KR20150126008A - 캐리어 부착 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 - Google Patents

캐리어 부착 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20150126008A
KR20150126008A KR1020157027336A KR20157027336A KR20150126008A KR 20150126008 A KR20150126008 A KR 20150126008A KR 1020157027336 A KR1020157027336 A KR 1020157027336A KR 20157027336 A KR20157027336 A KR 20157027336A KR 20150126008 A KR20150126008 A KR 20150126008A
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KR
South Korea
Prior art keywords
layer
carrier
copper foil
thin copper
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020157027336A
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English (en)
Korean (ko)
Inventor
가즈히코 사카구치
신이치 사사키
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 filed Critical 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Publication of KR20150126008A publication Critical patent/KR20150126008A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020157027336A 2013-03-04 2014-03-04 캐리어 부착 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 Ceased KR20150126008A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-042076 2013-03-04
JP2013042076 2013-03-04
PCT/JP2014/055494 WO2014136785A1 (ja) 2013-03-04 2014-03-04 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
KR20150126008A true KR20150126008A (ko) 2015-11-10

Family

ID=51491300

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157027336A Ceased KR20150126008A (ko) 2013-03-04 2014-03-04 캐리어 부착 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP6514635B2 (enExample)
KR (1) KR20150126008A (enExample)
CN (2) CN105209252B (enExample)
TW (1) TW201446495A (enExample)
WO (1) WO2014136785A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12302504B2 (en) * 2016-10-06 2025-05-13 Mitsui Mining & Smelting Co., Ltd. Production method for multilayer wiring board

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016043058A1 (ja) * 2014-09-19 2016-03-24 三井金属鉱業株式会社 表面処理銅箔及びその製造方法、プリント配線板用銅張積層板、並びにプリント配線板
JP2016084533A (ja) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器の製造方法、及び、プリント配線板の製造方法
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
JP6427454B2 (ja) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
JP6639128B2 (ja) * 2015-07-10 2020-02-05 株式会社カネカ 金属細線フィルムおよびその製造方法
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108464062B (zh) * 2016-02-18 2020-10-27 三井金属矿业株式会社 印刷电路板的制造方法
JP6824436B2 (ja) * 2017-10-26 2021-02-03 三井金属鉱業株式会社 極薄銅箔及びキャリア付極薄銅箔、並びにプリント配線板の製造方法
CN111511544B (zh) 2018-03-29 2022-09-30 三井金属矿业株式会社 带玻璃载体的铜箔及其制造方法
WO2020173574A1 (en) * 2019-02-28 2020-09-03 Circuit Foil Luxembourg Composite copper foil and method of fabricating the same

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JP4006618B2 (ja) * 2001-09-26 2007-11-14 日鉱金属株式会社 キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
TW200420208A (en) * 2002-10-31 2004-10-01 Furukawa Circuit Foil Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
TWI285686B (en) * 2005-03-31 2007-08-21 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5482285B2 (ja) * 2010-02-23 2014-05-07 大日本印刷株式会社 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、ｈｄｄ用サスペンション基板、ｈｄｄ用サスペンションおよびハードディスクドライブ
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12302504B2 (en) * 2016-10-06 2025-05-13 Mitsui Mining & Smelting Co., Ltd. Production method for multilayer wiring board

Also Published As

Publication number Publication date
JPWO2014136785A1 (ja) 2017-02-16
WO2014136785A1 (ja) 2014-09-12
TW201446495A (zh) 2014-12-16
TWI562885B (enExample) 2016-12-21
JP6514635B2 (ja) 2019-05-15
CN107031143A (zh) 2017-08-11
CN105209252B (zh) 2018-01-30
CN105209252A (zh) 2015-12-30

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