1306367 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種半導體封裝用軟性電路基板及其製 這方法，尤有關一種在絕緣膜上形成電路圖案的軟性電路 基板及其製造方法。 【先前技術】 使用聚醯亞胺（P〇lyimide)膜等做為絕緣膜之電路基 ，’係由於具有薄型化與輕化量的優點，故普遍使用於捲 •帶式自動接合(Tape Automated Bonding，簡稱TAB)捲帶 與軟性電路基板的製造上。特別是近來，因電路圖案的高 费度化之要求，適用於細微電路的形成，故被應用在具有 電路密著性與絕緣可靠性的2層材料上。該2層材料，係 使用濺鍍法在聚醯亞胺等絕緣膜上形成鎳/鉻等金屬化 層在其上藉由鍍銅等可形成並得到期望的金屬層。 、習知的軟性電路基板的製造方法如下所示。該製造方 _法係例如揭示於日本特開2005-191525號公報。第2圖係 為用以顯示習知之軟性電路基板的製造方法，而顯示各步 驟中的軟性電路基板之剖面圖。 如第2圖（3)所示，在聚醯亞胺膜（1)上形成鎳/鉻合 金的金屬化層（3)，在其上以鍍銅形成金屬層（4)，在金屬 層⑷的表面形成以㈣形成電路圖案用的光阻⑸。又於 聚醯亞胺膜⑴在’形成金屬化層⑶之際，產生表面變質層 (2)。 接著，如第2圖（b)所示，使用氯化銅、氣化鐵溶液等 318353 5 1306367 :土路出於光阻開口部的金屬層⑷及金屬化層⑶以形成 電路圖案。之後，去除光阻（5)。 如第2圖㈦所示，溶解金屬化層⑶中在電路 從金屬層⑷之下露出(突出並殘留)的部分。該溶 '、例如市售的鎳/鉻選擇蝕刻液（例如，MEC股份有 限公司製造’品名：脈去除劑（咖 CH1920)。 現 藉由：融解’電路圖案外周的金屬化層⑶的露出雖消 ’但如第2圖（c)所示，露出於電路圖案間的絕緣膜⑴ 面係殘留3有原為金屬化層之金屬成分的表面變質層 (2)〇 因此，如第2圖（d)所示，為得到絕緣可靠性，將絕緣 膜（1)表面含有金屬成分的表面變質層（2)厚厚地去除。 —之後，依照需求在電路圖案上形成絕緣保護膜，或者 如第2圖⑷所示’在露出的電路圖案表面施 鲁錫等冀望的鍍覆（6)。 '、 ’ 如同上述習知的軟性電路基板之製造方法中，在去除 絕緣膜（1)表面含有金屬成分的表面變質層⑵之際，因須 以強力的蝕刻液充分的去除，故如第2圖（(1)之放大所示， 連電路圖案下側的絕緣膜⑴都被溶解，在施行後段步驟的 鍍覆（6)鎳或錫或金等之際，職渗入被溶解的絕緣膜⑴ 與電路圖案之間，而導致電路密著性降低之問題。 此外如第2圖（b)所示在沒有去除電路外周部的金屬 化層（3)的原始狀態，只要一施加鍍覆（6)鎳、金、錫的話， 318353 6 1306367 會鑛覆至殘留的電路外周部的金屬化層（3 )，致使電路圖案 間的空間變小，在細間距的製品中，會有難以得到充分的 電路圖案間空間之問題。 此外，在日本特開2005-210058號公報，為提昇密著 性SX置基材金屬層，為使該基材金屬層從電路圖案僅露出 預定的寬度，分別使用兩種處理液二度蝕刻電路圖案。但 是，由於該處理步驟複雜，會有提高製造費用的問題。 專利文獻1 .日本特開2005-191525號公報 專利文獻2 .日本特開2 〇 〇 5 - 21 〇 〇 5 8號公報 【發明内容】 (發明欲解決的課題） 本發明的目的係為提供一種不會溶解電路圖案下侧的 絕緣膜，且維持電路圖案與絕緣膜間的電路密著性，而能 在細間距製品中充分地維持電路圖案間的冑間之軟性電路 基板及其製造方法。 (解決課題的手段） 、本發明的軟性電路基板之製造方法，係使用具有·以 濺鍍法在絕緣膜之至少單側面所形成的金屬化層、鱼 在該金屬化層上的金屬層之軟性·基板用材料，^餘 法將前述金屬化層及前述金屬層形成敎的電路圖案，二 去除露出於前述電路圖案間的絕緣膜的表面變質居後 除殘留在表面變質層上的金屬化層之從前述金心 ： 出的部分。 ^万露 而且，前述金屬化層係、最好為含有錄與從鉻、鈦、鹤、 318353 7 1306367 錮及鋼組成^群组中選出的至少—種以上之錄合金。 係最述金屬層係最好為銅或銅合金，前述絕緣膜 你敢好為聚酿亞胺臈。 η 明的軟性電路基板，係具有··以雜法在絕緣膜 的」單側面所形成的金屬化層、與形成在該金屬化層上 :金屬層所製成的狀電路圖案，其中，前述濺鍍法所導 緣朗表㈣f層在前述電路圖㈣於俯視觀 仗别述電路圖案僅露出預定的寬度。 =且’於俯視觀察時從前述電路圖案露出的前述表面 、曰的寬度係最好為5#ηι以下。 再且，别述金屬化層係最好為含有鎳與從鉻、鈦、鎢 翻及鋼組成之群組中選出的至少—種以上的錄合金。‘ 円並且月U述金屬層係最好為銅或銅合金，前述絕緣 係最好為聚醯亞胺膜。 、、 (發明的效果） • 依據本發明，可得到不會溶解並錢電路圖案盘絕緣 膜之間’、且電路密著性變佳之效果。更且，因電路圖案外 周不會殘留露出的金屬化層，故電路圖案間的空間不會變 狹小’而能提供高可靠性的軟性電路基板。 【實施方式】 本發明係使用具有以濺鍍法在絕緣膜至少單側之面形 成的金屬化層、與在該金屬化層上形成的金 路基板用材料。 電 百先，在軟性電路基板用材料上積層光阻，並曝光及 318353 8 1306367 顯影預定的電路圖案，形成作為關㈣料圖荦。 接著^行喷灑式_(取心灿叫）金屬層與金屬 用二趟酿^的電路圖案後，_光阻。_係最好使 2 Μ 及過氧化氫（hydrGgen如咖i如）為主成 :、：化銅系蝕刻液。此時，形成了電路圖案的下側外周 。’系殘留5"以下的金屬化層，並從金屬層之下露出。 ，外在電路圖案之間，係露出以誠法形成金屬化層時 產生的表面變質層。 .·、將該超出電路圖案下側外周部之殘留的金屬化層作為 遮罩，去除表面變質層，之後，去除電路圖案的下侧外周 部所殘留的金屬化層。為钱刻表面變質層’最好使用以過 鐘酸鉀（potassium permanganate)及氫氧化鈉（⑽心⑽ hydroxide)為主成分的驗（alkaU)㈣㈣溶液。此外， 為钮刻電路圖案的下侧外周部所殘留的金屬化層，最好使 用以鹽酸及硫酸為主成分的鹽酸系鎳/絡敍刻液。因此， 鲁在去除表面„層後，由於去除電路圖案的下侧外周部所 殘留的金屬化層，故表面變質層係從電路圖案的下侧外周 部以5 # m以下的寬度剩餘殘留著。 最後，在开> 成的電路圖案表面施行鎮覆。 依據上述，製造本發明的軟性電路基板。 (實施例1至3) ★以下，、關於本發明的實施例！至3使用第i圖來說明。 第1圖係為用以顯示本發明的軟性電路基板的製造方法之 一實施例，顯示各步驟的軟性電路基板之剖面圖。 318353 9 1306367 使用以濺鍍法在厚度38 // m的聚醯亞胺膜的絕緣膜（1) 上形成厚度170 A的Ni(鎳）/Cr (鉻）金屬化層（3)，與形 成厚度8 /z m的銅箔層（4)之軟性電路基板用材料。在聚醯 亞胺膜（1)係由於形成金屬化層（3)之際的濺鍍法，而產生 厚度20nm的表面變質層（2)。 首先’如第1圖（a)所示’在軟性電路基板用材料上積 層乾膜光阻（dry film photo resist)(5)，且曝光及顯影 預定的電路圖案’並形成光阻圖案。 • 接著，使用氯化銅溶液施行噴灑式蝕刻，形成電路圖 案’再使用氫氧化鈉水溶液剝離及去除光阻。 以顯微鏡觀察得到的配線圖案時，如第1圖（b)所示， 能夠確認殘留著金屬化層（3)並以包圍電路圖案的下側外 周部之方式從金屬層（4)下方露出。 更且，以溫度40°C的條件浸泡在過錳酸鉀濃度5〇g// 卜氫氧化鈉濃度40g/l的溶液90秒，如第i圖所示， 鲁去除表面變質層（2)。 _更且，使用市售的鎳/鉻選擇蝕刻液（MEC股份有限公 司製造，品名：MEC去除劑，型號：CH192〇)，以溫度4〇 C的條件/X/包ι8〇秒’如第i圖⑷所示，去除電路圖案的 I側外周部所殘留的金屬化層⑶。第1圖⑷係放大顯示 -部份。表面變質層⑵係從電路圖案的下側外周部以 以下的寬度剩餘殘留著。 最後’如帛i圖⑹所示，在形成的電路圖案表面施行 318353 10 1306367 關於依據上述方式所得到的軟性電路基板，藉由 TENSIL0N(0RIENTECC0RP0RATI0N 製，型號 trm-50)測量剝 離強度（peel strength)。測量結果如表丨所示。 [表1 ] 電路圖案寬度 (U m) 剝離強度 (N/m) 實施例1 30 5. 1 貫施例2 50 5.2 實施例3 100 5. 5 (習知例1至3) 為了比較，依據習知施行方式製造了軟性電路基板。 關於習知技術的習知例i至3，使用第2圖來說明。 使用以濺鍍法在厚度38# m的聚醯亞胺膜的絕緣膜 上形成厚度170 A的Ni/Cr*金屬化層（3)，與厚度8/^m 的銅箔層（4)之軟性電路基板用材料。在聚醯亞胺臈（1)係 籲由於形成金屬化層（3)之際的濺鍍法，而產生厚度2〇nm的 表面變質層（2)。 首先，如第2圖（a)所示，在軟性電路基板用材料上積 層乾膜光阻（5)，且曝光及顯影預定的電路圖案，並形成光 阻圖案β 接著，使用氣化銅溶液施行喷灑式蝕刻，形成電路圖 案，再使用氫氧化鈉水溶液剝離及去除光阻。 以顯微鏡觀察得到的配線圖案時，如第2圖（b)所示， 能夠確認殘留著金屬化層⑶並以包圍電路圖案的下侧外 318353 11 1306367 周邛之方式從金屬層（4)下方露出。 司=且’使用市售的錄/絡選擇钱刻液（歌股份有限公 ^ ’品名：MEC去除劑，型號：CH192〇)，以溫度4〇 、條件浸泡180秒，如第2圖⑷所示，去除電路圖案的 下侧外周部所殘留的金屬化層。 产更且，以溫度4〇。(：的條件浸泡在過錳酸鉀濃度5〇容/ 卜氫氧化鈉濃度4〇g/1的溶液9〇秒，如第2圖〇)所示， 去除表面變質層（2)。 齡最後，如第2圖（e)所示，在形成的電路圖案表面施行 鍍錫（6)。[Technical Field] The present invention relates to a flexible circuit board for semiconductor package and a method of manufacturing the same, and more particularly to a flexible circuit board in which a circuit pattern is formed on an insulating film and a method of manufacturing the same. [Prior Art] The use of a polyfluorene (P〇lyimide) film or the like as a circuit base for an insulating film is generally used for roll-to-belt automatic bonding (Tape Automated) because of its advantages of thinness and light weight. Bonding, referred to as TAB) is the manufacture of tape and flexible circuit substrates. In particular, recently, it has been applied to a two-layer material having circuit adhesion and insulation reliability because of the high cost of the circuit pattern and the application to the formation of a fine circuit. In the two-layer material, a metallization layer such as nickel/chromium is formed on an insulating film such as polyimide by sputtering, and a desired metal layer can be formed by copper plating or the like. A conventional method of manufacturing a flexible circuit board is as follows. This manufacturing method is disclosed, for example, in Japanese Laid-Open Patent Publication No. 2005-191525. Fig. 2 is a cross-sectional view showing a flexible circuit board in each step for displaying a conventional method of manufacturing a flexible circuit board. As shown in Fig. 2 (3), a metallization layer (3) of a nickel/chromium alloy is formed on the polyimide film (1), and a metal layer (4) is formed thereon by copper plating, and the metal layer (4) is formed thereon. The surface is formed with (4) a photoresist (5) for forming a circuit pattern. Further, when the polyimide film (1) is formed to form the metallization layer (3), the surface deterioration layer (2) is produced. Next, as shown in Fig. 2(b), a copper chloride, a vaporized iron solution or the like is used, 318353 5 1306367: the earth layer (4) and the metallization layer (3) of the photoresist opening portion are formed to form a circuit pattern. After that, the photoresist (5) is removed. As shown in Fig. 2 (7), the portion of the molten metallization layer (3) where the circuit is exposed (projected and remains) from under the metal layer (4). The solution, for example, a commercially available nickel/chromium selective etching solution (for example, manufactured by MEC Co., Ltd.): product name: vein remover (Cham CH1920). Now by: melting the exposed metallization layer (3) of the circuit pattern However, as shown in Fig. 2(c), the surface of the insulating film (1) exposed between the circuit patterns has three surface-degraded layers (2) which are originally metal components of the metallization layer. Therefore, as shown in Fig. 2 (Fig. 2) d), in order to obtain insulation reliability, the surface deterioration layer (2) containing a metal component on the surface of the insulating film (1) is removed thickly. - Thereafter, an insulating protective film is formed on the circuit pattern as required, or as in the second Fig. 4 shows a plating (6) on the surface of the exposed circuit pattern, such as Schrüssie. ', ' As in the conventional method for manufacturing a flexible circuit substrate, the surface of the insulating film (1) is removed to contain a metal component. In the surface deterioration layer (2), since it is sufficiently removed by a strong etching liquid, as shown in Fig. 2 ((1), the insulating film (1) on the lower side of the circuit pattern is dissolved, and the subsequent step is performed. Plating (6) nickel or tin or gold, etc. The problem penetrates between the dissolved insulating film (1) and the circuit pattern, causing a problem that the circuit adhesion is lowered. Further, as shown in Fig. 2(b), the original state of the metallization layer (3) at the outer peripheral portion of the circuit is not removed. As long as a plating (6) of nickel, gold or tin is applied, 318353 6 1306367 will be applied to the metallization layer (3) on the outer peripheral portion of the residual circuit, resulting in a small space between the circuit patterns, in fine pitch products. In addition, it is difficult to obtain a sufficient space between the circuit patterns. Further, in Japanese Laid-Open Patent Publication No. 2005-210058, in order to improve the adhesion SX, the base metal layer is provided so that the base metal layer is only from the circuit pattern. In the case where the predetermined width is exposed, the circuit pattern is etched twice using the two treatment liquids. However, the processing procedure is complicated, and the manufacturing cost is increased. Patent Document 1. Japanese Patent Laid-Open Publication No. 2005-191525. OBJECTS OF THE INVENTION [Problem to be Solved by the Invention] An object of the present invention is to provide an insulating film which does not dissolve the underside of a circuit pattern and maintains the circuit A flexible circuit board capable of sufficiently maintaining a turn between circuit patterns in a fine pitch product and a method of manufacturing the same, and a method of manufacturing the same, and a flexible circuit board of the present invention In the manufacturing method, a metallization layer having a metallization layer formed on at least one side surface of the insulating film by sputtering or a metal layer of a metal layer on the metallization layer is used, and the metallization layer is used. And the metal layer forms a circuit pattern of the germanium, and the surface of the insulating film exposed between the circuit patterns is removed, and the portion of the metallization layer remaining on the surface alteration layer from the gold core is removed. Further, the metallization layer is preferably an alloy containing at least one selected from the group consisting of chromium, titanium, crane, 318353 7 1306367 锢 and steel. It is preferable that the metal layer is the copper or copper alloy, and the above-mentioned insulating film is good for the brewing of the imine. The flexible circuit board of the present invention has a metallization layer formed on one side surface of the insulating film by a dummy method, and a circuit pattern formed on the metallization layer: a metal layer. According to the sputtering method, the f-layer is in the above-mentioned circuit diagram (4). The circuit pattern is only exposed to a predetermined width in a plan view. The width of the surface and the ridge which is exposed from the circuit pattern in a plan view is preferably 5# ηι or less. Further, it is preferable that the metallization layer is at least one type of alloy selected from the group consisting of nickel and chromium, titanium, tungsten, and steel. Preferably, the metal layer is preferably copper or a copper alloy, and the insulating layer is preferably a polyimide film. (Effects of the Invention) According to the present invention, it is possible to obtain an effect of not improving the circuit adhesion between the circuit board and the insulating film. Further, since the exposed metallization layer does not remain in the periphery of the circuit pattern, the space between the circuit patterns does not become small, and a highly reliable flexible circuit board can be provided. [Embodiment] In the present invention, a metallization layer having a surface formed on at least one side of an insulating film by a sputtering method and a material for a gold substrate formed on the metallization layer are used. In the first place, a photoresist is laminated on the material for the flexible circuit substrate, and the predetermined circuit pattern is developed by exposure and 318353 8 1306367, and formed as a (four) material pattern. Then ^ spray type _ (take the heart can be called) metal layer and metal with the second circuit brewing ^ circuit pattern, _ photoresist. _ is best to make 2 Μ and hydrogen peroxide (hydrGgen such as coffee i) as the main: :, copper-based etching solution. At this time, the lower outer circumference of the circuit pattern is formed. The following metallization layer is left and exposed from below the metal layer. Between the external circuit patterns, a surface deterioration layer which is formed when the metallization layer is formed by a method is exposed. The metallized layer remaining beyond the outer peripheral portion of the lower side of the circuit pattern is used as a mask to remove the surface-degraded layer, and then the metallized layer remaining on the lower outer peripheral portion of the circuit pattern is removed. It is preferable to use a test solution (alkaU) (four) (iv) which is mainly composed of potassium permanganate and sodium hydroxide (10) hydroxide. Further, it is preferable that the metallization layer remaining on the outer peripheral portion of the lower side of the button circuit pattern is a hydrochloric acid-based nickel/complex which is mainly composed of hydrochloric acid and sulfuric acid. Therefore, after removing the surface layer, the metallization layer remaining on the lower outer peripheral portion of the circuit pattern is removed, so that the surface deterioration layer remains remaining at a width of 5 # m or less from the lower outer peripheral portion of the circuit pattern. Finally, the surface of the circuit pattern formed is opened. The flexible circuit board of the present invention is manufactured according to the above. (Embodiments 1 to 3) ★ Hereinafter, the embodiment of the present invention is used! BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a flexible circuit board showing the steps of the present invention, showing a flexible circuit board of the present invention. 318353 9 1306367 Using a sputtering method at a thickness of 38 // m a Ni (nickel) / Cr (chromium) metallization layer (3) having a thickness of 170 A and a soft circuit forming a copper foil layer (4) having a thickness of 8 /zm on the insulating film (1) of the polyimide film A material for a substrate. A surface-deformed layer (2) having a thickness of 20 nm is produced by a sputtering method in which a polyimide layer (1) is formed by forming a metallized layer (3). First, as shown in Fig. 1 (a) Show 'Laminating film photoresist on the material for flexible circuit substrates (dry film ph Oto resist) (5), and exposing and developing a predetermined circuit pattern 'and forming a photoresist pattern. · Next, spray etching is performed using a copper chloride solution to form a circuit pattern', and then removing and removing the photoresist using an aqueous solution of sodium hydroxide When the wiring pattern obtained by the microscope is observed, as shown in FIG. 1(b), it can be confirmed that the metallized layer (3) remains and is exposed from the lower side of the metal layer (4) so as to surround the lower outer peripheral portion of the circuit pattern. Further, the solution was immersed in a solution of potassium permanganate concentration of 5 〇g / / sodium hydroxide concentration of 40 g / l for 90 seconds at a temperature of 40 ° C, as shown in Fig. i, the surface metamorphic layer was removed. _More, use a commercially available nickel/chromium selective etching solution (manufactured by MEC Co., Ltd., product name: MEC remover, model: CH192〇) at a temperature of 4 〇C /X/包 ι 8 〇 seconds' As shown in Fig. 4(4), the metallization layer (3) remaining on the outer peripheral portion of the first side of the circuit pattern is removed. Fig. 1(4) shows an enlarged portion. The surface deterioration layer (2) is from the lower outer peripheral portion of the circuit pattern. The width remains remaining. Finally 'as shown in Figure 6 (6), in the formation Circuit pattern surface application 318353 10 1306367 Regarding the flexible circuit substrate obtained in the above manner, the peel strength was measured by TENSIL0N (manufactured by 0RIENTECC0RP0RATI0N, model trm-50). The measurement results are shown in Table 。. Circuit pattern width (U m ) Peel strength (N/m) Example 1 30 5. 1 Example 2 50 5.2 Example 3 100 5. 5 (Prevention Examples 1 to 3) For comparison, according to a conventional manner A flexible circuit substrate was manufactured. The conventional examples i to 3 of the prior art are described using Fig. 2 . A Ni/Cr* metallization layer (3) having a thickness of 170 A and a copper foil layer (4) having a thickness of 8/m are formed on the insulating film of the polyimide film having a thickness of 38 #m by sputtering. A material for a flexible circuit board. In the polyimine oxime (1), a surface alteration layer (2) having a thickness of 2 〇 nm is produced by a sputtering method at the time of forming the metallization layer (3). First, as shown in Fig. 2(a), a dry film photoresist (5) is laminated on a material for a flexible circuit board, and a predetermined circuit pattern is exposed and developed to form a photoresist pattern β. Next, a vaporized copper solution is used. Spray etching is performed to form a circuit pattern, and the photoresist is stripped and removed using an aqueous solution of sodium hydroxide. When the wiring pattern obtained by the microscope is observed, as shown in FIG. 2(b), it can be confirmed that the metallization layer (3) remains and is surrounded by the metal layer (4) so as to surround the lower side of the circuit pattern 318353 11 1306367. Exposed. Division = and 'use the commercially available record / network to choose money engraving liquid (Song shares limited public ^ 'product name: MEC remover, model: CH192 〇), soaked for 180 seconds at a temperature of 4 〇, as shown in Figure 2 (4) It is shown that the metallization layer remaining on the outer peripheral portion of the lower side of the circuit pattern is removed. Production is more, with a temperature of 4 〇. (: The condition is immersed in a solution of potassium permanganate concentration of 5 / / 氢氧化钠 sodium hydroxide concentration of 4 〇 g / 1 for 9 〇 seconds, as shown in Figure 2), to remove the surface metamorphic layer (2). At the end of the age, as shown in Fig. 2(e), tin plating (6) is applied to the surface of the formed circuit pattern.
關於依據上述方式所得到的軟性電路基板，藉由 TENSIL0N(0RIENTEC C0RP0RATI0N 製，型號 TRM_5〇a)測量剝 離強度（peel Strength)。測量結果如表2所示。由表J 及表2與習知例1至3比較，可得知在本發明實施例i至 3 ’係提昇剝離強度。 [表2] 電路圖案寬度 (β m) 剝離強度 (N/m) 實施例1 25 4. 3 實施例2 30 4. 6 實施例3 50 5. 1 【圖式簡單說明】 第1圖（a)至（e)係為用以顯示本發明的軟性電路基板 的製造方法之一實施例’顯示各步驟的軟性電路基板之剖 318353 12 1306367 面圖。 第2圖（a)至（e)係為用以顯示習知的軟性電路基板的 製造方法，顯示各步驟的軟性電路基板之剖面圖。 【主要元件符號說明】 1 絕緣膜 2 絕緣膜變質的表面變質層 3 金屬化層 4 金屬層 5 光阻 6 鍍覆Regarding the flexible circuit board obtained in the above manner, the peel strength was measured by TENSIL0N (manufactured by 0RIENTEC C0RP0RATI0N, model TRM_5〇a). The measurement results are shown in Table 2. Comparing Tables J and 2 with the conventional examples 1 to 3, it is understood that the examples i to 3' of the present invention enhance the peel strength. [Table 2] Circuit pattern width (β m) Peel strength (N/m) Example 1 25 4. 3 Example 2 30 4. 6 Example 3 50 5. 1 [Simple description of the drawing] Fig. 1 (a (e) is a cross-sectional view showing a section 318353 12 1306367 of a flexible circuit board showing each step of the method for manufacturing the flexible circuit board of the present invention. Fig. 2 (a) to (e) are cross-sectional views showing a method of manufacturing a flexible circuit board, and showing a flexible circuit board in each step. [Main component symbol description] 1 Insulation film 2 Surface deterioration layer of insulating film deterioration 3 Metallization layer 4 Metal layer 5 Photoresist 6 Plating
13 31835313 318353