TW200914391A - Insulation paste for a metal core substrate and electronic device - Google Patents

Insulation paste for a metal core substrate and electronic device Download PDF

Info

Publication number
TW200914391A
TW200914391A TW097123260A TW97123260A TW200914391A TW 200914391 A TW200914391 A TW 200914391A TW 097123260 A TW097123260 A TW 097123260A TW 97123260 A TW97123260 A TW 97123260A TW 200914391 A TW200914391 A TW 200914391A
Authority
TW
Taiwan
Prior art keywords
glass
paste
insulating layer
insulating
metal core
Prior art date
Application number
TW097123260A
Other languages
English (en)
Chinese (zh)
Inventor
Akira Inaba
Masaki Hamaguchi
Naoto Nakajima
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200914391A publication Critical patent/TW200914391A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2207/00—Compositions specially applicable for the manufacture of vitreous enamels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Inorganic Insulating Materials (AREA)
  • Glass Compositions (AREA)
TW097123260A 2007-06-20 2008-06-20 Insulation paste for a metal core substrate and electronic device TW200914391A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/820,986 US20080318061A1 (en) 2007-06-20 2007-06-20 Insulation paste for a metal core substrate and electronic device

Publications (1)

Publication Number Publication Date
TW200914391A true TW200914391A (en) 2009-04-01

Family

ID=39789918

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097123260A TW200914391A (en) 2007-06-20 2008-06-20 Insulation paste for a metal core substrate and electronic device

Country Status (7)

Country Link
US (2) US20080318061A1 (enExample)
EP (1) EP2155618A1 (enExample)
JP (1) JP2010531044A (enExample)
KR (1) KR20100021663A (enExample)
CN (1) CN101679107A (enExample)
TW (1) TW200914391A (enExample)
WO (1) WO2008157675A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128527A1 (ja) * 2008-04-18 2009-10-22 日本電気硝子株式会社 色素増感型太陽電池用ガラス組成物および色素増感型太陽電池用材料
US20110094584A1 (en) * 2008-06-17 2011-04-28 Nippon Electric Glass Co., Ltd. Solar cell substrate and oxide semiconductor electrode for dye-sensitized solar cell
EP2330084A4 (en) * 2008-09-04 2014-07-30 Nippon Electric Glass Co GLASS COMPOSITION FOR ELECTRODE MANUFACTURE AND MATERIAL FOR ELECTRODE MANUFACTURE
US20110303883A1 (en) * 2009-02-24 2011-12-15 Kentaro Ishihara Glass composition for electrode formation and electrode formation material
JP2011044426A (ja) 2009-07-24 2011-03-03 Nippon Electric Glass Co Ltd 太陽電池用導電膜付ガラス基板
AT512525B1 (de) 2012-05-04 2013-09-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat
JP6829665B2 (ja) * 2017-07-10 2021-02-10 新光電気工業株式会社 リードフレーム、半導体装置、及びリードフレームの製造方法
JP6787286B2 (ja) * 2017-09-20 2020-11-18 株式会社村田製作所 インダクタ部品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1171784A (en) * 1966-11-17 1969-11-26 English Electric Co Ltd Improvements in or relating to Processes for Forming an Insulating Coating on a Metal, and to Coated Metals.
CS219732B1 (en) * 1981-01-21 1983-03-25 Radomir Kuzel Method of making the isolation coatings on the steel products
NL8100816A (nl) * 1981-02-19 1982-09-16 Philips Nv Draadgewonden weerstand.
US4556598A (en) * 1983-06-16 1985-12-03 Cts Corporation Porcelain tape for producing porcelainized metal substrates
JPS63170994A (ja) * 1986-05-30 1988-07-14 古河電気工業株式会社 多層プリント配線板及びその製造方法
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
US6233817B1 (en) * 1999-01-17 2001-05-22 Delphi Technologies, Inc. Method of forming thick-film hybrid circuit on a metal circuit board
KR20020062308A (ko) * 1999-12-16 2002-07-25 가부시끼가이샤 도꾸야마 결정화 유리와 질화 알루미늄 소결체의 접합체 및 그 제조방법
JP2004175645A (ja) * 2002-11-29 2004-06-24 Asahi Glass Co Ltd ガラスフリット混合物、電子回路基板製造方法および電子回路基板
JP4407199B2 (ja) * 2003-08-13 2010-02-03 旭硝子株式会社 結晶化無鉛ガラス、ガラスセラミックス組成物、グリーンシートおよび電子回路基板

Also Published As

Publication number Publication date
US20080318061A1 (en) 2008-12-25
EP2155618A1 (en) 2010-02-24
JP2010531044A (ja) 2010-09-16
KR20100021663A (ko) 2010-02-25
WO2008157675A1 (en) 2008-12-24
US20100200283A1 (en) 2010-08-12
CN101679107A (zh) 2010-03-24

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