JP2015019107A5 - - Google Patents
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- Publication number
- JP2015019107A5 JP2015019107A5 JP2014203471A JP2014203471A JP2015019107A5 JP 2015019107 A5 JP2015019107 A5 JP 2015019107A5 JP 2014203471 A JP2014203471 A JP 2014203471A JP 2014203471 A JP2014203471 A JP 2014203471A JP 2015019107 A5 JP2015019107 A5 JP 2015019107A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- rolled
- layer
- electrolytic
- electrolytic copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 103
- 239000011889 copper foil Substances 0.000 claims 76
- 229910052802 copper Inorganic materials 0.000 claims 27
- 239000010949 copper Substances 0.000 claims 27
- 238000005530 etching Methods 0.000 claims 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 11
- 229910045601 alloy Inorganic materials 0.000 claims 8
- 239000000956 alloy Substances 0.000 claims 8
- 239000007864 aqueous solution Substances 0.000 claims 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 7
- 229910052737 gold Inorganic materials 0.000 claims 7
- 239000010931 gold Substances 0.000 claims 7
- 229910052709 silver Inorganic materials 0.000 claims 7
- 239000004332 silver Substances 0.000 claims 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 6
- 229910001260 Pt alloy Inorganic materials 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims 4
- 229960003280 cupric chloride Drugs 0.000 claims 4
- 239000011888 foil Substances 0.000 claims 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 150000002739 metals Chemical class 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910001297 Zn alloy Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910000510 noble metal Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014203471A JP5937652B2 (ja) | 2009-01-29 | 2014-10-01 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009018441 | 2009-01-29 | ||
| JP2009018441 | 2009-01-29 | ||
| JP2014203471A JP5937652B2 (ja) | 2009-01-29 | 2014-10-01 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013142701A Division JP5694453B2 (ja) | 2009-01-29 | 2013-07-08 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015019107A JP2015019107A (ja) | 2015-01-29 |
| JP2015019107A5 true JP2015019107A5 (enExample) | 2015-09-03 |
| JP5937652B2 JP5937652B2 (ja) | 2016-06-22 |
Family
ID=42395530
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010548480A Active JP5457374B2 (ja) | 2009-01-29 | 2010-01-21 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
| JP2013142701A Active JP5694453B2 (ja) | 2009-01-29 | 2013-07-08 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
| JP2014203471A Active JP5937652B2 (ja) | 2009-01-29 | 2014-10-01 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010548480A Active JP5457374B2 (ja) | 2009-01-29 | 2010-01-21 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
| JP2013142701A Active JP5694453B2 (ja) | 2009-01-29 | 2013-07-08 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20110300401A1 (enExample) |
| EP (1) | EP2384101A4 (enExample) |
| JP (3) | JP5457374B2 (enExample) |
| KR (1) | KR101412795B1 (enExample) |
| CN (1) | CN102301838B (enExample) |
| MY (1) | MY164452A (enExample) |
| TW (1) | TWI539875B (enExample) |
| WO (1) | WO2010087268A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102265711B (zh) | 2008-12-26 | 2014-11-05 | 吉坤日矿日石金属株式会社 | 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 |
| KR101412795B1 (ko) * | 2009-01-29 | 2014-06-27 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 전자 회로용 압연 동박 또는 전해 동박 및 이들을 사용한 전자 회로의 형성 방법 |
| JP5232823B2 (ja) * | 2010-03-30 | 2013-07-10 | Ｊｘ日鉱日石金属株式会社 | エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 |
| JP5746876B2 (ja) * | 2011-02-16 | 2015-07-08 | Jx日鉱日石金属株式会社 | 電子回路の形成方法 |
| JP5808114B2 (ja) * | 2011-02-16 | 2015-11-10 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔、積層体及びプリント配線板 |
| JP5650023B2 (ja) * | 2011-03-03 | 2015-01-07 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
| JP5346054B2 (ja) * | 2011-03-18 | 2013-11-20 | Ｊｘ日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
| JP5558437B2 (ja) * | 2011-08-24 | 2014-07-23 | Ｊｘ日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
| JP5816045B2 (ja) * | 2011-09-30 | 2015-11-17 | Jx日鉱日石金属株式会社 | 生産性に優れたプリント配線板用銅箔及びそれを用いた積層板 |
| US9728563B2 (en) * | 2012-10-26 | 2017-08-08 | Applied Materials, Inc. | Combinatorial masking |
| KR101420543B1 (ko) * | 2012-12-31 | 2014-08-13 | 삼성전기주식회사 | 다층기판 |
| US9960135B2 (en) * | 2015-03-23 | 2018-05-01 | Texas Instruments Incorporated | Metal bond pad with cobalt interconnect layer and solder thereon |
| MY205699A (en) | 2018-04-27 | 2024-11-07 | Jx Nippon Mining & Metals Corp | Surface treated copper foil, copper clad laminate, and printed circuit board |
| RU2747969C1 (ru) * | 2020-07-21 | 2021-05-18 | Акционерное Общество "Нииэфа Им. Д.В. Ефремова" | Устройство для формирования антикоррозионных слоев на поверхности тепловыделяющих элементов |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3529350A (en) * | 1968-12-09 | 1970-09-22 | Gen Electric | Thin film resistor-conductor system employing beta-tungsten resistor films |
| US3806779A (en) * | 1969-10-02 | 1974-04-23 | Omron Tateisi Electronics Co | Semiconductor device and method of making same |
| CH587336A5 (en) * | 1974-05-29 | 1977-04-29 | Pc Products Sa | Etchant for copper printed circuits - is aq. ammoniacal soln. contg. copper chloride, ammonium formate, chloride, and carbonate together with alkali metal chlorite |
| US3986939A (en) * | 1975-01-17 | 1976-10-19 | Western Electric Company, Inc. | Method for enhancing the bondability of metallized thin film substrates |
| JPH07120564B2 (ja) * | 1989-10-02 | 1995-12-20 | 日本電解株式会社 | 抵抗層付導電材料及び抵抗層付プリント回路基板 |
| CA2070047A1 (en) * | 1991-06-28 | 1992-12-29 | Richard J. Sadey | Metal foil with improved peel strength and method for making said foil |
| TW230290B (enExample) * | 1991-11-15 | 1994-09-11 | Nikko Guruder Foreer Kk | |
| JPH0787270B2 (ja) * | 1992-02-19 | 1995-09-20 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
| JP2717911B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
| US5552234A (en) * | 1993-03-29 | 1996-09-03 | Japan Energy Corporation | Copper foil for printed circuits |
| TW289900B (enExample) * | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
| MY139405A (en) * | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
| JP3142259B2 (ja) * | 1998-11-30 | 2001-03-07 | 三井金属鉱業株式会社 | 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法 |
| JP2001111201A (ja) | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 配線板の製造方法およびそれを用いて製造された配線板 |
| US6361823B1 (en) * | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| JP3670186B2 (ja) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
| US6467160B1 (en) * | 2000-03-28 | 2002-10-22 | International Business Machines Corporation | Fine pitch circuitization with unfilled plated through holes |
| JP4592936B2 (ja) | 2000-12-05 | 2010-12-08 | Ｊｘ日鉱日石金属株式会社 | 電子回路用銅箔及び電子回路の形成方法 |
| WO2003004262A1 (en) * | 2001-07-06 | 2003-01-16 | Kaneka Corporation | Laminate and its producing method |
| JP2004259940A (ja) * | 2003-02-26 | 2004-09-16 | Hitachi Chem Co Ltd | プリント配線板の製造方法並びにレーザー穴あけ用銅箔 |
| US7029761B2 (en) * | 2003-04-30 | 2006-04-18 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
| US7156904B2 (en) * | 2003-04-30 | 2007-01-02 | Mec Company Ltd. | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby |
| TWI239043B (en) * | 2004-01-28 | 2005-09-01 | Pro Magnus Technology Corp | Method of forming light-reflection pattern and its manufactured product |
| JP2006261270A (ja) | 2005-03-16 | 2006-09-28 | Nippon Steel Chem Co Ltd | フレキシブルプリント配線板用積層体およびその製造方法 |
| JP4912909B2 (ja) * | 2006-03-30 | 2012-04-11 | 新日鐵化学株式会社 | フレキシブルプリント配線板の製造方法 |
| KR100905969B1 (ko) * | 2006-11-11 | 2009-07-06 | 조인셋 주식회사 | 연성 금속 적층필름 및 그 제조방법 |
| KR101412795B1 (ko) * | 2009-01-29 | 2014-06-27 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 전자 회로용 압연 동박 또는 전해 동박 및 이들을 사용한 전자 회로의 형성 방법 |
-
2010
- 2010-01-21 KR KR1020117017467A patent/KR101412795B1/ko active Active
- 2010-01-21 US US13/146,574 patent/US20110300401A1/en not_active Abandoned
- 2010-01-21 MY MYPI2011003432A patent/MY164452A/en unknown
- 2010-01-21 JP JP2010548480A patent/JP5457374B2/ja active Active
- 2010-01-21 EP EP10735737A patent/EP2384101A4/en not_active Withdrawn
- 2010-01-21 WO PCT/JP2010/050707 patent/WO2010087268A1/ja not_active Ceased
- 2010-01-21 CN CN201080005933.XA patent/CN102301838B/zh active Active
- 2010-01-29 TW TW099102503A patent/TWI539875B/zh active
-
2013
- 2013-06-07 US US13/912,406 patent/US20130270218A1/en not_active Abandoned
- 2013-07-08 JP JP2013142701A patent/JP5694453B2/ja active Active
-
2014
- 2014-10-01 JP JP2014203471A patent/JP5937652B2/ja active Active
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