JP2011512683A5 - - Google Patents
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- Publication number
- JP2011512683A5 JP2011512683A5 JP2010547042A JP2010547042A JP2011512683A5 JP 2011512683 A5 JP2011512683 A5 JP 2011512683A5 JP 2010547042 A JP2010547042 A JP 2010547042A JP 2010547042 A JP2010547042 A JP 2010547042A JP 2011512683 A5 JP2011512683 A5 JP 2011512683A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- region
- electrical contact
- emitting device
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005266 casting Methods 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008010510 | 2008-02-22 | ||
| DE102008010510.4 | 2008-02-22 | ||
| DE102008014927A DE102008014927A1 (de) | 2008-02-22 | 2008-03-19 | Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement |
| DE102008014927.6 | 2008-03-19 | ||
| PCT/DE2009/000249 WO2009103283A1 (de) | 2008-02-22 | 2009-02-19 | Verfahren zur herstellung einer mehrzahl von strahlungsemittierenden bauelementen und strahlungsemittierendes bauelement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011512683A JP2011512683A (ja) | 2011-04-21 |
| JP2011512683A5 true JP2011512683A5 (enExample) | 2011-12-15 |
| JP5579080B2 JP5579080B2 (ja) | 2014-08-27 |
Family
ID=40896796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010547042A Expired - Fee Related JP5579080B2 (ja) | 2008-02-22 | 2009-02-19 | 複数のビーム放射構成素子を作製する方法およびビーム放射構成素子 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8790939B2 (enExample) |
| EP (1) | EP2255396B1 (enExample) |
| JP (1) | JP5579080B2 (enExample) |
| KR (1) | KR101525638B1 (enExample) |
| CN (1) | CN101946339B (enExample) |
| DE (1) | DE102008014927A1 (enExample) |
| TW (1) | TW200947765A (enExample) |
| WO (1) | WO2009103283A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012008637A1 (de) | 2012-05-02 | 2013-11-07 | Heraeus Noblelight Gmbh | Optisches Modul mit Ausformung zur Montage |
| DE102012025826B3 (de) * | 2012-05-02 | 2020-09-24 | Heraeus Noblelight Gmbh | Optisches Modul mit Ausformung zur Montage |
| JP6176302B2 (ja) * | 2015-01-30 | 2017-08-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| DE102015105661B4 (de) | 2015-04-14 | 2022-04-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Vorrichtung mit einer Mischung aufweisend ein Silikon und ein fluor-organisches Additiv |
| JP6925100B2 (ja) * | 2015-05-21 | 2021-08-25 | 日亜化学工業株式会社 | 発光装置 |
| TWI585844B (zh) * | 2015-09-25 | 2017-06-01 | 光寶光電（常州）有限公司 | 發光二極體封裝結構及其製造方法 |
| DE102017117548A1 (de) * | 2017-08-02 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| DE102017117550A1 (de) * | 2017-08-02 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| CN114242601B (zh) * | 2021-11-30 | 2025-09-05 | 北京卫星制造厂有限公司 | 一种用于igbt模块的密封方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3604108B2 (ja) | 1997-02-17 | 2004-12-22 | 株式会社シチズン電子 | チップ型光半導体の製造方法 |
| JPH1174410A (ja) * | 1997-08-28 | 1999-03-16 | Citizen Electron Co Ltd | 表面実装型チップ部品及びその製造方法 |
| JP3497722B2 (ja) * | 1998-02-27 | 2004-02-16 | 富士通株式会社 | 半導体装置及びその製造方法及びその搬送トレイ |
| JP2000183218A (ja) * | 1998-12-14 | 2000-06-30 | Mitsumi Electric Co Ltd | Ｉｃパッケージの製造方法 |
| JP3455762B2 (ja) * | 1999-11-11 | 2003-10-14 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| DE10008203B4 (de) * | 2000-02-23 | 2008-02-07 | Vishay Semiconductor Gmbh | Verfahren zum Herstellen elektronischer Halbleiterbauelemente |
| US6345903B1 (en) * | 2000-09-01 | 2002-02-12 | Citizen Electronics Co., Ltd. | Surface-mount type emitting diode and method of manufacturing same |
| MY131962A (en) * | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| JP2003179269A (ja) * | 2001-01-24 | 2003-06-27 | Nichia Chem Ind Ltd | 光半導体素子 |
| JP4789350B2 (ja) * | 2001-06-11 | 2011-10-12 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
| JP3844196B2 (ja) * | 2001-06-12 | 2006-11-08 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
| JP2003031526A (ja) * | 2001-07-16 | 2003-01-31 | Mitsumi Electric Co Ltd | モジュールの製造方法及びモジュール |
| US6743699B1 (en) * | 2003-01-21 | 2004-06-01 | Micron Technology, Inc. | Method of fabricating semiconductor components |
| JP2004319530A (ja) * | 2003-02-28 | 2004-11-11 | Sanyo Electric Co Ltd | 光半導体装置およびその製造方法 |
| JP2005051150A (ja) * | 2003-07-31 | 2005-02-24 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| WO2005106978A1 (ja) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Industrial Co., Ltd. | 発光装置およびその製造方法 |
| US7087463B2 (en) * | 2004-08-04 | 2006-08-08 | Gelcore, Llc | Laser separation of encapsulated submount |
| JP4747704B2 (ja) | 2005-07-20 | 2011-08-17 | 豊田合成株式会社 | 蛍光体層付き発光装置の製造方法 |
| US7842526B2 (en) * | 2004-09-09 | 2010-11-30 | Toyoda Gosei Co., Ltd. | Light emitting device and method of producing same |
| JP5128047B2 (ja) | 2004-10-07 | 2013-01-23 | Ｔｏｗａ株式会社 | 光デバイス及び光デバイスの生産方法 |
| TW200637033A (en) * | 2004-11-22 | 2006-10-16 | Matsushita Electric Industrial Co Ltd | Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device |
| JP2007165789A (ja) * | 2005-12-16 | 2007-06-28 | Olympus Corp | 半導体装置の製造方法 |
| JP2007184426A (ja) * | 2006-01-06 | 2007-07-19 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP4838005B2 (ja) * | 2006-02-20 | 2011-12-14 | 京セラ株式会社 | 発光装置 |
| JP2007324205A (ja) | 2006-05-30 | 2007-12-13 | Toyoda Gosei Co Ltd | 発光装置 |
| US7816769B2 (en) * | 2006-08-28 | 2010-10-19 | Atmel Corporation | Stackable packages for three-dimensional packaging of semiconductor dice |
| US7883810B2 (en) * | 2006-11-09 | 2011-02-08 | GM Global Technology Operations LLC | Slow purge for improved water removal, freeze durability, purge energy efficiency and voltage degradation due to shutdown/startup cycling |
| JP4343962B2 (ja) * | 2007-01-19 | 2009-10-14 | Ｏｋｉセミコンダクタ株式会社 | 半導体装置の製造方法及び半導体装置 |
| US7923846B2 (en) * | 2007-11-16 | 2011-04-12 | Stats Chippac Ltd. | Integrated circuit package-in-package system with wire-in-film encapsulant |
-
2008
- 2008-03-19 DE DE102008014927A patent/DE102008014927A1/de not_active Withdrawn
-
2009
- 2009-02-11 TW TW098104275A patent/TW200947765A/zh unknown
- 2009-02-19 CN CN2009801060204A patent/CN101946339B/zh not_active Expired - Fee Related
- 2009-02-19 JP JP2010547042A patent/JP5579080B2/ja not_active Expired - Fee Related
- 2009-02-19 EP EP09712047.1A patent/EP2255396B1/de not_active Not-in-force
- 2009-02-19 WO PCT/DE2009/000249 patent/WO2009103283A1/de not_active Ceased
- 2009-02-19 US US12/918,364 patent/US8790939B2/en not_active Expired - Fee Related
- 2009-02-19 KR KR1020107020192A patent/KR101525638B1/ko not_active Expired - Fee Related