JP5172341B2 - 基板アッセンブリ、多層回路板アッセンブリ、ボール・グリッド・アレーパッケージ、電子アッセンブリ、基板アッセンブリ内の寄生容量を最小にする方法および基板アッセンブリを製造する方法 - Google Patents

基板アッセンブリ、多層回路板アッセンブリ、ボール・グリッド・アレーパッケージ、電子アッセンブリ、基板アッセンブリ内の寄生容量を最小にする方法および基板アッセンブリを製造する方法 Download PDF

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Publication number
JP5172341B2
JP5172341B2 JP2007532322A JP2007532322A JP5172341B2 JP 5172341 B2 JP5172341 B2 JP 5172341B2 JP 2007532322 A JP2007532322 A JP 2007532322A JP 2007532322 A JP2007532322 A JP 2007532322A JP 5172341 B2 JP5172341 B2 JP 5172341B2
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Japan
Prior art keywords
substrate
conductor
assembly
spacer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007532322A
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English (en)
Japanese (ja)
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JP2008513998A5 (enExample
JP2008513998A (ja
Inventor
ヨン，ション−ジョー
アグイレ，フェルナンド
テネケトゲス，ニコラス・ジェイ
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Teradyne Inc
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Teradyne Inc
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Publication date
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2007532322A 2004-09-17 2005-07-27 基板アッセンブリ、多層回路板アッセンブリ、ボール・グリッド・アレーパッケージ、電子アッセンブリ、基板アッセンブリ内の寄生容量を最小にする方法および基板アッセンブリを製造する方法 Expired - Lifetime JP5172341B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/817,785 2004-09-17
US10/817,785 US7388158B2 (en) 2004-09-17 2004-09-17 Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
PCT/US2005/026688 WO2006036282A1 (en) 2004-09-17 2005-07-27 Circuit board assembly with reduced capacitive coupling

Publications (3)

Publication Number Publication Date
JP2008513998A JP2008513998A (ja) 2008-05-01
JP2008513998A5 JP2008513998A5 (enExample) 2012-12-20
JP5172341B2 true JP5172341B2 (ja) 2013-03-27

Family

ID=35482356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007532322A Expired - Lifetime JP5172341B2 (ja) 2004-09-17 2005-07-27 基板アッセンブリ、多層回路板アッセンブリ、ボール・グリッド・アレーパッケージ、電子アッセンブリ、基板アッセンブリ内の寄生容量を最小にする方法および基板アッセンブリを製造する方法

Country Status (6)

Country Link
US (1) US7388158B2 (enExample)
EP (1) EP1795057A1 (enExample)
JP (1) JP5172341B2 (enExample)
KR (1) KR101136423B1 (enExample)
CN (2) CN102638931B (enExample)
WO (1) WO2006036282A1 (enExample)

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US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
US20110139484A1 (en) * 2009-12-15 2011-06-16 Advanced Bionics, Llc Hermetic Electrical Feedthrough
US8487195B2 (en) * 2010-03-04 2013-07-16 Broadcom Corporation Via structure for multi-gigahertz signaling
US10572416B1 (en) * 2016-03-28 2020-02-25 Aquantia Corporation Efficient signaling scheme for high-speed ultra short reach interfaces
KR102362243B1 (ko) 2017-10-18 2022-02-11 삼성전자주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
CN108650777B (zh) * 2018-05-16 2020-10-16 新华三技术有限公司 印制电路板及通信设备
US11855056B1 (en) 2019-03-15 2023-12-26 Eliyan Corporation Low cost solution for 2.5D and 3D packaging using USR chiplets
US11855043B1 (en) 2021-05-06 2023-12-26 Eliyan Corporation Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12438095B1 (en) 2021-05-06 2025-10-07 Eliyan Corp. Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12204794B1 (en) 2021-05-18 2025-01-21 Eliyan Corporation Architecture for DRAM control optimization using simultaneous bidirectional memory interfaces
US11842986B1 (en) 2021-11-25 2023-12-12 Eliyan Corporation Multi-chip module (MCM) with interface adapter circuitry
US12190038B1 (en) 2021-11-25 2025-01-07 Eliyan Corporation Multi-chip module (MCM) with multi-port unified memory
US11841815B1 (en) 2021-12-31 2023-12-12 Eliyan Corporation Chiplet gearbox for low-cost multi-chip module applications
US12248419B1 (en) 2022-05-26 2025-03-11 Eliyan Corporation Interface conversion circuitry for universal chiplet interconnect express (UCIe)
US12058874B1 (en) 2022-12-27 2024-08-06 Eliyan Corporation Universal network-attached memory architecture
US12182040B1 (en) 2023-06-05 2024-12-31 Eliyan Corporation Multi-chip module (MCM) with scalable high bandwidth memory
US12204482B1 (en) 2023-10-09 2025-01-21 Eliyan Corporation Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules
US12248413B1 (en) 2023-10-11 2025-03-11 Eliyan Corporation Universal memory interface utilizing die-to-die (D2D) interfaces between chiplets

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CN2155126Y (zh) * 1993-03-13 1994-02-02 张鹏志 一种新型印制电路板
NL9400261A (nl) * 1994-02-22 1995-10-02 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van een multilayer microwave board alsmede op deze wijze verkregen boards.
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Also Published As

Publication number Publication date
KR20070114692A (ko) 2007-12-04
CN101044801A (zh) 2007-09-26
CN102638931B (zh) 2014-09-24
US7388158B2 (en) 2008-06-17
WO2006036282A1 (en) 2006-04-06
CN102638931A (zh) 2012-08-15
JP2008513998A (ja) 2008-05-01
KR101136423B1 (ko) 2012-04-19
US20060060376A1 (en) 2006-03-23
EP1795057A1 (en) 2007-06-13

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