JP2007035574A5 - - Google Patents

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Publication number
JP2007035574A5
JP2007035574A5 JP2005221026A JP2005221026A JP2007035574A5 JP 2007035574 A5 JP2007035574 A5 JP 2007035574A5 JP 2005221026 A JP2005221026 A JP 2005221026A JP 2005221026 A JP2005221026 A JP 2005221026A JP 2007035574 A5 JP2007035574 A5 JP 2007035574A5
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JP
Japan
Prior art keywords
fine particles
particle
conductive
substrate
projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005221026A
Other languages
English (en)
Japanese (ja)
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JP2007035574A (ja
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Publication date
Application filed filed Critical
Priority to JP2005221026A priority Critical patent/JP2007035574A/ja
Priority claimed from JP2005221026A external-priority patent/JP2007035574A/ja
Publication of JP2007035574A publication Critical patent/JP2007035574A/ja
Publication of JP2007035574A5 publication Critical patent/JP2007035574A5/ja
Pending legal-status Critical Current

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JP2005221026A 2005-07-29 2005-07-29 導電性微粒子、異方性導電材料、及び、接続構造体 Pending JP2007035574A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005221026A JP2007035574A (ja) 2005-07-29 2005-07-29 導電性微粒子、異方性導電材料、及び、接続構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005221026A JP2007035574A (ja) 2005-07-29 2005-07-29 導電性微粒子、異方性導電材料、及び、接続構造体

Publications (2)

Publication Number Publication Date
JP2007035574A JP2007035574A (ja) 2007-02-08
JP2007035574A5 true JP2007035574A5 (enExample) 2008-05-15

Family

ID=37794556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005221026A Pending JP2007035574A (ja) 2005-07-29 2005-07-29 導電性微粒子、異方性導電材料、及び、接続構造体

Country Status (1)

Country Link
JP (1) JP2007035574A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049609B1 (ko) * 2005-11-18 2011-07-14 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 접속 구조 및 회로부재의접속방법
CN102474024B (zh) * 2009-07-02 2014-09-17 日立化成株式会社 导电粒子
CN103827981A (zh) * 2011-09-22 2014-05-28 株式会社日本触媒 导电性微粒及含有导电性微粒的各向异性导电材料
JP5902717B2 (ja) * 2011-12-08 2016-04-13 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料
JP6231374B2 (ja) * 2012-12-31 2017-11-15 株式会社ドクサンハイメタル タッチスクリーンパネル用導電粒子、およびこれを含む導電材料
CN112740483B (zh) * 2018-10-03 2023-07-14 迪睿合株式会社 各向异性导电薄膜、连接结构体、连接结构体的制备方法
WO2020071271A1 (ja) * 2018-10-03 2020-04-09 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4387175B2 (ja) * 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体

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