JP2008277749A5 - - Google Patents

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Publication number
JP2008277749A5
JP2008277749A5 JP2008026597A JP2008026597A JP2008277749A5 JP 2008277749 A5 JP2008277749 A5 JP 2008277749A5 JP 2008026597 A JP2008026597 A JP 2008026597A JP 2008026597 A JP2008026597 A JP 2008026597A JP 2008277749 A5 JP2008277749 A5 JP 2008277749A5
Authority
JP
Japan
Prior art keywords
layer
wiring
alloy
before symbol
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008026597A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008277749A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008026597A priority Critical patent/JP2008277749A/ja
Priority claimed from JP2008026597A external-priority patent/JP2008277749A/ja
Priority to KR1020080028198A priority patent/KR20080090285A/ko
Priority to TW97111694A priority patent/TW200841793A/zh
Priority to US12/059,223 priority patent/US20080239684A1/en
Publication of JP2008277749A publication Critical patent/JP2008277749A/ja
Publication of JP2008277749A5 publication Critical patent/JP2008277749A5/ja
Pending legal-status Critical Current

Links

JP2008026597A 2007-04-02 2008-02-06 配線基板およびその製造方法 Pending JP2008277749A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008026597A JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法
KR1020080028198A KR20080090285A (ko) 2007-04-02 2008-03-27 배선 기판 및 그 제조 방법
TW97111694A TW200841793A (en) 2007-04-02 2008-03-31 Wiring board and method of manufacturing the same
US12/059,223 US20080239684A1 (en) 2007-04-02 2008-03-31 Wiring board and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007096527 2007-04-02
JP2008026597A JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2008277749A JP2008277749A (ja) 2008-11-13
JP2008277749A5 true JP2008277749A5 (enExample) 2011-02-10

Family

ID=40014827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008026597A Pending JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法

Country Status (4)

Country Link
JP (1) JP2008277749A (enExample)
KR (1) KR20080090285A (enExample)
CN (1) CN101282620A (enExample)
TW (1) TW200841793A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101194461B1 (ko) 2011-09-22 2012-10-24 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2013084987A (ja) * 2013-01-10 2013-05-09 Denso Corp 配線基板の製造方法
KR20160080526A (ko) * 2014-12-29 2016-07-08 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20180133153A (ko) * 2017-06-05 2018-12-13 삼성전기주식회사 코일 부품 및 그 제조방법
KR20190031838A (ko) 2017-09-18 2019-03-27 주식회사 아모그린텍 박막 회로 기판 및 이의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2879746B2 (ja) * 1989-11-07 1999-04-05 カシオ計算機株式会社 半導体パネル
JPH03155134A (ja) * 1989-11-13 1991-07-03 Seiko Epson Corp 集積回路装置の配線電極
JP2004243701A (ja) * 2003-02-14 2004-09-02 Toyo Kohan Co Ltd 合金層積層体および合金層積層体を用いた部品
JP2005129899A (ja) * 2003-08-28 2005-05-19 Kyocera Corp 配線基板および半導体装置
JP4817733B2 (ja) * 2005-07-06 2011-11-16 富士通株式会社 金属表面処理液、積層体および積層体の製造方法

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