KR101056691B1 - 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판 - Google Patents

케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판 Download PDF

Info

Publication number
KR101056691B1
KR101056691B1 KR1020030075727A KR20030075727A KR101056691B1 KR 101056691 B1 KR101056691 B1 KR 101056691B1 KR 1020030075727 A KR1020030075727 A KR 1020030075727A KR 20030075727 A KR20030075727 A KR 20030075727A KR 101056691 B1 KR101056691 B1 KR 101056691B1
Authority
KR
South Korea
Prior art keywords
copper foil
layer
ultra
carrier
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020030075727A
Other languages
English (en)
Korean (ko)
Other versions
KR20040038761A (ko
Inventor
유지 스즈키
아키라 마츠다
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20040038761A publication Critical patent/KR20040038761A/ko
Application granted granted Critical
Publication of KR101056691B1 publication Critical patent/KR101056691B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
KR1020030075727A 2002-10-31 2003-10-29 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판 Expired - Fee Related KR101056691B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00317907 2002-10-31
JP2002317907 2002-10-31

Publications (2)

Publication Number Publication Date
KR20040038761A KR20040038761A (ko) 2004-05-08
KR101056691B1 true KR101056691B1 (ko) 2011-08-12

Family

ID=32171244

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030075727A Expired - Fee Related KR101056691B1 (ko) 2002-10-31 2003-10-29 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판

Country Status (6)

Country Link
US (1) US6924043B2 (enExample)
EP (1) EP1420621B1 (enExample)
JP (1) JP2010100942A (enExample)
KR (1) KR101056691B1 (enExample)
CN (1) CN100551687C (enExample)
TW (1) TW200420208A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054865A1 (ko) * 2021-09-30 2023-04-06 롯데에너지머티리얼즈 주식회사 미세 홀 가공이 용이한 캐리어박 부착 극박동박, 및 이를 포함하는 동박 적층판, 그의 제조방법
KR20240140198A (ko) * 2023-03-16 2024-09-24 와이엠티 주식회사 미세돌기가 형성된 금속박용 캐리어 및 이를 포함하는 금속박

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP4346541B2 (ja) * 2004-11-26 2009-10-21 日東電工株式会社 配線回路基板およびその製造方法
JP4529978B2 (ja) * 2005-07-15 2010-08-25 パナソニック株式会社 配線基板、配線材料、及び銅張積層板、及び配線基板の製造方法
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
KR20070038407A (ko) * 2005-10-05 2007-04-10 스미또모 가가꾸 가부시끼가이샤 유연성 배선용 기판 및 이의 제조 방법
JP4736703B2 (ja) * 2005-10-14 2011-07-27 宇部興産株式会社 銅配線ポリイミドフィルムの製造方法
CN1984527B (zh) * 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
JP4934409B2 (ja) * 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
KR100802600B1 (ko) * 2006-04-24 2008-02-15 (주)피앤티 동박을 갖는 기판 및 이의 제조 방법
JP5959149B2 (ja) * 2008-09-05 2016-08-02 古河電気工業株式会社 キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板
JP5505828B2 (ja) * 2009-03-04 2014-05-28 福田金属箔粉工業株式会社 複合金属箔及びその製造方法
JP5406784B2 (ja) 2010-04-26 2014-02-05 日東電工株式会社 水分散型粘着剤組成物およびその製造方法
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
KR20120084441A (ko) * 2011-01-20 2012-07-30 이미연 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판
WO2012132573A1 (ja) * 2011-03-25 2012-10-04 Jx日鉱日石金属株式会社 複合銅箔及びその製造方法
US9585261B2 (en) 2011-03-30 2017-02-28 Mitsui Mining & Smelting Co., Ltd. Manufacturing method of multilayer printed wiring board
KR101510366B1 (ko) 2011-03-30 2015-04-07 미쓰이금속광업주식회사 다층 프린트 배선판의 제조 방법
JP5373995B2 (ja) * 2011-08-31 2013-12-18 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP5902931B2 (ja) * 2011-12-06 2016-04-13 新光電気工業株式会社 配線基板の製造方法、及び、配線基板製造用の支持体
JP5903446B2 (ja) * 2012-02-06 2016-04-13 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板の製造方法、プリント回路板の製造方法、銅張積層板の製造方法及び電子機器の製造方法
WO2013129508A1 (ja) * 2012-03-01 2013-09-06 三井金属鉱業株式会社 キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5228130B1 (ja) * 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP5393903B1 (ja) * 2012-12-28 2014-01-22 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、及び、それを用いたプリント配線板、プリント回路板及び銅張積層板
CN105209252B (zh) * 2013-03-04 2018-01-30 Jx日矿日石金属株式会社 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法
US9070586B1 (en) 2014-02-22 2015-06-30 International Business Machines Corporation Method of forming surface protrusions on an article and the article with the protrusions attached
US10330701B2 (en) 2014-02-22 2019-06-25 International Business Machines Corporation Test probe head for full wafer testing
CN105101627B (zh) * 2014-05-09 2019-03-01 Jx日矿日石金属株式会社 附载体铜箔及其制造方法、印刷配线板及其制造方法、积层体、电子机器
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6236119B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR102335444B1 (ko) * 2017-03-30 2021-12-03 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이를 이용한 동 클래드 적층판 및 프린트 배선판
WO2019163605A1 (ja) * 2018-02-20 2019-08-29 三井金属鉱業株式会社 ガラスキャリア付銅箔及びその製造方法
US11648761B2 (en) 2018-04-17 2023-05-16 3M Innovative Properties Company Conductive films
JP7456579B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 金属層を有する金属部材の製造方法
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
CN114554686A (zh) * 2020-11-19 2022-05-27 广州方邦电子股份有限公司 一种复合金属箔及线路板
CN113488660B (zh) * 2021-07-08 2023-04-18 江西鸿美新能源科技有限公司 一种负极集流体的制备方法及电池负极的制备方法
CN113386417A (zh) * 2021-07-08 2021-09-14 江西柔顺科技有限公司 一种覆铜板及其制备方法
CN113386416B (zh) * 2021-07-08 2022-12-16 江西柔顺科技有限公司 一种导热双面覆铜板及其制备方法
CN114900975A (zh) * 2022-03-09 2022-08-12 九江德福科技股份有限公司 一种电子电路用超薄铜箔及其制备方法
CN114657610A (zh) * 2022-03-28 2022-06-24 电子科技大学 一种可剥离超薄载体铜箔的制备方法
CN115058711B (zh) * 2022-06-17 2022-12-27 山东大学 一种易剥离的超薄载体铜箔的制备方法
CN116685051B (zh) * 2023-07-03 2024-02-06 广州方邦电子股份有限公司 金属箔、载体箔、覆金属层叠板、印刷线路板及电池
CN116939998B (zh) * 2023-09-07 2023-11-28 江苏普诺威电子股份有限公司 具有高剥离强度的线路基板及其制作方法、音圈马达

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346335B1 (en) * 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
WO2002024444A1 (fr) * 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921392B2 (ja) * 1976-09-21 1984-05-19 日本電解株式会社 プリント回路用銅箔の製造方法
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates
JPH0818401B2 (ja) 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
US5262247A (en) * 1989-05-17 1993-11-16 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board
US5066366A (en) * 1990-05-04 1991-11-19 Olin Corporation Method for making foil
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
TW289900B (enExample) * 1994-04-22 1996-11-01 Gould Electronics Inc
JP4329953B2 (ja) * 1999-05-19 2009-09-09 古河電気工業株式会社 高密度超微細配線板用銅箔
MY120403A (en) 2000-03-10 2005-10-31 Gbc Metals Llc Copper foil composite including a release layer
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
US6660406B2 (en) * 2000-07-07 2003-12-09 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346335B1 (en) * 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
WO2002024444A1 (fr) * 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054865A1 (ko) * 2021-09-30 2023-04-06 롯데에너지머티리얼즈 주식회사 미세 홀 가공이 용이한 캐리어박 부착 극박동박, 및 이를 포함하는 동박 적층판, 그의 제조방법
EP4408135A4 (en) * 2021-09-30 2025-10-15 Lotte Energy Mat Corporation ULTRA-THIN COPPER FOIL ATTACHED TO A CARRIER FOIL FACILITATING MICRO-HOLE PROCESSING, COPPER-CLAD LAMINATE COMPRISING THIS FOIL, AND RELATED MANUFACTURING METHODS
KR20240140198A (ko) * 2023-03-16 2024-09-24 와이엠티 주식회사 미세돌기가 형성된 금속박용 캐리어 및 이를 포함하는 금속박
KR102872719B1 (ko) * 2023-03-16 2025-10-17 와이엠티 주식회사 미세돌기가 형성된 금속박용 캐리어 및 이를 포함하는 금속박

Also Published As

Publication number Publication date
TW200420208A (en) 2004-10-01
JP2010100942A (ja) 2010-05-06
KR20040038761A (ko) 2004-05-08
EP1420621B1 (en) 2014-08-13
EP1420621A1 (en) 2004-05-19
US20040121178A1 (en) 2004-06-24
CN1498749A (zh) 2004-05-26
CN100551687C (zh) 2009-10-21
US6924043B2 (en) 2005-08-02
TWI338543B (enExample) 2011-03-01

Similar Documents

Publication Publication Date Title
KR101056691B1 (ko) 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판
KR100562956B1 (ko) 고밀도 초미세 배선판용 동박
KR101056692B1 (ko) 케리어 부착 극박 동박의 제조방법 및 이 제조방법으로제조된 케리어 부착 극박동박, 프린트 배선기판, 다층프린트 배선판 및 칩온필름용 배선판
CN101809206B (zh) 印刷电路用铜箔及覆铜箔层压板
US7985488B2 (en) Ultrathin copper foil with carrier and printed circuit board using same
US8674229B2 (en) Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate
JP2004169181A (ja) キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
TWI638590B (zh) Carrier copper foil, laminated body, printed wiring board, and printed wiring board manufacturing method
JP4129429B2 (ja) 複合フォイル及びその製造方法
KR101347140B1 (ko) 캐리어 부착 극박 동박 및 프린트 배선 기판
JP2012102407A (ja) キャリア付き極薄銅箔及びプリント配線板
KR20160034915A (ko) 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
TWI402009B (zh) Surface treatment of copper foil and circuit substrate
JP2007314855A (ja) キャリア付き極薄銅箔、銅張積層板及びプリント配線基板
JP2017088971A (ja) キャリア付銅箔、キャリア付銅箔の製造方法、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP4748519B2 (ja) キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP4391449B2 (ja) キャリア付き極薄銅箔及びプリント配線基板
JPH08181432A (ja) 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140721

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150716

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

FPAY Annual fee payment

Payment date: 20160721

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170720

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180717

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230809

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230809