TW200841793A - Wiring board and method of manufacturing the same - Google Patents
Wiring board and method of manufacturing the same Download PDFInfo
- Publication number
- TW200841793A TW200841793A TW97111694A TW97111694A TW200841793A TW 200841793 A TW200841793 A TW 200841793A TW 97111694 A TW97111694 A TW 97111694A TW 97111694 A TW97111694 A TW 97111694A TW 200841793 A TW200841793 A TW 200841793A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- copper
- wiring
- nickel
- pattern
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 76
- 239000011347 resin Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 68
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 40
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 38
- 238000007747 plating Methods 0.000 claims description 34
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- QRKHFCODDWZNBA-UHFFFAOYSA-N [Cu].[Ni].[Bi] Chemical compound [Cu].[Ni].[Bi] QRKHFCODDWZNBA-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- 239000000956 alloy Substances 0.000 abstract description 5
- 229910018054 Ni-Cu Inorganic materials 0.000 abstract 4
- 229910018481 Ni—Cu Inorganic materials 0.000 abstract 4
- 238000000059 patterning Methods 0.000 abstract 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- -1 group Chemical compound 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 150000002632 lipids Chemical class 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 244000166124 Eucalyptus globulus Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 241000237502 Ostreidae Species 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- FFEZGPKGGQWAER-UHFFFAOYSA-N bearline Natural products C1CC(OC)C2(C3C4OC)C5CC(C(C6)OC(C)=O)C(O)C5C6(O)C4(O)C2N(CC)CC31COC(=O)C1=CC=CC=C1N1C(=O)CC(C)C1=O FFEZGPKGGQWAER-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000020636 oyster Nutrition 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007096527 | 2007-04-02 | ||
| JP2008026597A JP2008277749A (ja) | 2007-04-02 | 2008-02-06 | 配線基板およびその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200841793A true TW200841793A (en) | 2008-10-16 |
Family
ID=40014827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97111694A TW200841793A (en) | 2007-04-02 | 2008-03-31 | Wiring board and method of manufacturing the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008277749A (enExample) |
| KR (1) | KR20080090285A (enExample) |
| CN (1) | CN101282620A (enExample) |
| TW (1) | TW200841793A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010147059A1 (ja) * | 2009-06-18 | 2010-12-23 | Jx日鉱日石金属株式会社 | 電子回路及びその形成方法並びに電子回路形成用銅張積層板 |
| KR101194461B1 (ko) | 2011-09-22 | 2012-10-24 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| JP2013084987A (ja) * | 2013-01-10 | 2013-05-09 | Denso Corp | 配線基板の製造方法 |
| KR20160080526A (ko) * | 2014-12-29 | 2016-07-08 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| KR20180133153A (ko) * | 2017-06-05 | 2018-12-13 | 삼성전기주식회사 | 코일 부품 및 그 제조방법 |
| KR20190031838A (ko) | 2017-09-18 | 2019-03-27 | 주식회사 아모그린텍 | 박막 회로 기판 및 이의 제조 방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2879746B2 (ja) * | 1989-11-07 | 1999-04-05 | カシオ計算機株式会社 | 半導体パネル |
| JPH03155134A (ja) * | 1989-11-13 | 1991-07-03 | Seiko Epson Corp | 集積回路装置の配線電極 |
| JP2004243701A (ja) * | 2003-02-14 | 2004-09-02 | Toyo Kohan Co Ltd | 合金層積層体および合金層積層体を用いた部品 |
| JP2005129899A (ja) * | 2003-08-28 | 2005-05-19 | Kyocera Corp | 配線基板および半導体装置 |
| JP4817733B2 (ja) * | 2005-07-06 | 2011-11-16 | 富士通株式会社 | 金属表面処理液、積層体および積層体の製造方法 |
-
2008
- 2008-02-06 JP JP2008026597A patent/JP2008277749A/ja active Pending
- 2008-03-27 KR KR1020080028198A patent/KR20080090285A/ko not_active Withdrawn
- 2008-03-31 TW TW97111694A patent/TW200841793A/zh unknown
- 2008-04-02 CN CNA2008100906415A patent/CN101282620A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN101282620A (zh) | 2008-10-08 |
| JP2008277749A (ja) | 2008-11-13 |
| KR20080090285A (ko) | 2008-10-08 |
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