JP2008513998A5 - - Google Patents

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Publication number
JP2008513998A5
JP2008513998A5 JP2007532322A JP2007532322A JP2008513998A5 JP 2008513998 A5 JP2008513998 A5 JP 2008513998A5 JP 2007532322 A JP2007532322 A JP 2007532322A JP 2007532322 A JP2007532322 A JP 2007532322A JP 2008513998 A5 JP2008513998 A5 JP 2008513998A5
Authority
JP
Japan
Prior art keywords
substrate
conductor
flat
signal path
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007532322A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008513998A (ja
JP5172341B2 (ja
Filing date
Publication date
Priority claimed from US10/817,785 external-priority patent/US7388158B2/en
Application filed filed Critical
Publication of JP2008513998A publication Critical patent/JP2008513998A/ja
Publication of JP2008513998A5 publication Critical patent/JP2008513998A5/ja
Application granted granted Critical
Publication of JP5172341B2 publication Critical patent/JP5172341B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2007532322A 2004-09-17 2005-07-27 基板アッセンブリ、多層回路板アッセンブリ、ボール・グリッド・アレーパッケージ、電子アッセンブリ、基板アッセンブリ内の寄生容量を最小にする方法および基板アッセンブリを製造する方法 Expired - Lifetime JP5172341B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/817,785 2004-09-17
US10/817,785 US7388158B2 (en) 2004-09-17 2004-09-17 Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
PCT/US2005/026688 WO2006036282A1 (en) 2004-09-17 2005-07-27 Circuit board assembly with reduced capacitive coupling

Publications (3)

Publication Number Publication Date
JP2008513998A JP2008513998A (ja) 2008-05-01
JP2008513998A5 true JP2008513998A5 (enExample) 2012-12-20
JP5172341B2 JP5172341B2 (ja) 2013-03-27

Family

ID=35482356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007532322A Expired - Lifetime JP5172341B2 (ja) 2004-09-17 2005-07-27 基板アッセンブリ、多層回路板アッセンブリ、ボール・グリッド・アレーパッケージ、電子アッセンブリ、基板アッセンブリ内の寄生容量を最小にする方法および基板アッセンブリを製造する方法

Country Status (6)

Country Link
US (1) US7388158B2 (enExample)
EP (1) EP1795057A1 (enExample)
JP (1) JP5172341B2 (enExample)
KR (1) KR101136423B1 (enExample)
CN (2) CN102638931B (enExample)
WO (1) WO2006036282A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
US20110139484A1 (en) * 2009-12-15 2011-06-16 Advanced Bionics, Llc Hermetic Electrical Feedthrough
US8487195B2 (en) * 2010-03-04 2013-07-16 Broadcom Corporation Via structure for multi-gigahertz signaling
US10572416B1 (en) * 2016-03-28 2020-02-25 Aquantia Corporation Efficient signaling scheme for high-speed ultra short reach interfaces
KR102362243B1 (ko) * 2017-10-18 2022-02-11 삼성전자주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
CN108650777B (zh) * 2018-05-16 2020-10-16 新华三技术有限公司 印制电路板及通信设备
US11855056B1 (en) 2019-03-15 2023-12-26 Eliyan Corporation Low cost solution for 2.5D and 3D packaging using USR chiplets
US12438095B1 (en) 2021-05-06 2025-10-07 Eliyan Corp. Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US11855043B1 (en) 2021-05-06 2023-12-26 Eliyan Corporation Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12204794B1 (en) 2021-05-18 2025-01-21 Eliyan Corporation Architecture for DRAM control optimization using simultaneous bidirectional memory interfaces
US11842986B1 (en) 2021-11-25 2023-12-12 Eliyan Corporation Multi-chip module (MCM) with interface adapter circuitry
US12190038B1 (en) 2021-11-25 2025-01-07 Eliyan Corporation Multi-chip module (MCM) with multi-port unified memory
US11841815B1 (en) 2021-12-31 2023-12-12 Eliyan Corporation Chiplet gearbox for low-cost multi-chip module applications
US12248419B1 (en) 2022-05-26 2025-03-11 Eliyan Corporation Interface conversion circuitry for universal chiplet interconnect express (UCIe)
US12058874B1 (en) 2022-12-27 2024-08-06 Eliyan Corporation Universal network-attached memory architecture
US12182040B1 (en) 2023-06-05 2024-12-31 Eliyan Corporation Multi-chip module (MCM) with scalable high bandwidth memory
US12204482B1 (en) 2023-10-09 2025-01-21 Eliyan Corporation Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules
US12204468B1 (en) 2023-10-11 2025-01-21 Eliyan Corporation Universal memory interface with dynamic bidirectional data transfers

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377393A (ja) * 1989-08-21 1991-04-02 Ok Print:Kk 配線基板装置
CN2155126Y (zh) * 1993-03-13 1994-02-02 张鹏志 一种新型印制电路板
NL9400261A (nl) * 1994-02-22 1995-10-02 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van een multilayer microwave board alsmede op deze wijze verkregen boards.
JPH10107391A (ja) * 1996-09-30 1998-04-24 O K Print:Kk 配線基板および配線基板用基材
JP3737597B2 (ja) * 1997-02-07 2006-01-18 日本特殊陶業株式会社 フリップチップ実装用配線基板
JPH1174645A (ja) * 1997-08-29 1999-03-16 Sumitomo Kinzoku Electro Device:Kk 多層セラミック基板の製造方法
US6137062A (en) * 1998-05-11 2000-10-24 Motorola, Inc. Ball grid array with recessed solder balls
US6456502B1 (en) * 1998-09-21 2002-09-24 Compaq Computer Corporation Integrated circuit device/circuit board connection apparatus
JP4204150B2 (ja) 1998-10-16 2009-01-07 パナソニック株式会社 多層回路基板
JP2001308547A (ja) 2000-04-27 2001-11-02 Sharp Corp 高周波多層回路基板
US6834426B1 (en) * 2000-07-25 2004-12-28 International Business Machines Corporation Method of fabricating a laminate circuit structure
JP3546823B2 (ja) * 2000-09-07 2004-07-28 インターナショナル・ビジネス・マシーンズ・コーポレーション スルーホール構造および該スルーホール構造を含むプリント基板
JP2002353588A (ja) * 2001-05-29 2002-12-06 Mitsubishi Electric Corp 配線基板及び配線基板の製造方法
WO2003067711A2 (en) * 2001-10-10 2003-08-14 Molex Incorporated High speed differential signal edge card connector circuit board layouts
JP2003309378A (ja) * 2002-04-18 2003-10-31 Mitsubishi Electric Corp 信号伝送用多層配線板
US6828513B2 (en) 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
US7271349B2 (en) * 2002-09-04 2007-09-18 Intel Corporation Via shielding for power/ground layers on printed circuit board
US6753679B1 (en) * 2002-12-23 2004-06-22 Nortel Networks Limited Test point monitor using embedded passive resistance
WO2004107830A1 (ja) * 2003-06-02 2004-12-09 Nec Corporation プリント回路基板用コンパクトビア伝送路およびその設計方法
US7141742B2 (en) * 2003-07-17 2006-11-28 Hewlett-Packard Development Company, L.P. Alternating voided areas of anti-pads
US7348498B2 (en) * 2003-07-17 2008-03-25 Hewlett-Packard Development Company, L.P. Partially voided anti-pads

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