JP6514635B2 - キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法 - Google Patents

キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法 Download PDF

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Publication number
JP6514635B2
JP6514635B2 JP2015504333A JP2015504333A JP6514635B2 JP 6514635 B2 JP6514635 B2 JP 6514635B2 JP 2015504333 A JP2015504333 A JP 2015504333A JP 2015504333 A JP2015504333 A JP 2015504333A JP 6514635 B2 JP6514635 B2 JP 6514635B2
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Japan
Prior art keywords
layer
carrier
copper
copper foil
treatment
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Japanese (ja)
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JPWO2014136785A1 (ja
Inventor
和彦 坂口
和彦 坂口
佐々木　伸一
伸一 佐々木
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2015504333A 2013-03-04 2014-03-04 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法 Active JP6514635B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013042076 2013-03-04
JP2013042076 2013-03-04
PCT/JP2014/055494 WO2014136785A1 (ja) 2013-03-04 2014-03-04 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2014136785A1 JPWO2014136785A1 (ja) 2017-02-16
JP6514635B2 true JP6514635B2 (ja) 2019-05-15

Family

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JP2015504333A Active JP6514635B2 (ja) 2013-03-04 2014-03-04 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

Country Status (5)

Country Link
JP (1) JP6514635B2 (enExample)
KR (1) KR20150126008A (enExample)
CN (2) CN105209252B (enExample)
TW (1) TW201446495A (enExample)
WO (1) WO2014136785A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016043058A1 (ja) * 2014-09-19 2016-03-24 三井金属鉱業株式会社 表面処理銅箔及びその製造方法、プリント配線板用銅張積層板、並びにプリント配線板
JP2016084533A (ja) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器の製造方法、及び、プリント配線板の製造方法
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
JP6427454B2 (ja) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
JP6639128B2 (ja) * 2015-07-10 2020-02-05 株式会社カネカ 金属細線フィルムおよびその製造方法
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108464062B (zh) * 2016-02-18 2020-10-27 三井金属矿业株式会社 印刷电路板的制造方法
WO2018066113A1 (ja) * 2016-10-06 2018-04-12 三井金属鉱業株式会社 多層配線板の製造方法
JP6824436B2 (ja) * 2017-10-26 2021-02-03 三井金属鉱業株式会社 極薄銅箔及びキャリア付極薄銅箔、並びにプリント配線板の製造方法
CN111511544B (zh) 2018-03-29 2022-09-30 三井金属矿业株式会社 带玻璃载体的铜箔及其制造方法
WO2020173574A1 (en) * 2019-02-28 2020-09-03 Circuit Foil Luxembourg Composite copper foil and method of fabricating the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006618B2 (ja) * 2001-09-26 2007-11-14 日鉱金属株式会社 キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
TW200420208A (en) * 2002-10-31 2004-10-01 Furukawa Circuit Foil Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
TWI285686B (en) * 2005-03-31 2007-08-21 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5482285B2 (ja) * 2010-02-23 2014-05-07 大日本印刷株式会社 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、ｈｄｄ用サスペンション基板、ｈｄｄ用サスペンションおよびハードディスクドライブ
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔

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Publication number Publication date
JPWO2014136785A1 (ja) 2017-02-16
WO2014136785A1 (ja) 2014-09-12
TW201446495A (zh) 2014-12-16
KR20150126008A (ko) 2015-11-10
TWI562885B (enExample) 2016-12-21
CN107031143A (zh) 2017-08-11
CN105209252B (zh) 2018-01-30
CN105209252A (zh) 2015-12-30

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