JP2016206670A5 - - Google Patents
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- JP2016206670A5 JP2016206670A5 JP2016082149A JP2016082149A JP2016206670A5 JP 2016206670 A5 JP2016206670 A5 JP 2016206670A5 JP 2016082149 A JP2016082149 A JP 2016082149A JP 2016082149 A JP2016082149 A JP 2016082149A JP 2016206670 A5 JP2016206670 A5 JP 2016206670A5
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- JP
- Japan
- Prior art keywords
- layer
- mask
- forming
- resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229910045601 alloy Inorganic materials 0.000 claims description 36
- 239000000956 alloy Substances 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 239000007864 aqueous solution Substances 0.000 claims description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 230000002378 acidificating effect Effects 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229910017052 cobalt Inorganic materials 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 229940079877 pyrogallol Drugs 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- -1 polyoxyethylene Polymers 0.000 claims description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000007650 screen-printing Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 230000008602 contraction Effects 0.000 claims 1
- 238000005323 electroforming Methods 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000004693 Polybenzimidazole Substances 0.000 description 3
- 229920002480 polybenzimidazole Polymers 0.000 description 3
- 238000003847 radiation curing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015087166 | 2015-04-21 | ||
| JP2015087166 | 2015-04-21 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016206670A JP2016206670A (ja) | 2016-12-08 |
| JP2016206670A5 true JP2016206670A5 (enExample) | 2019-04-25 |
| JP6829859B2 JP6829859B2 (ja) | 2021-02-17 |
Family
ID=57144437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016082149A Active JP6829859B2 (ja) | 2015-04-21 | 2016-04-15 | マスクの形成方法、これを利用したプリント配線基板の製造方法、電鋳部品の製造方法およびスクリーン印刷製版の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6829859B2 (enExample) |
| CN (1) | CN107533298B (enExample) |
| TW (1) | TWI693485B (enExample) |
| WO (1) | WO2016171074A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110100047B (zh) * | 2016-12-23 | 2022-04-01 | 3M创新有限公司 | 电铸微结构制品的方法 |
| TWI651994B (zh) * | 2018-03-06 | 2019-02-21 | 易華電子股份有限公司 | 提升乾膜與基材結合穩固性之系統 |
| TWI669404B (zh) * | 2018-06-06 | 2019-08-21 | 張東暉 | 金屬蒸鍍遮罩結構 |
| CN121704129A (zh) | 2019-04-26 | 2026-03-20 | 默克专利有限公司 | 制造固化膜的方法及其使用 |
| DE102020209767A1 (de) * | 2020-08-03 | 2022-02-03 | Gebr. Schmid Gmbh | Verfahren zur Leiterplattenherstellung |
| JP7478262B2 (ja) * | 2020-12-24 | 2024-05-02 | 京セラ株式会社 | スクリーン印刷製版およびスクリーン印刷装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3541360B2 (ja) * | 2002-05-17 | 2004-07-07 | 独立行政法人 科学技術振興機構 | 多層回路構造の形成方法及び多層回路構造を有する基体 |
| JP2004058640A (ja) * | 2002-07-29 | 2004-02-26 | Needs:Kk | スクリーン印刷用印刷版 |
| JP2005039097A (ja) * | 2003-07-16 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 銅箔の配線形成方法と配線転写基材及び配線基板 |
| JP2005136223A (ja) * | 2003-10-30 | 2005-05-26 | Fuji Photo Film Co Ltd | プリント配線板の製造方法 |
| JP2006156605A (ja) * | 2004-11-29 | 2006-06-15 | Matsushita Electric Works Ltd | 多層回路基板の製造方法 |
| JP4715234B2 (ja) * | 2005-02-28 | 2011-07-06 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法 |
| JP2007334058A (ja) * | 2006-06-15 | 2007-12-27 | Murata Mfg Co Ltd | スクリーン印刷用版およびその製造方法 |
| JP5232487B2 (ja) * | 2007-02-22 | 2013-07-10 | 富士フイルム株式会社 | 平版印刷版原版および平版印刷方法 |
| KR20110118803A (ko) * | 2009-04-20 | 2011-11-01 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 감광성 수지 적층체 |
| JP5422696B2 (ja) * | 2011-04-28 | 2014-02-19 | 株式会社北陸濾化 | 表面改質処理剤および表面改質方法 |
| JP2014051575A (ja) * | 2012-09-06 | 2014-03-20 | Tosoh Corp | 洗浄組成物 |
| JP6068123B2 (ja) * | 2012-12-14 | 2017-01-25 | 上村工業株式会社 | プリント配線基板の製造方法およびその方法により製造されたプリント配線基板 |
-
2016
- 2016-04-15 JP JP2016082149A patent/JP6829859B2/ja active Active
- 2016-04-15 CN CN201680023007.2A patent/CN107533298B/zh active Active
- 2016-04-15 WO PCT/JP2016/062057 patent/WO2016171074A1/ja not_active Ceased
- 2016-04-19 TW TW105112155A patent/TWI693485B/zh active
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