KR20080090285A - 배선 기판 및 그 제조 방법 - Google Patents

배선 기판 및 그 제조 방법 Download PDF

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Publication number
KR20080090285A
KR20080090285A KR1020080028198A KR20080028198A KR20080090285A KR 20080090285 A KR20080090285 A KR 20080090285A KR 1020080028198 A KR1020080028198 A KR 1020080028198A KR 20080028198 A KR20080028198 A KR 20080028198A KR 20080090285 A KR20080090285 A KR 20080090285A
Authority
KR
South Korea
Prior art keywords
layer
nickel
copper
wiring
seed layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020080028198A
Other languages
English (en)
Korean (ko)
Inventor
도모오 야마사키
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20080090285A publication Critical patent/KR20080090285A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
KR1020080028198A 2007-04-02 2008-03-27 배선 기판 및 그 제조 방법 Withdrawn KR20080090285A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00096527 2007-04-02
JP2007096527 2007-04-02
JP2008026597A JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法
JPJP-P-2008-00026597 2008-02-06

Publications (1)

Publication Number Publication Date
KR20080090285A true KR20080090285A (ko) 2008-10-08

Family

ID=40014827

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080028198A Withdrawn KR20080090285A (ko) 2007-04-02 2008-03-27 배선 기판 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP2008277749A (enExample)
KR (1) KR20080090285A (enExample)
CN (1) CN101282620A (enExample)
TW (1) TW200841793A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019054781A1 (ko) * 2017-09-18 2019-03-21 주식회사 아모그린텍 박막 회로 기판 및 이의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101194461B1 (ko) 2011-09-22 2012-10-24 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2013084987A (ja) * 2013-01-10 2013-05-09 Denso Corp 配線基板の製造方法
KR20160080526A (ko) * 2014-12-29 2016-07-08 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20180133153A (ko) * 2017-06-05 2018-12-13 삼성전기주식회사 코일 부품 및 그 제조방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2879746B2 (ja) * 1989-11-07 1999-04-05 カシオ計算機株式会社 半導体パネル
JPH03155134A (ja) * 1989-11-13 1991-07-03 Seiko Epson Corp 集積回路装置の配線電極
JP2004243701A (ja) * 2003-02-14 2004-09-02 Toyo Kohan Co Ltd 合金層積層体および合金層積層体を用いた部品
JP2005129899A (ja) * 2003-08-28 2005-05-19 Kyocera Corp 配線基板および半導体装置
JP4817733B2 (ja) * 2005-07-06 2011-11-16 富士通株式会社 金属表面処理液、積層体および積層体の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019054781A1 (ko) * 2017-09-18 2019-03-21 주식회사 아모그린텍 박막 회로 기판 및 이의 제조 방법
CN111096086A (zh) * 2017-09-18 2020-05-01 阿莫绿色技术有限公司 薄膜电路基板及其制造方法
US11543748B2 (en) 2017-09-18 2023-01-03 Amogreentech Co., Ltd. Thin film circuit substrate and manufacturing method thereof
CN111096086B (zh) * 2017-09-18 2023-05-02 阿莫绿色技术有限公司 薄膜电路基板及其制造方法

Also Published As

Publication number Publication date
CN101282620A (zh) 2008-10-08
JP2008277749A (ja) 2008-11-13
TW200841793A (en) 2008-10-16

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20080327

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid