TWI338543B - - Google Patents

Download PDF

Info

Publication number
TWI338543B
TWI338543B TW092128381A TW92128381A TWI338543B TW I338543 B TWI338543 B TW I338543B TW 092128381 A TW092128381 A TW 092128381A TW 92128381 A TW92128381 A TW 92128381A TW I338543 B TWI338543 B TW I338543B
Authority
TW
Taiwan
Prior art keywords
layer
copper
thin
carrier
plating
Prior art date
Application number
TW092128381A
Other languages
English (en)
Chinese (zh)
Other versions
TW200420208A (en
Inventor
Suzuki Yuuji
Akira Matsuda
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW200420208A publication Critical patent/TW200420208A/zh
Application granted granted Critical
Publication of TWI338543B publication Critical patent/TWI338543B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
TW092128381A 2002-10-31 2003-10-14 Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier TW200420208A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002317907 2002-10-31

Publications (2)

Publication Number Publication Date
TW200420208A TW200420208A (en) 2004-10-01
TWI338543B true TWI338543B (enExample) 2011-03-01

Family

ID=32171244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128381A TW200420208A (en) 2002-10-31 2003-10-14 Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier

Country Status (6)

Country Link
US (1) US6924043B2 (enExample)
EP (1) EP1420621B1 (enExample)
JP (1) JP2010100942A (enExample)
KR (1) KR101056691B1 (enExample)
CN (1) CN100551687C (enExample)
TW (1) TW200420208A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9066459B2 (en) 2011-03-30 2015-06-23 Mitsui Mining & Smelting Co., Ltd. Manufacturing method of multilayer printed wiring board
TWI503060B (zh) * 2011-03-30 2015-10-01 Mitsui Mining & Smelting Co 多層印刷配線板的製造方法及以該製造方法所得之多層印刷配線板
TWI562885B (enExample) * 2013-03-04 2016-12-21 Jx Nippon Mining & Metals Corp
TWI573901B (zh) * 2015-06-17 2017-03-11 Jx Nippon Mining & Metals Corp Fabrication method of copper foil, laminate, printed wiring board, and manufacturing method of electronic device
TWI575121B (zh) * 2015-06-24 2017-03-21 Jx Nippon Mining & Metals Corp Production method of copper foil, laminate, printed wiring board, electronic machine and printed wiring board
TWI586851B (zh) * 2015-06-24 2017-06-11 Jx Nippon Mining & Metals Corp Manufacturing method of copper foil, laminate, printed wiring board, electronic machine and printed wiring board
US10212814B2 (en) 2012-03-01 2019-02-19 Mitsui Mining & Smelting Co., Ltd. Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP4346541B2 (ja) * 2004-11-26 2009-10-21 日東電工株式会社 配線回路基板およびその製造方法
JP4529978B2 (ja) * 2005-07-15 2010-08-25 パナソニック株式会社 配線基板、配線材料、及び銅張積層板、及び配線基板の製造方法
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
KR20070038407A (ko) * 2005-10-05 2007-04-10 스미또모 가가꾸 가부시끼가이샤 유연성 배선용 기판 및 이의 제조 방법
JP4736703B2 (ja) * 2005-10-14 2011-07-27 宇部興産株式会社 銅配線ポリイミドフィルムの製造方法
CN1984527B (zh) * 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
JP4934409B2 (ja) * 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
KR100802600B1 (ko) * 2006-04-24 2008-02-15 (주)피앤티 동박을 갖는 기판 및 이의 제조 방법
JP5959149B2 (ja) * 2008-09-05 2016-08-02 古河電気工業株式会社 キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板
JP5505828B2 (ja) * 2009-03-04 2014-05-28 福田金属箔粉工業株式会社 複合金属箔及びその製造方法
JP5406784B2 (ja) 2010-04-26 2014-02-05 日東電工株式会社 水分散型粘着剤組成物およびその製造方法
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
KR20120084441A (ko) * 2011-01-20 2012-07-30 이미연 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판
WO2012132573A1 (ja) * 2011-03-25 2012-10-04 Jx日鉱日石金属株式会社 複合銅箔及びその製造方法
JP5373995B2 (ja) * 2011-08-31 2013-12-18 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP5902931B2 (ja) * 2011-12-06 2016-04-13 新光電気工業株式会社 配線基板の製造方法、及び、配線基板製造用の支持体
JP5903446B2 (ja) * 2012-02-06 2016-04-13 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板の製造方法、プリント回路板の製造方法、銅張積層板の製造方法及び電子機器の製造方法
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5228130B1 (ja) * 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP5393903B1 (ja) * 2012-12-28 2014-01-22 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、及び、それを用いたプリント配線板、プリント回路板及び銅張積層板
US9070586B1 (en) 2014-02-22 2015-06-30 International Business Machines Corporation Method of forming surface protrusions on an article and the article with the protrusions attached
US10330701B2 (en) 2014-02-22 2019-06-25 International Business Machines Corporation Test probe head for full wafer testing
CN105101627B (zh) * 2014-05-09 2019-03-01 Jx日矿日石金属株式会社 附载体铜箔及其制造方法、印刷配线板及其制造方法、积层体、电子机器
KR102335444B1 (ko) * 2017-03-30 2021-12-03 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이를 이용한 동 클래드 적층판 및 프린트 배선판
WO2019163605A1 (ja) * 2018-02-20 2019-08-29 三井金属鉱業株式会社 ガラスキャリア付銅箔及びその製造方法
US11648761B2 (en) 2018-04-17 2023-05-16 3M Innovative Properties Company Conductive films
JP7456579B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 金属層を有する金属部材の製造方法
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
CN114554686A (zh) * 2020-11-19 2022-05-27 广州方邦电子股份有限公司 一种复合金属箔及线路板
CN113488660B (zh) * 2021-07-08 2023-04-18 江西鸿美新能源科技有限公司 一种负极集流体的制备方法及电池负极的制备方法
CN113386417A (zh) * 2021-07-08 2021-09-14 江西柔顺科技有限公司 一种覆铜板及其制备方法
CN113386416B (zh) * 2021-07-08 2022-12-16 江西柔顺科技有限公司 一种导热双面覆铜板及其制备方法
KR20230046855A (ko) * 2021-09-30 2023-04-06 롯데에너지머티리얼즈 주식회사 미세 홀 가공이 용이한 캐리어박 부착 극박동박, 및 이를 포함하는 동박 적층판, 그의 제조방법
CN114900975A (zh) * 2022-03-09 2022-08-12 九江德福科技股份有限公司 一种电子电路用超薄铜箔及其制备方法
CN114657610A (zh) * 2022-03-28 2022-06-24 电子科技大学 一种可剥离超薄载体铜箔的制备方法
CN115058711B (zh) * 2022-06-17 2022-12-27 山东大学 一种易剥离的超薄载体铜箔的制备方法
KR102872719B1 (ko) * 2023-03-16 2025-10-17 와이엠티 주식회사 미세돌기가 형성된 금속박용 캐리어 및 이를 포함하는 금속박
CN116685051B (zh) * 2023-07-03 2024-02-06 广州方邦电子股份有限公司 金属箔、载体箔、覆金属层叠板、印刷线路板及电池
CN116939998B (zh) * 2023-09-07 2023-11-28 江苏普诺威电子股份有限公司 具有高剥离强度的线路基板及其制作方法、音圈马达

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921392B2 (ja) * 1976-09-21 1984-05-19 日本電解株式会社 プリント回路用銅箔の製造方法
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates
JPH0818401B2 (ja) 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
US5262247A (en) * 1989-05-17 1993-11-16 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board
US5066366A (en) * 1990-05-04 1991-11-19 Olin Corporation Method for making foil
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
TW289900B (enExample) * 1994-04-22 1996-11-01 Gould Electronics Inc
JP4329953B2 (ja) * 1999-05-19 2009-09-09 古河電気工業株式会社 高密度超微細配線板用銅箔
US6346335B1 (en) * 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
MY120403A (en) 2000-03-10 2005-10-31 Gbc Metals Llc Copper foil composite including a release layer
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
US6660406B2 (en) * 2000-07-07 2003-12-09 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9066459B2 (en) 2011-03-30 2015-06-23 Mitsui Mining & Smelting Co., Ltd. Manufacturing method of multilayer printed wiring board
TWI503060B (zh) * 2011-03-30 2015-10-01 Mitsui Mining & Smelting Co 多層印刷配線板的製造方法及以該製造方法所得之多層印刷配線板
TWI511633B (zh) * 2011-03-30 2015-12-01 Mitsui Mining & Smelting Co 多層印刷配線板的製造方法及以該製造方法所得之多層印刷配線板
TWI561138B (en) * 2011-03-30 2016-12-01 Mitsui Mining & Smelting Co Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method
US9585261B2 (en) 2011-03-30 2017-02-28 Mitsui Mining & Smelting Co., Ltd. Manufacturing method of multilayer printed wiring board
US10212814B2 (en) 2012-03-01 2019-02-19 Mitsui Mining & Smelting Co., Ltd. Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
TWI562885B (enExample) * 2013-03-04 2016-12-21 Jx Nippon Mining & Metals Corp
TWI573901B (zh) * 2015-06-17 2017-03-11 Jx Nippon Mining & Metals Corp Fabrication method of copper foil, laminate, printed wiring board, and manufacturing method of electronic device
TWI575121B (zh) * 2015-06-24 2017-03-21 Jx Nippon Mining & Metals Corp Production method of copper foil, laminate, printed wiring board, electronic machine and printed wiring board
TWI586851B (zh) * 2015-06-24 2017-06-11 Jx Nippon Mining & Metals Corp Manufacturing method of copper foil, laminate, printed wiring board, electronic machine and printed wiring board

Also Published As

Publication number Publication date
TW200420208A (en) 2004-10-01
KR101056691B1 (ko) 2011-08-12
JP2010100942A (ja) 2010-05-06
KR20040038761A (ko) 2004-05-08
EP1420621B1 (en) 2014-08-13
EP1420621A1 (en) 2004-05-19
US20040121178A1 (en) 2004-06-24
CN1498749A (zh) 2004-05-26
CN100551687C (zh) 2009-10-21
US6924043B2 (en) 2005-08-02

Similar Documents

Publication Publication Date Title
TWI338543B (enExample)
JP5318886B2 (ja) 印刷回路用銅箔
CN101809206B (zh) 印刷电路用铜箔及覆铜箔层压板
JP4087369B2 (ja) キャリア付き極薄銅箔、およびプリント配線板
JP4728723B2 (ja) キャリア付き極薄銅箔
KR101853519B1 (ko) 액정 폴리머 구리 피복 적층판 및 당해 적층판에 사용하는 구리박
CN100571483C (zh) 带载体的极薄铜箔以及使用带载体的极薄铜箔的电路板
JP4429979B2 (ja) キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法
JP2004169181A (ja) キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP2012102407A (ja) キャリア付き極薄銅箔及びプリント配線板
JP2007186782A (ja) キャリア付き極薄銅箔及びプリント配線基板
JP4934409B2 (ja) キャリア付き極薄銅箔及びプリント配線基板
TW200526819A (en) Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
JP2000269637A (ja) 高密度超微細配線板用銅箔
JP2010006071A (ja) 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
JP2005260058A (ja) キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板
KR101623667B1 (ko) 인쇄 회로용 동박
JP2009214308A (ja) キャリア付き銅箔
JP4429539B2 (ja) ファインパターン用電解銅箔
JP5364838B1 (ja) キャリア付銅箔
JP2001177205A (ja) 改良された結合強さ及び耐アンダーカッティング性を有する銅箔結合処理物
JP4748519B2 (ja) キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP4391449B2 (ja) キャリア付き極薄銅箔及びプリント配線基板
JP2005015897A (ja) 厚銅シート、それを用いたプリント配線板

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent