JP2008277749A - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法 Download PDF

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Publication number
JP2008277749A
JP2008277749A JP2008026597A JP2008026597A JP2008277749A JP 2008277749 A JP2008277749 A JP 2008277749A JP 2008026597 A JP2008026597 A JP 2008026597A JP 2008026597 A JP2008026597 A JP 2008026597A JP 2008277749 A JP2008277749 A JP 2008277749A
Authority
JP
Japan
Prior art keywords
layer
wiring
adhesion
alloy
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008026597A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008277749A5 (enExample
Inventor
Tomoo Yamazaki
智生 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008026597A priority Critical patent/JP2008277749A/ja
Priority to KR1020080028198A priority patent/KR20080090285A/ko
Priority to TW97111694A priority patent/TW200841793A/zh
Priority to US12/059,223 priority patent/US20080239684A1/en
Publication of JP2008277749A publication Critical patent/JP2008277749A/ja
Publication of JP2008277749A5 publication Critical patent/JP2008277749A5/ja
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
JP2008026597A 2007-04-02 2008-02-06 配線基板およびその製造方法 Pending JP2008277749A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008026597A JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法
KR1020080028198A KR20080090285A (ko) 2007-04-02 2008-03-27 배선 기판 및 그 제조 방법
TW97111694A TW200841793A (en) 2007-04-02 2008-03-31 Wiring board and method of manufacturing the same
US12/059,223 US20080239684A1 (en) 2007-04-02 2008-03-31 Wiring board and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007096527 2007-04-02
JP2008026597A JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2008277749A true JP2008277749A (ja) 2008-11-13
JP2008277749A5 JP2008277749A5 (enExample) 2011-02-10

Family

ID=40014827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008026597A Pending JP2008277749A (ja) 2007-04-02 2008-02-06 配線基板およびその製造方法

Country Status (4)

Country Link
JP (1) JP2008277749A (enExample)
KR (1) KR20080090285A (enExample)
CN (1) CN101282620A (enExample)
TW (1) TW200841793A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101194461B1 (ko) 2011-09-22 2012-10-24 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2013084987A (ja) * 2013-01-10 2013-05-09 Denso Corp 配線基板の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160080526A (ko) * 2014-12-29 2016-07-08 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20180133153A (ko) * 2017-06-05 2018-12-13 삼성전기주식회사 코일 부품 및 그 제조방법
KR20190031838A (ko) 2017-09-18 2019-03-27 주식회사 아모그린텍 박막 회로 기판 및 이의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03152806A (ja) * 1989-11-07 1991-06-28 Casio Comput Co Ltd 半導体パネル
JPH03155134A (ja) * 1989-11-13 1991-07-03 Seiko Epson Corp 集積回路装置の配線電極
JP2004243701A (ja) * 2003-02-14 2004-09-02 Toyo Kohan Co Ltd 合金層積層体および合金層積層体を用いた部品
JP2005129899A (ja) * 2003-08-28 2005-05-19 Kyocera Corp 配線基板および半導体装置
JP2007016105A (ja) * 2005-07-06 2007-01-25 Fujitsu Ltd 金属表面処理液、積層体および積層体の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03152806A (ja) * 1989-11-07 1991-06-28 Casio Comput Co Ltd 半導体パネル
JPH03155134A (ja) * 1989-11-13 1991-07-03 Seiko Epson Corp 集積回路装置の配線電極
JP2004243701A (ja) * 2003-02-14 2004-09-02 Toyo Kohan Co Ltd 合金層積層体および合金層積層体を用いた部品
JP2005129899A (ja) * 2003-08-28 2005-05-19 Kyocera Corp 配線基板および半導体装置
JP2007016105A (ja) * 2005-07-06 2007-01-25 Fujitsu Ltd 金属表面処理液、積層体および積層体の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101194461B1 (ko) 2011-09-22 2012-10-24 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2013084987A (ja) * 2013-01-10 2013-05-09 Denso Corp 配線基板の製造方法

Also Published As

Publication number Publication date
CN101282620A (zh) 2008-10-08
TW200841793A (en) 2008-10-16
KR20080090285A (ko) 2008-10-08

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