TWI562885B - - Google Patents

Info

Publication number
TWI562885B
TWI562885B TW103107351A TW103107351A TWI562885B TW I562885 B TWI562885 B TW I562885B TW 103107351 A TW103107351 A TW 103107351A TW 103107351 A TW103107351 A TW 103107351A TW I562885 B TWI562885 B TW I562885B
Authority
TW
Taiwan
Application number
TW103107351A
Other languages
Chinese (zh)
Other versions
TW201446495A (zh
Inventor
Kazuhiko Sakaguchi
Shinichi Sasaki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201446495A publication Critical patent/TW201446495A/zh
Application granted granted Critical
Publication of TWI562885B publication Critical patent/TWI562885B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
TW103107351A 2013-03-04 2014-03-04 附載體銅箔、使用其之覆銅積層板、印刷配線板、電子機器及印刷配線板之製造方法 TW201446495A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013042076 2013-03-04

Publications (2)

Publication Number Publication Date
TW201446495A TW201446495A (zh) 2014-12-16
TWI562885B true TWI562885B (enExample) 2016-12-21

Family

ID=51491300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103107351A TW201446495A (zh) 2013-03-04 2014-03-04 附載體銅箔、使用其之覆銅積層板、印刷配線板、電子機器及印刷配線板之製造方法

Country Status (5)

Country Link
JP (1) JP6514635B2 (enExample)
KR (1) KR20150126008A (enExample)
CN (2) CN105209252B (enExample)
TW (1) TW201446495A (enExample)
WO (1) WO2014136785A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016043058A1 (ja) * 2014-09-19 2016-03-24 三井金属鉱業株式会社 表面処理銅箔及びその製造方法、プリント配線板用銅張積層板、並びにプリント配線板
JP2016084533A (ja) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器の製造方法、及び、プリント配線板の製造方法
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
JP6427454B2 (ja) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
JP6639128B2 (ja) * 2015-07-10 2020-02-05 株式会社カネカ 金属細線フィルムおよびその製造方法
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108464062B (zh) * 2016-02-18 2020-10-27 三井金属矿业株式会社 印刷电路板的制造方法
WO2018066113A1 (ja) * 2016-10-06 2018-04-12 三井金属鉱業株式会社 多層配線板の製造方法
JP6824436B2 (ja) * 2017-10-26 2021-02-03 三井金属鉱業株式会社 極薄銅箔及びキャリア付極薄銅箔、並びにプリント配線板の製造方法
CN111511544B (zh) 2018-03-29 2022-09-30 三井金属矿业株式会社 带玻璃载体的铜箔及其制造方法
WO2020173574A1 (en) * 2019-02-28 2020-09-03 Circuit Foil Luxembourg Composite copper foil and method of fabricating the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI338543B (enExample) * 2002-10-31 2011-03-01 Furukawa Electric Co Ltd
JP2011176051A (ja) * 2010-02-23 2011-09-08 Dainippon Printing Co Ltd 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、ｈｄｄ用サスペンション基板、ｈｄｄ用サスペンションおよびハードディスクドライブ
TWI379925B (enExample) * 2003-09-01 2012-12-21

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006618B2 (ja) * 2001-09-26 2007-11-14 日鉱金属株式会社 キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
TWI285686B (en) * 2005-03-31 2007-08-21 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI338543B (enExample) * 2002-10-31 2011-03-01 Furukawa Electric Co Ltd
TWI379925B (enExample) * 2003-09-01 2012-12-21
JP2011176051A (ja) * 2010-02-23 2011-09-08 Dainippon Printing Co Ltd 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、ｈｄｄ用サスペンション基板、ｈｄｄ用サスペンションおよびハードディスクドライブ

Also Published As

Publication number Publication date
JPWO2014136785A1 (ja) 2017-02-16
WO2014136785A1 (ja) 2014-09-12
TW201446495A (zh) 2014-12-16
KR20150126008A (ko) 2015-11-10
JP6514635B2 (ja) 2019-05-15
CN107031143A (zh) 2017-08-11
CN105209252B (zh) 2018-01-30
CN105209252A (zh) 2015-12-30

Similar Documents

Publication Publication Date Title
BR112015007533A2 (enExample)
BR102016010778A2 (enExample)
BR112014017733A2 (enExample)
BR112014018502A2 (enExample)
BR112014017739A2 (enExample)
BR112014019326A2 (enExample)
BR112014018480A2 (enExample)
BR112014018516A2 (enExample)
BR112014020341A2 (enExample)
BR112014017855A2 (enExample)
BR112014017765A2 (enExample)
BR112014017669A2 (enExample)
BR112014021878A2 (enExample)
BR112014018468A2 (enExample)
BR112014017901A2 (enExample)
BR112014019204A2 (enExample)
BR112014018207A2 (enExample)
BR112015015948A2 (enExample)
BR112014017722A2 (enExample)
BR112014017653A2 (enExample)
TWI562885B (enExample)
BR112014018578A2 (enExample)
BR112014018483A2 (enExample)
BR112014017794A2 (enExample)
BR112014017601A2 (enExample)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees