JP2012173708A5 - - Google Patents
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- Publication number
- JP2012173708A5 JP2012173708A5 JP2011038559A JP2011038559A JP2012173708A5 JP 2012173708 A5 JP2012173708 A5 JP 2012173708A5 JP 2011038559 A JP2011038559 A JP 2011038559A JP 2011038559 A JP2011038559 A JP 2011038559A JP 2012173708 A5 JP2012173708 A5 JP 2012173708A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- plating layer
- manufacturing
- plating
- engineering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 20
- 239000011347 resin Substances 0.000 claims 18
- 229920005989 resin Polymers 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011038559A JP5804726B2 (ja) | 2011-02-24 | 2011-02-24 | 微細構造体の製造方法 |
| US13/399,651 US9040227B2 (en) | 2011-02-24 | 2012-02-17 | Microstructure manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011038559A JP5804726B2 (ja) | 2011-02-24 | 2011-02-24 | 微細構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012173708A JP2012173708A (ja) | 2012-09-10 |
| JP2012173708A5 true JP2012173708A5 (enExample) | 2014-04-10 |
| JP5804726B2 JP5804726B2 (ja) | 2015-11-04 |
Family
ID=46719212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011038559A Expired - Fee Related JP5804726B2 (ja) | 2011-02-24 | 2011-02-24 | 微細構造体の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9040227B2 (enExample) |
| JP (1) | JP5804726B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013120126A (ja) * | 2011-12-07 | 2013-06-17 | Canon Inc | 微細構造体、およびその微細構造体を備えた撮像装置 |
| CN104622492A (zh) * | 2013-11-11 | 2015-05-20 | 中国科学技术大学 | 一种x射线光栅相位衬度成像装置和方法 |
| US10460999B2 (en) | 2013-11-27 | 2019-10-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metrology device and metrology method thereof |
| DE102017202312B4 (de) * | 2017-02-14 | 2018-10-04 | Siemens Healthcare Gmbh | Verfahren zur Herstellung eines Röntgen-Streustrahlenrasters |
| EP3534377B1 (de) | 2018-02-28 | 2021-11-17 | Siemens Healthcare GmbH | Verfahren zur herstellung eines mikrostrukturbauteils |
| EP3534376A1 (de) | 2018-02-28 | 2019-09-04 | Siemens Healthcare GmbH | Verfahren zur herstellung eines mikrostrukturbauteils, mikrostrukturbauteil und röntgengerät |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080121343A1 (en) * | 2003-12-31 | 2008-05-29 | Microfabrica Inc. | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates |
| US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
| JP2006161124A (ja) * | 2004-12-09 | 2006-06-22 | Canon Inc | 貫通電極の形成方法 |
| JP2007010713A (ja) | 2005-06-28 | 2007-01-18 | Seiko Epson Corp | 光学素子の製造方法、投射型表示装置 |
| JP4642818B2 (ja) * | 2007-08-02 | 2011-03-02 | 株式会社ナノクリエート | 回折格子の製造方法 |
| JP5243786B2 (ja) * | 2007-12-28 | 2013-07-24 | サンリツオートメイション株式会社 | リモートｉ／ｏシステム及びリモートｉ／ｏシステムにおける時刻同期方法 |
| JP4663742B2 (ja) * | 2008-01-16 | 2011-04-06 | 株式会社ナノクリエート | 回折格子の製造方法 |
| JP5627247B2 (ja) * | 2010-02-10 | 2014-11-19 | キヤノン株式会社 | マイクロ構造体の製造方法および放射線吸収格子 |
| JP5744407B2 (ja) * | 2010-02-23 | 2015-07-08 | キヤノン株式会社 | マイクロ構造体の製造方法 |
-
2011
- 2011-02-24 JP JP2011038559A patent/JP5804726B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-17 US US13/399,651 patent/US9040227B2/en not_active Expired - Fee Related
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