CN107533298B - 掩模的形成方法及利用了其的印刷配线基板的制造方法 - Google Patents

掩模的形成方法及利用了其的印刷配线基板的制造方法 Download PDF

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Publication number
CN107533298B
CN107533298B CN201680023007.2A CN201680023007A CN107533298B CN 107533298 B CN107533298 B CN 107533298B CN 201680023007 A CN201680023007 A CN 201680023007A CN 107533298 B CN107533298 B CN 107533298B
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layer
base material
mask
resin
material layer
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Chinese (zh)
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CN107533298A (zh
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森家英幸
森家圭一郎
森家洋晃
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Hokuriku Filtration Co ltd
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Hokuriku Filtration Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CN201680023007.2A 2015-04-21 2016-04-15 掩模的形成方法及利用了其的印刷配线基板的制造方法 Active CN107533298B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-087166 2015-04-21
JP2015087166 2015-04-21
PCT/JP2016/062057 WO2016171074A1 (ja) 2015-04-21 2016-04-15 マスクの形成方法、これを利用したプリント配線基板の製造方法、電鋳部品の製造方法およびスクリーン印刷製版の製造方法

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Publication Number Publication Date
CN107533298A CN107533298A (zh) 2018-01-02
CN107533298B true CN107533298B (zh) 2021-06-22

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JP (1) JP6829859B2 (enExample)
CN (1) CN107533298B (enExample)
TW (1) TWI693485B (enExample)
WO (1) WO2016171074A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200087808A1 (en) * 2016-12-23 2020-03-19 3M Innovative Properties Company Method of electroforming microstructured articles
TWI651994B (zh) * 2018-03-06 2019-02-21 易華電子股份有限公司 提升乾膜與基材結合穩固性之系統
TWI669404B (zh) * 2018-06-06 2019-08-21 張東暉 金屬蒸鍍遮罩結構
JP7429712B2 (ja) 2019-04-26 2024-02-08 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 硬化膜の製造方法、およびその使用
DE102020209767A1 (de) 2020-08-03 2022-02-03 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung
WO2022138824A1 (ja) * 2020-12-24 2022-06-30 京セラ株式会社 スクリーン印刷製版およびスクリーン印刷装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004058640A (ja) * 2002-07-29 2004-02-26 Needs:Kk スクリーン印刷用印刷版
CN1612048A (zh) * 2003-10-30 2005-05-04 富士胶片株式会社 印刷电路板的制造方法
CN1653873A (zh) * 2002-05-17 2005-08-10 独立行政法人科学技术振兴机构 多层电路结构的形成方法和具有多层电路结构的基体
JP2006235499A (ja) * 2005-02-28 2006-09-07 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法
JP2007334058A (ja) * 2006-06-15 2007-12-27 Murata Mfg Co Ltd スクリーン印刷用版およびその製造方法
JP2012237064A (ja) * 2011-04-28 2012-12-06 Hokuriku Roka:Kk 表面改質処理剤および表面改質方法
TW201433231A (zh) * 2012-12-14 2014-08-16 Uyemura C & Co Ltd 印刷電路板之製造方法及利用該方法製造的印刷電路板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039097A (ja) * 2003-07-16 2005-02-10 Matsushita Electric Ind Co Ltd 銅箔の配線形成方法と配線転写基材及び配線基板
JP2006156605A (ja) * 2004-11-29 2006-06-15 Matsushita Electric Works Ltd 多層回路基板の製造方法
JP5232487B2 (ja) * 2007-02-22 2013-07-10 富士フイルム株式会社 平版印刷版原版および平版印刷方法
KR101617507B1 (ko) * 2009-04-20 2016-05-02 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 적층체
JP2014051575A (ja) * 2012-09-06 2014-03-20 Tosoh Corp 洗浄組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1653873A (zh) * 2002-05-17 2005-08-10 独立行政法人科学技术振兴机构 多层电路结构的形成方法和具有多层电路结构的基体
JP2004058640A (ja) * 2002-07-29 2004-02-26 Needs:Kk スクリーン印刷用印刷版
CN1612048A (zh) * 2003-10-30 2005-05-04 富士胶片株式会社 印刷电路板的制造方法
JP2006235499A (ja) * 2005-02-28 2006-09-07 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法
JP2007334058A (ja) * 2006-06-15 2007-12-27 Murata Mfg Co Ltd スクリーン印刷用版およびその製造方法
JP2012237064A (ja) * 2011-04-28 2012-12-06 Hokuriku Roka:Kk 表面改質処理剤および表面改質方法
TW201433231A (zh) * 2012-12-14 2014-08-16 Uyemura C & Co Ltd 印刷電路板之製造方法及利用該方法製造的印刷電路板

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Publication number Publication date
TW201702766A (zh) 2017-01-16
CN107533298A (zh) 2018-01-02
JP6829859B2 (ja) 2021-02-17
JP2016206670A (ja) 2016-12-08
TWI693485B (zh) 2020-05-11
WO2016171074A1 (ja) 2016-10-27

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