TW200947765A - Method for producing a plurality of radiation-emitting components and radiation-emitting component - Google Patents

Method for producing a plurality of radiation-emitting components and radiation-emitting component Download PDF

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Publication number
TW200947765A
TW200947765A TW098104275A TW98104275A TW200947765A TW 200947765 A TW200947765 A TW 200947765A TW 098104275 A TW098104275 A TW 098104275A TW 98104275 A TW98104275 A TW 98104275A TW 200947765 A TW200947765 A TW 200947765A
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TW
Taiwan
Prior art keywords
layer
interlayer
hardness
separation
carrier layer
Prior art date
Application number
TW098104275A
Other languages
English (en)
Chinese (zh)
Inventor
Stephan Preub
Harald Jager
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200947765A publication Critical patent/TW200947765A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Led Device Packages (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW098104275A 2008-02-22 2009-02-11 Method for producing a plurality of radiation-emitting components and radiation-emitting component TW200947765A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008010510 2008-02-22
DE102008014927A DE102008014927A1 (de) 2008-02-22 2008-03-19 Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement

Publications (1)

Publication Number Publication Date
TW200947765A true TW200947765A (en) 2009-11-16

Family

ID=40896796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104275A TW200947765A (en) 2008-02-22 2009-02-11 Method for producing a plurality of radiation-emitting components and radiation-emitting component

Country Status (8)

Country Link
US (1) US8790939B2 (enExample)
EP (1) EP2255396B1 (enExample)
JP (1) JP5579080B2 (enExample)
KR (1) KR101525638B1 (enExample)
CN (1) CN101946339B (enExample)
DE (1) DE102008014927A1 (enExample)
TW (1) TW200947765A (enExample)
WO (1) WO2009103283A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008637A1 (de) 2012-05-02 2013-11-07 Heraeus Noblelight Gmbh Optisches Modul mit Ausformung zur Montage
DE102012025826B3 (de) * 2012-05-02 2020-09-24 Heraeus Noblelight Gmbh Optisches Modul mit Ausformung zur Montage
JP6176302B2 (ja) * 2015-01-30 2017-08-09 日亜化学工業株式会社 発光装置の製造方法
DE102015105661B4 (de) 2015-04-14 2022-04-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Vorrichtung mit einer Mischung aufweisend ein Silikon und ein fluor-organisches Additiv
JP6925100B2 (ja) * 2015-05-21 2021-08-25 日亜化学工業株式会社 発光装置
TWI585844B (zh) * 2015-09-25 2017-06-01 光寶光電（常州）有限公司 發光二極體封裝結構及其製造方法
DE102017117548A1 (de) * 2017-08-02 2019-02-07 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102017117550A1 (de) * 2017-08-02 2019-02-07 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
CN114242601B (zh) * 2021-11-30 2025-09-05 北京卫星制造厂有限公司 一种用于igbt模块的密封方法

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Also Published As

Publication number Publication date
JP2011512683A (ja) 2011-04-21
JP5579080B2 (ja) 2014-08-27
CN101946339B (zh) 2012-08-29
KR20100127220A (ko) 2010-12-03
EP2255396A1 (de) 2010-12-01
WO2009103283A1 (de) 2009-08-27
EP2255396B1 (de) 2018-08-29
US8790939B2 (en) 2014-07-29
KR101525638B1 (ko) 2015-06-03
CN101946339A (zh) 2011-01-12
US20110127564A1 (en) 2011-06-02
DE102008014927A1 (de) 2009-08-27

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