KR20100021663A - 금속 코어 기판용 절연 페이스트 및 전자 소자 - Google Patents

금속 코어 기판용 절연 페이스트 및 전자 소자 Download PDF

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Publication number
KR20100021663A
KR20100021663A KR1020107001225A KR20107001225A KR20100021663A KR 20100021663 A KR20100021663 A KR 20100021663A KR 1020107001225 A KR1020107001225 A KR 1020107001225A KR 20107001225 A KR20107001225 A KR 20107001225A KR 20100021663 A KR20100021663 A KR 20100021663A
Authority
KR
South Korea
Prior art keywords
paste
glass
metal core
insulating
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107001225A
Other languages
English (en)
Korean (ko)
Inventor
아키라 이나바
마사키 하마구치
나오토 나카지마
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20100021663A publication Critical patent/KR20100021663A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2207/00—Compositions specially applicable for the manufacture of vitreous enamels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
KR1020107001225A 2007-06-20 2008-06-19 금속 코어 기판용 절연 페이스트 및 전자 소자 Ceased KR20100021663A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/820,986 2007-06-20
US11/820,986 US20080318061A1 (en) 2007-06-20 2007-06-20 Insulation paste for a metal core substrate and electronic device

Publications (1)

Publication Number Publication Date
KR20100021663A true KR20100021663A (ko) 2010-02-25

Family

ID=39789918

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107001225A Ceased KR20100021663A (ko) 2007-06-20 2008-06-19 금속 코어 기판용 절연 페이스트 및 전자 소자

Country Status (7)

Country Link
US (2) US20080318061A1 (enExample)
EP (1) EP2155618A1 (enExample)
JP (1) JP2010531044A (enExample)
KR (1) KR20100021663A (enExample)
CN (1) CN101679107A (enExample)
TW (1) TW200914391A (enExample)
WO (1) WO2008157675A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128527A1 (ja) * 2008-04-18 2009-10-22 日本電気硝子株式会社 色素増感型太陽電池用ガラス組成物および色素増感型太陽電池用材料
US20110094584A1 (en) * 2008-06-17 2011-04-28 Nippon Electric Glass Co., Ltd. Solar cell substrate and oxide semiconductor electrode for dye-sensitized solar cell
EP2330084A4 (en) * 2008-09-04 2014-07-30 Nippon Electric Glass Co GLASS COMPOSITION FOR ELECTRODE MANUFACTURE AND MATERIAL FOR ELECTRODE MANUFACTURE
US20110303883A1 (en) * 2009-02-24 2011-12-15 Kentaro Ishihara Glass composition for electrode formation and electrode formation material
JP2011044426A (ja) 2009-07-24 2011-03-03 Nippon Electric Glass Co Ltd 太陽電池用導電膜付ガラス基板
AT512525B1 (de) 2012-05-04 2013-09-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat
JP6829665B2 (ja) * 2017-07-10 2021-02-10 新光電気工業株式会社 リードフレーム、半導体装置、及びリードフレームの製造方法
JP6787286B2 (ja) * 2017-09-20 2020-11-18 株式会社村田製作所 インダクタ部品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1171784A (en) * 1966-11-17 1969-11-26 English Electric Co Ltd Improvements in or relating to Processes for Forming an Insulating Coating on a Metal, and to Coated Metals.
CS219732B1 (en) * 1981-01-21 1983-03-25 Radomir Kuzel Method of making the isolation coatings on the steel products
NL8100816A (nl) * 1981-02-19 1982-09-16 Philips Nv Draadgewonden weerstand.
US4556598A (en) * 1983-06-16 1985-12-03 Cts Corporation Porcelain tape for producing porcelainized metal substrates
JPS63170994A (ja) * 1986-05-30 1988-07-14 古河電気工業株式会社 多層プリント配線板及びその製造方法
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
US6233817B1 (en) * 1999-01-17 2001-05-22 Delphi Technologies, Inc. Method of forming thick-film hybrid circuit on a metal circuit board
KR20020062308A (ko) * 1999-12-16 2002-07-25 가부시끼가이샤 도꾸야마 결정화 유리와 질화 알루미늄 소결체의 접합체 및 그 제조방법
JP2004175645A (ja) * 2002-11-29 2004-06-24 Asahi Glass Co Ltd ガラスフリット混合物、電子回路基板製造方法および電子回路基板
JP4407199B2 (ja) * 2003-08-13 2010-02-03 旭硝子株式会社 結晶化無鉛ガラス、ガラスセラミックス組成物、グリーンシートおよび電子回路基板

Also Published As

Publication number Publication date
US20080318061A1 (en) 2008-12-25
EP2155618A1 (en) 2010-02-24
JP2010531044A (ja) 2010-09-16
TW200914391A (en) 2009-04-01
WO2008157675A1 (en) 2008-12-24
US20100200283A1 (en) 2010-08-12
CN101679107A (zh) 2010-03-24

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