JPH04130696A - Method of supplying cream solder to pattern mask - Google Patents

Abstract

PURPOSE:To effectively and smoothly supply cream solder by selectively using a roller having a diameter suitable for a supplying amount to a through hole of pattern mask, and supplying the solder while rolling it. CONSTITUTION:A cream solder 15 on a mask pattern 12 is supplied by a pressurizing and rolling process by a roller 11 while forcibly press-fitting in the through hole 13 of the pattern 12. In this case, the roller 11 is selected to have a diameter suitable for a supplying mount from various types having different diameters, and the solder 15 is supplied smoothly and effectively to the hole 13 of the mask 12 in response to the degree of viscosity. The solders can alternately be supplied to paired and disposed printed boards 16 by using reciprocating strokes of the roller.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of supplying cream solder to a pattern mask, and more specifically, it is suitable for supplying cream solder spot-wise to a predetermined position on a printed circuit board. The present invention relates to a method for supplying cream solder to a pattern mask that can be used for.

[Prior Art] Recently, as the mounting density of electronic components on printed circuit boards has increased, the supply of cream solder to stably fix these electronic components has become required to be more precise. .

One method to meet such demands is a coating device that supplies cream solder onto a printed circuit board in a predetermined pattern while moving a controllable nozzle.

Another method is to use a pattern mask with holes drilled in a predetermined pattern, spread the cream solder supplied onto this pattern mask using a squeegee, and spread it through the holes. There is a method of supplying cream solder to the printed circuit board side.

[Problems to be Solved by the Invention] By the way, it is possible to supply cream solder to a predetermined position on a printed circuit board using any of the conventional methods described above.

However, among the above methods, when a coating device is used, the control system for moving the nozzle is complicated, and the device becomes large-scale, leading to an increase in cost.

Furthermore, when using a pattern mask, the amount of solder supplied to the through holes may vary even under the same conditions depending on the degree of viscosity of the cream solder itself, making it difficult to stably supply the appropriate amount to the printed circuit board. Not only is it impossible to do this, but the conditions for the spreading operation using a squeegee must be set depending on the situation at the time, which poses the problem of making the operation extremely complicated.

[Means for Solving the Problems] The present invention has been made in view of the above-mentioned problems seen in the conventional method, and its structural features correspond to the arrangement positions of electronic components mounted on a printed circuit board. A pattern mask is used, which is equipped with a through hole drilled under a pattern, and the amount of cream solder supplied to the top surface of this pattern mask is determined in relation to the amount of cream solder supplied to the through hole. The method is to spread the material under pressure using a roller having a selected diameter and supply it to the through hole.

Furthermore, the pattern mask used in the method of the present invention is
For printed circuit boards arranged in pairs separated from each other, apply cream solder to the holes in the pattern corresponding to one printed circuit board during forward movement, and to the holes in the pattern corresponding to the other printed circuit board during backward movement. The cream solder may be supported so as to be able to reciprocate in order to be supplied, and the cream solder may be pressurized and spread by a roller using the stroke during this reciprocating movement.

[Function] For this reason, by selectively using a roller having a suitable diameter in relation to the amount of supply to the hole in the pattern mask, it is possible to spread the cream solder while spreading it. can be supplied.

Therefore, when cream solder is supplied to the through holes of the pattern mask, it can be carried out reliably and smoothly depending on the degree of viscosity of the cream solder.

[Example] Embodiments of the present invention will be described in detail below with reference to the drawings.

The mask pattern 12 used in the present invention includes at least one through hole 1 of an appropriate diameter, which is formed in a pattern corresponding to the arrangement position of electronic components mounted on the printed circuit board 16.
3.

Cream solder 15 having an appropriate composition is supplied to the upper surface of the mask pattern 12 thus formed.

The supplied cream solder 15 is spread under pressure by rollers 11 that are disposed so as to be transferable.

The cream solder 15 on the mask pattern 12 is applied to the roller 1.
1, the material is forcibly press-fitted into the through hole 13 of the mask pattern 12 and supplied.

The roller 11 used at this time is closely related to the amount of cream solder supplied to the through hole 13, so
Various types of rollers with different diameters are available, such as a roller 11 with a relatively large diameter as shown in FIG. 1, and a roller 11'' with a relatively small diameter. The length of the roller 11 in the axial direction is determined in relation to the standard size of the mask pattern 12 used, and the key is to stably supply the cream solder 15 to all the through holes 13. The material may be any material as long as it has a length that allows the cream solder 15 to be smoothly supplied to the through hole 13, and may be made of metal, elastic material such as rubber, etc. Appropriate members can be selected and used.

FIG. 2 shows one specific example of the outline of the apparatus configuration used when carrying out the method of the present invention.

According to the figure, the mask pattern 12 is also accurately positioned and placed on the printed circuit board 16 that is placed and fixed on the support base 19, and is supplied onto the mask pattern 12. The cream solder 15 thus formed is spread under pressure by a roller 11 that is disposed so as to be transferable in a partitioned area between the surrounding wall 17 and the mask pattern 12, and at that time, it is printed through the through hole 13 of the mask pattern 12. Cream solder 15 can be supplied directly to the substrate 16 side.

FIG. 3 shows another specific example of the outline of the apparatus configuration used when carrying out the method of the present invention.

According to the figure, the supports 19 are arranged in pairs at regular intervals, and each of these supports 19 has a printed circuit board 16 having the same pattern, the same pattern, or different patterns. Accurately positioned and placed.

On the other hand, the mask pattern 12 is supported so as to be able to reciprocate through an opening 18 provided in the surrounding wall 17, and the movement stroke at this time is determined by the distance a between the pair of supports 19. is set to approximately match. Further, the mask pattern 12 is divided into two sections in relation to the movement stroke, and the arrangement pattern of the through holes 13 in each section is the same as that of the corresponding printed circuit board 1.
This corresponds to the supply pattern of cream solder 15 to 6.

In addition, the reference numeral 14 in the figure indicates a stopper, and 20 indicates the cream solder 1 supplied to the through hole 13 of the mask pattern 12.
5 and 6 are forcibly moved to the printed circuit board 16 side for application.

Since the present invention is configured in this manner, the cream solder 15 is supplied to the through holes 13 of the pattern mask 12 by selecting a roller 11 having a suitable diameter in relation to each through hole 13. It can be done using this. As is clear from FIG. 1, when the diameter of the roller 11' is relatively small, the amount of cream solder 15 supplied at this time is relatively small, although the spreading pressure is relatively small. If a relatively large amount can be taken in and the diameter of the roller 11 is relatively large, the spreading pressure will be relatively large, but a relatively small amount can be taken in. As a result, by selecting and using the roller 11 having a suitable diameter in relation to the supply amount of the cream solder 15, the supply of the cream solder 15 to the through holes 13 of the pattern mask 12 can also be controlled to a viscous degree. This can be done smoothly and reliably.

In addition, in the present invention, the pattern mask 12 is connected to a printed circuit board 1 arranged in pairs as shown in FIG.
6, cream solder 1 is applied to the through holes 13 of the pattern corresponding to one printed circuit board 16 during the forward movement, and to the through holes 13 of the pattern corresponding to the other printed circuit board 16 during the backward movement.
When using a device that is supported so that it can reciprocate against the surrounding wall 17 so that it can supply 5, the stroke of the reciprocating movement (the distance a between the supports 19) is used,
For each printed circuit board 16 prepared separately,
Cream solder 15 can be supplied alternately.

[Advantageous Effects of the Invention 1] As described above, according to the present invention, rollers having a suitable diameter in relation to the amount of supply to the through holes are selectively used for the through holes of the pattern mask. The cream solder can be supplied while being spread, and therefore the cream solder can be supplied to the through holes of the pattern mask reliably and smoothly depending on the degree of viscosity of the cream solder.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing a roller used in the present invention, FIG. 2 is an explanatory diagram showing an outline of an example of an apparatus used for carrying out the method of the present invention, and FIG. 3 is an explanatory diagram schematically showing a roller used in the present invention. FIG. 2 is an explanatory diagram showing an overview of an apparatus as the other side used to implement the method. 11... Roller, 12... Pattern mask, 13... Through hole, 14... Stopper 15... Cream solder, 16... Printed circuit board,
l7... Surrounding wall, 19... Abutment, 21... Tangent. 18...Opening part, 20...Elevating bottle, Fig. Fig. Fig.

Claims (2)

[Claims] (1) A pattern mask is used that has through holes drilled in a pattern that corresponds to the placement position of electronic components mounted on a printed circuit board, and cream solder is supplied to the top surface of this pattern mask. The pattern mask is characterized in that cream solder is spread under pressure using a roller having a diameter selected in relation to the amount of cream solder supplied to the through hole, and is supplied to the through hole. Cream solder supply method. (2) With respect to printed circuit boards arranged in a pair separated from each other, the pattern mask corresponds to the through hole of the pattern corresponding to one printed circuit board when moving forward, and to the other printed circuit board when moving backward. 2. The solder paste according to claim 1, wherein the cream solder is supported so as to be able to reciprocate in order to supply the cream solder to the through holes of the pattern, and the cream solder is pressurized and spread by a roller using the stroke during this reciprocating movement. How to supply cream solder to a pattern mask.