CN105209252B - 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法 - Google Patents

附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法 Download PDF

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Publication number
CN105209252B
CN105209252B CN201480012569.8A CN201480012569A CN105209252B CN 105209252 B CN105209252 B CN 105209252B CN 201480012569 A CN201480012569 A CN 201480012569A CN 105209252 B CN105209252 B CN 105209252B
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CN
China
Prior art keywords
layer
carrier
copper foil
copper
ultra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201480012569.8A
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English (en)
Chinese (zh)
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CN105209252A (zh
Inventor
坂口和彦
佐佐木伸
佐佐木伸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201611113446.0A priority Critical patent/CN107031143A/zh
Publication of CN105209252A publication Critical patent/CN105209252A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201480012569.8A 2013-03-04 2014-03-04 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法 Active CN105209252B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611113446.0A CN107031143A (zh) 2013-03-04 2014-03-04 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013042076 2013-03-04
JP2013-042076 2013-03-04
PCT/JP2014/055494 WO2014136785A1 (ja) 2013-03-04 2014-03-04 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201611113446.0A Division CN107031143A (zh) 2013-03-04 2014-03-04 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

Publications (2)

Publication Number Publication Date
CN105209252A CN105209252A (zh) 2015-12-30
CN105209252B true CN105209252B (zh) 2018-01-30

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480012569.8A Active CN105209252B (zh) 2013-03-04 2014-03-04 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法
CN201611113446.0A Pending CN107031143A (zh) 2013-03-04 2014-03-04 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201611113446.0A Pending CN107031143A (zh) 2013-03-04 2014-03-04 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

Country Status (5)

Country Link
JP (1) JP6514635B2 (enExample)
KR (1) KR20150126008A (enExample)
CN (2) CN105209252B (enExample)
TW (1) TW201446495A (enExample)
WO (1) WO2014136785A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732471B (zh) 2019-02-28 2021-07-01 盧森堡商盧森堡銅箔有限公司 複合銅箔及其製造方法

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CN106164327B (zh) * 2014-09-19 2018-01-30 三井金属矿业株式会社 表面处理铜箔及其制造方法、印刷电路板用覆铜层叠板、以及印刷电路板
JP2016084533A (ja) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器の製造方法、及び、プリント配線板の製造方法
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
JP6427454B2 (ja) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
JP6639128B2 (ja) * 2015-07-10 2020-02-05 株式会社カネカ 金属細線フィルムおよびその製造方法
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6836579B2 (ja) * 2016-02-18 2021-03-03 三井金属鉱業株式会社 プリント配線板の製造方法
CN109716871B (zh) * 2016-10-06 2023-02-17 三井金属矿业株式会社 多层布线板的制造方法
CN110997313A (zh) * 2017-10-26 2020-04-10 三井金属矿业株式会社 极薄铜箔和带载体的极薄铜箔、以及印刷电路板的制造方法
JP6836689B2 (ja) * 2018-03-29 2021-03-03 三井金属鉱業株式会社 ガラスキャリア付銅箔及びその製造方法

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CN1498749A (zh) * 2002-10-31 2004-05-26 �źӵ�·ͭ����ʽ���� 带载体的极薄铜箔及其制造方法以及印刷配线基板
CN101662892A (zh) * 2003-09-01 2010-03-03 古河电气工业株式会社 带有载体的极薄铜箔及其制造方法及布线板
JP2011176051A (ja) * 2010-02-23 2011-09-08 Dainippon Printing Co Ltd 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、ｈｄｄ用サスペンション基板、ｈｄｄ用サスペンションおよびハードディスクドライブ

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JP4006618B2 (ja) * 2001-09-26 2007-11-14 日鉱金属株式会社 キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
TWI285686B (en) * 2005-03-31 2007-08-21 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1498749A (zh) * 2002-10-31 2004-05-26 �źӵ�·ͭ����ʽ���� 带载体的极薄铜箔及其制造方法以及印刷配线基板
CN101662892A (zh) * 2003-09-01 2010-03-03 古河电气工业株式会社 带有载体的极薄铜箔及其制造方法及布线板
JP2011176051A (ja) * 2010-02-23 2011-09-08 Dainippon Printing Co Ltd 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、ｈｄｄ用サスペンション基板、ｈｄｄ用サスペンションおよびハードディスクドライブ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732471B (zh) 2019-02-28 2021-07-01 盧森堡商盧森堡銅箔有限公司 複合銅箔及其製造方法
US11639557B2 (en) 2019-02-28 2023-05-02 Circuit Foil Luxembourg Composite copper foil and method of fabricating the same

Also Published As

Publication number Publication date
CN105209252A (zh) 2015-12-30
JP6514635B2 (ja) 2019-05-15
JPWO2014136785A1 (ja) 2017-02-16
KR20150126008A (ko) 2015-11-10
TWI562885B (enExample) 2016-12-21
WO2014136785A1 (ja) 2014-09-12
TW201446495A (zh) 2014-12-16
CN107031143A (zh) 2017-08-11

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Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan

Patentee after: JX Nippon Mining & Metals Corp.

Address before: Tokyo, Japan

Patentee before: JX Nippon Mining & Metals Corp.

CP02 Change in the address of a patent holder