JP2011502330A5 - - Google Patents

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Publication number
JP2011502330A5
JP2011502330A5 JP2010530108A JP2010530108A JP2011502330A5 JP 2011502330 A5 JP2011502330 A5 JP 2011502330A5 JP 2010530108 A JP2010530108 A JP 2010530108A JP 2010530108 A JP2010530108 A JP 2010530108A JP 2011502330 A5 JP2011502330 A5 JP 2011502330A5
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JP
Japan
Prior art keywords
silver
metal
thick film
mixtures
firing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010530108A
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English (en)
Japanese (ja)
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JP2011502330A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/080140 external-priority patent/WO2009052271A1/en
Publication of JP2011502330A publication Critical patent/JP2011502330A/ja
Publication of JP2011502330A5 publication Critical patent/JP2011502330A5/ja
Withdrawn legal-status Critical Current

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JP2010530108A 2007-10-18 2008-10-16 鉛フリーの伝導性組成物、および半導体デバイスの製造における使用方法：Ｍｇ含有添加剤 Withdrawn JP2011502330A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98092407P 2007-10-18 2007-10-18
PCT/US2008/080140 WO2009052271A1 (en) 2007-10-18 2008-10-16 Lead-free conductive compositions and processes for use in the manufacture of semiconductor devices: mg-containing additive

Publications (2)

Publication Number Publication Date
JP2011502330A JP2011502330A (ja) 2011-01-20
JP2011502330A5 true JP2011502330A5 (enExample) 2011-11-17

Family

ID=40294650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010530108A Withdrawn JP2011502330A (ja) 2007-10-18 2008-10-16 鉛フリーの伝導性組成物、および半導体デバイスの製造における使用方法：Ｍｇ含有添加剤

Country Status (7)

Country Link
US (1) US7780878B2 (enExample)
EP (1) EP2193527A1 (enExample)
JP (1) JP2011502330A (enExample)
KR (1) KR20100080612A (enExample)
CN (1) CN101816045A (enExample)
TW (1) TW200931448A (enExample)
WO (1) WO2009052271A1 (enExample)

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