクリーン印刷した基板にある量の粘性媒体を補足的に噴射するよう配置された噴射手段を備える、請求項14に記載の装置。
Inspection means for inspecting the result of the screen printing; processing means for judging an error in the screen printing based on the inspection;
15. Correcting means for correcting at least a portion of the error, the correcting means comprising spraying means arranged to supplementarily spray a quantity of viscous media on a screen printed substrate. Equipment.
修正手段が、スクリーン印刷した基板から粘性媒体を除去する除去手段を備える、請求項15または16に記載の装置。  17. An apparatus according to claim 15 or 16, wherein the correction means comprises removal means for removing the viscous medium from the screen printed substrate. 基板の所定の位置に追加量の粘性媒体を噴射する噴射手段と補足的噴射手段とが同じ噴射手段である、請求項15から17いずれか1項に記載の装置。  18. An apparatus according to any one of claims 15 to 17, wherein the spraying means for spraying the additional amount of viscous medium to the predetermined position of the substrate and the supplemental spraying means are the same spraying means. スクリーン印刷した基板に追加の粘性媒体を塗布する、粘性媒体噴射の使用。  Use of viscous media jets to apply additional viscous media to screen printed substrates.
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