JP2010531044A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010531044A5 JP2010531044A5 JP2010513404A JP2010513404A JP2010531044A5 JP 2010531044 A5 JP2010531044 A5 JP 2010531044A5 JP 2010513404 A JP2010513404 A JP 2010513404A JP 2010513404 A JP2010513404 A JP 2010513404A JP 2010531044 A5 JP2010531044 A5 JP 2010531044A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- diffusion inhibitor
- paste
- insulating layer
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 claims 15
- 238000009792 diffusion process Methods 0.000 claims 11
- 239000003112 inhibitor Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 9
- 229910052751 metal Inorganic materials 0.000 claims 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 6
- 239000000843 powder Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 2
- 229910002555 FeNi Inorganic materials 0.000 claims 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000010935 stainless steel Substances 0.000 claims 2
- 229910001220 stainless steel Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/820,986 US20080318061A1 (en) | 2007-06-20 | 2007-06-20 | Insulation paste for a metal core substrate and electronic device |
| PCT/US2008/067465 WO2008157675A1 (en) | 2007-06-20 | 2008-06-19 | Insulation paste for a metal core substrate and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010531044A JP2010531044A (ja) | 2010-09-16 |
| JP2010531044A5 true JP2010531044A5 (enExample) | 2011-08-11 |
Family
ID=39789918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010513404A Withdrawn JP2010531044A (ja) | 2007-06-20 | 2008-06-19 | 金属コア基板および電子デバイスのための絶縁ペースト |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20080318061A1 (enExample) |
| EP (1) | EP2155618A1 (enExample) |
| JP (1) | JP2010531044A (enExample) |
| KR (1) | KR20100021663A (enExample) |
| CN (1) | CN101679107A (enExample) |
| TW (1) | TW200914391A (enExample) |
| WO (1) | WO2008157675A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009128527A1 (ja) * | 2008-04-18 | 2009-10-22 | 日本電気硝子株式会社 | 色素増感型太陽電池用ガラス組成物および色素増感型太陽電池用材料 |
| US20110094584A1 (en) * | 2008-06-17 | 2011-04-28 | Nippon Electric Glass Co., Ltd. | Solar cell substrate and oxide semiconductor electrode for dye-sensitized solar cell |
| WO2010026952A1 (ja) * | 2008-09-04 | 2010-03-11 | 日本電気硝子株式会社 | 電極形成用ガラス組成物および電極形成材料 |
| JP5532512B2 (ja) * | 2009-02-24 | 2014-06-25 | 日本電気硝子株式会社 | 電極形成用ガラス組成物および電極形成材料 |
| JP2011044426A (ja) | 2009-07-24 | 2011-03-03 | Nippon Electric Glass Co Ltd | 太陽電池用導電膜付ガラス基板 |
| AT512525B1 (de) | 2012-05-04 | 2013-09-15 | Mikroelektronik Ges Mit Beschraenkter Haftung Ab | Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat |
| JP6829665B2 (ja) * | 2017-07-10 | 2021-02-10 | 新光電気工業株式会社 | リードフレーム、半導体装置、及びリードフレームの製造方法 |
| JP6787286B2 (ja) | 2017-09-20 | 2020-11-18 | 株式会社村田製作所 | インダクタ部品の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1171784A (en) * | 1966-11-17 | 1969-11-26 | English Electric Co Ltd | Improvements in or relating to Processes for Forming an Insulating Coating on a Metal, and to Coated Metals. |
| CS219732B1 (en) * | 1981-01-21 | 1983-03-25 | Radomir Kuzel | Method of making the isolation coatings on the steel products |
| NL8100816A (nl) * | 1981-02-19 | 1982-09-16 | Philips Nv | Draadgewonden weerstand. |
| US4556598A (en) * | 1983-06-16 | 1985-12-03 | Cts Corporation | Porcelain tape for producing porcelainized metal substrates |
| EP0247575B1 (en) * | 1986-05-30 | 1993-07-21 | Furukawa Denki Kogyo Kabushiki Kaisha | Multilayer printed wiring board and method for producing the same |
| US5002818A (en) * | 1989-09-05 | 1991-03-26 | Hughes Aircraft Company | Reworkable epoxy die-attach adhesive |
| US6233817B1 (en) * | 1999-01-17 | 2001-05-22 | Delphi Technologies, Inc. | Method of forming thick-film hybrid circuit on a metal circuit board |
| EP1293492A1 (en) * | 1999-12-16 | 2003-03-19 | Tokuyama Corporation | Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same |
| JP2004175645A (ja) * | 2002-11-29 | 2004-06-24 | Asahi Glass Co Ltd | ガラスフリット混合物、電子回路基板製造方法および電子回路基板 |
| JP4407199B2 (ja) * | 2003-08-13 | 2010-02-03 | 旭硝子株式会社 | 結晶化無鉛ガラス、ガラスセラミックス組成物、グリーンシートおよび電子回路基板 |
-
2007
- 2007-06-20 US US11/820,986 patent/US20080318061A1/en not_active Abandoned
-
2008
- 2008-06-19 WO PCT/US2008/067465 patent/WO2008157675A1/en not_active Ceased
- 2008-06-19 EP EP08771449A patent/EP2155618A1/en not_active Withdrawn
- 2008-06-19 JP JP2010513404A patent/JP2010531044A/ja not_active Withdrawn
- 2008-06-19 KR KR1020107001225A patent/KR20100021663A/ko not_active Ceased
- 2008-06-19 CN CN200880018049.2A patent/CN101679107A/zh active Pending
- 2008-06-20 TW TW097123260A patent/TW200914391A/zh unknown
-
2010
- 2010-04-27 US US12/768,202 patent/US20100200283A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010531044A5 (enExample) | ||
| JP2011523492A5 (enExample) | ||
| JP2011501866A5 (enExample) | ||
| JP2011502330A5 (enExample) | ||
| JP2012038996A5 (enExample) | ||
| JP2011035387A5 (ja) | 半導体装置の作製方法 | |
| JP2006302891A5 (enExample) | ||
| JP2009105393A5 (enExample) | ||
| JP2013521207A5 (enExample) | ||
| JP2009104842A5 (enExample) | ||
| JP2011003544A5 (enExample) | ||
| JP2012134329A5 (enExample) | ||
| JP2006344939A5 (enExample) | ||
| JP2011023574A5 (enExample) | ||
| JP2012043622A5 (enExample) | ||
| JP2014526807A5 (enExample) | ||
| JP2019509237A (ja) | 金属又は金属ハイブリッド箔によって接合された厚膜ペースト介在セラミックス | |
| JP2014501448A5 (enExample) | ||
| JP2013247036A5 (enExample) | ||
| JP2014503783A5 (enExample) | ||
| JP2006344582A5 (enExample) | ||
| CN102187414B (zh) | 埋入式电容器及其制造方法 | |
| CN103887012A (zh) | 一种石墨烯导线的生产方法 | |
| JP4881192B2 (ja) | 電子部品の製造方法 | |
| JP2009177180A (ja) | 印刷回路基板用抵抗積層導電体及びその製造方法、並びに印刷回路基板 |