CN101282620A - 布线板和制造布线板的方法 - Google Patents

布线板和制造布线板的方法 Download PDF

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Publication number
CN101282620A
CN101282620A CNA2008100906415A CN200810090641A CN101282620A CN 101282620 A CN101282620 A CN 101282620A CN A2008100906415 A CNA2008100906415 A CN A2008100906415A CN 200810090641 A CN200810090641 A CN 200810090641A CN 101282620 A CN101282620 A CN 101282620A
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CN
China
Prior art keywords
layer
wiring
seed layer
resist pattern
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008100906415A
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English (en)
Chinese (zh)
Inventor
山崎智生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101282620A publication Critical patent/CN101282620A/zh
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
CNA2008100906415A 2007-04-02 2008-04-02 布线板和制造布线板的方法 Pending CN101282620A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007096527 2007-04-02
JP2007-096527 2007-04-02
JP2008-026597 2008-02-06

Publications (1)

Publication Number Publication Date
CN101282620A true CN101282620A (zh) 2008-10-08

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ID=40014827

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008100906415A Pending CN101282620A (zh) 2007-04-02 2008-04-02 布线板和制造布线板的方法

Country Status (4)

Country Link
JP (1) JP2008277749A (enExample)
KR (1) KR20080090285A (enExample)
CN (1) CN101282620A (enExample)
TW (1) TW200841793A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105744740A (zh) * 2014-12-29 2016-07-06 三星电机株式会社 印刷电路板及其制造方法
CN108987039A (zh) * 2017-06-05 2018-12-11 三星电机株式会社 线圈组件及其制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101194461B1 (ko) 2011-09-22 2012-10-24 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2013084987A (ja) * 2013-01-10 2013-05-09 Denso Corp 配線基板の製造方法
KR20190031838A (ko) 2017-09-18 2019-03-27 주식회사 아모그린텍 박막 회로 기판 및 이의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2879746B2 (ja) * 1989-11-07 1999-04-05 カシオ計算機株式会社 半導体パネル
JPH03155134A (ja) * 1989-11-13 1991-07-03 Seiko Epson Corp 集積回路装置の配線電極
JP2004243701A (ja) * 2003-02-14 2004-09-02 Toyo Kohan Co Ltd 合金層積層体および合金層積層体を用いた部品
JP2005129899A (ja) * 2003-08-28 2005-05-19 Kyocera Corp 配線基板および半導体装置
JP4817733B2 (ja) * 2005-07-06 2011-11-16 富士通株式会社 金属表面処理液、積層体および積層体の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105744740A (zh) * 2014-12-29 2016-07-06 三星电机株式会社 印刷电路板及其制造方法
CN108987039A (zh) * 2017-06-05 2018-12-11 三星电机株式会社 线圈组件及其制造方法
CN108987039B (zh) * 2017-06-05 2021-10-29 三星电机株式会社 线圈组件及其制造方法

Also Published As

Publication number Publication date
KR20080090285A (ko) 2008-10-08
JP2008277749A (ja) 2008-11-13
TW200841793A (en) 2008-10-16

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20081008