JP2018195702A5 - - Google Patents
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- Publication number
- JP2018195702A5 JP2018195702A5 JP2017098311A JP2017098311A JP2018195702A5 JP 2018195702 A5 JP2018195702 A5 JP 2018195702A5 JP 2017098311 A JP2017098311 A JP 2017098311A JP 2017098311 A JP2017098311 A JP 2017098311A JP 2018195702 A5 JP2018195702 A5 JP 2018195702A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- wiring layer
- via hole
- surface roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003746 surface roughness Effects 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 239000010949 copper Substances 0.000 claims 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 2
- 235000019253 formic acid Nutrition 0.000 claims 2
- 238000007788 roughening Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017098311A JP6894289B2 (ja) | 2017-05-17 | 2017-05-17 | 配線基板及びその製造方法 |
| US15/978,500 US10297540B2 (en) | 2017-05-17 | 2018-05-14 | Wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017098311A JP6894289B2 (ja) | 2017-05-17 | 2017-05-17 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018195702A JP2018195702A (ja) | 2018-12-06 |
| JP2018195702A5 true JP2018195702A5 (enExample) | 2020-01-30 |
| JP6894289B2 JP6894289B2 (ja) | 2021-06-30 |
Family
ID=64271965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017098311A Active JP6894289B2 (ja) | 2017-05-17 | 2017-05-17 | 配線基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10297540B2 (enExample) |
| JP (1) | JP6894289B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102145204B1 (ko) * | 2018-08-30 | 2020-08-18 | 삼성전자주식회사 | 반도체 패키지 |
| KR102543186B1 (ko) * | 2018-11-23 | 2023-06-14 | 삼성전자주식회사 | 반도체 패키지 |
| JP7261567B2 (ja) * | 2018-11-26 | 2023-04-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| KR102724892B1 (ko) * | 2018-12-04 | 2024-11-01 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11243277A (ja) * | 1998-02-26 | 1999-09-07 | Ibiden Co Ltd | フィルドビア構造を有する多層プリント配線板 |
| EP1583407B1 (en) * | 1998-02-26 | 2007-05-30 | Ibiden Co., Ltd. | Multilayer printed wiring board with filled viaholes |
| JP2000244127A (ja) | 1998-12-24 | 2000-09-08 | Ngk Spark Plug Co Ltd | 配線基板および配線基板の製造方法 |
| US6674017B1 (en) | 1998-12-24 | 2004-01-06 | Ngk Spark Plug Co., Ltd. | Multilayer-wiring substrate and method for fabricating same |
| JP4464790B2 (ja) * | 1998-12-24 | 2010-05-19 | 日本特殊陶業株式会社 | 配線基板の製造方法 |
| JP2001085846A (ja) | 1999-09-16 | 2001-03-30 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
| JP2003188541A (ja) * | 2001-12-19 | 2003-07-04 | Kyocera Corp | 配線基板の製造方法 |
| JP6358887B2 (ja) * | 2014-07-31 | 2018-07-18 | 新光電気工業株式会社 | 支持体、配線基板及びその製造方法、半導体パッケージの製造方法 |
| JP6156479B2 (ja) * | 2015-12-21 | 2017-07-05 | 日立化成株式会社 | 接着フィルム、該接着フィルムを用いた多層プリント配線板、及び該多層プリント配線板の製造方法 |
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2017
- 2017-05-17 JP JP2017098311A patent/JP6894289B2/ja active Active
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2018
- 2018-05-14 US US15/978,500 patent/US10297540B2/en active Active