JP2011519112A5 - - Google Patents
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- Publication number
- JP2011519112A5 JP2011519112A5 JP2010530172A JP2010530172A JP2011519112A5 JP 2011519112 A5 JP2011519112 A5 JP 2011519112A5 JP 2010530172 A JP2010530172 A JP 2010530172A JP 2010530172 A JP2010530172 A JP 2010530172A JP 2011519112 A5 JP2011519112 A5 JP 2011519112A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- sio
- thick film
- flux materials
- conductive silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 claims 14
- 230000004907 flux Effects 0.000 claims 8
- 239000000463 material Substances 0.000 claims 8
- 229910052709 silver Inorganic materials 0.000 claims 7
- 239000004332 silver Substances 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 6
- 229910004283 SiO 4 Inorganic materials 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims 3
- 238000010304 firing Methods 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 2
- 229910052745 lead Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- 101100296543 Caenorhabditis elegans pbo-4 gene Proteins 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US98091007P | 2007-10-18 | 2007-10-18 | |
| US60/980,910 | 2007-10-18 | ||
| PCT/US2008/080447 WO2009052474A1 (en) | 2007-10-18 | 2008-10-20 | Conductive compositions and processes for use in the manufacture of semiconductor devices: flux materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011519112A JP2011519112A (ja) | 2011-06-30 |
| JP2011519112A5 true JP2011519112A5 (enExample) | 2011-11-17 |
Family
ID=40279022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010530172A Withdrawn JP2011519112A (ja) | 2007-10-18 | 2008-10-20 | 伝導性組成物、および半導体デバイスの製造における使用方法：フラックス材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8187505B2 (enExample) |
| EP (2) | EP2191479A1 (enExample) |
| JP (1) | JP2011519112A (enExample) |
| KR (1) | KR101208136B1 (enExample) |
| CN (1) | CN101884074A (enExample) |
| TW (1) | TW200937450A (enExample) |
| WO (2) | WO2009052343A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102251281B (zh) * | 2006-03-01 | 2013-01-16 | 三菱瓦斯化学株式会社 | 采用液相生长法的ZnO单晶的制造方法 |
| NL2000999C2 (nl) * | 2007-11-13 | 2009-05-14 | Stichting Energie | Werkwijze voor het fabriceren van kristallijn silicium zonnecellen met gebruikmaking van co-diffusie van boor en fosfor. |
| US20100294353A1 (en) * | 2009-05-21 | 2010-11-25 | E. I. Du Pont De Nemours And Company | Conductive paste for solar cell electrode |
| JP5426241B2 (ja) * | 2009-06-10 | 2014-02-26 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | チップ抵抗器の表電極および裏電極 |
| KR101332429B1 (ko) * | 2009-12-17 | 2013-11-22 | 제일모직주식회사 | 태양전지 전극용 페이스트 및 이를 이용한 태양전지 |
| KR101045262B1 (ko) * | 2009-12-21 | 2011-06-29 | 제일모직주식회사 | 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름 |
| CN102314956A (zh) * | 2010-07-09 | 2012-01-11 | 硕禾电子材料股份有限公司 | 导电铝胶及其制造方法、太阳能电池及其模块 |
| KR101374359B1 (ko) * | 2010-09-15 | 2014-03-18 | 제일모직주식회사 | 태양전지 전극용 페이스트 및 이를 이용하여 제조되는 태양전지 |
| US8562872B2 (en) | 2010-09-15 | 2013-10-22 | Cheil Industries, Inc. | Paste for solar cell electrode and solar cell prepared using the same |
| WO2012044281A1 (en) * | 2010-09-28 | 2012-04-05 | E. I. Du Pont De Nemours And Company | Conductive paste for solar cell electrode |
| JP2012209148A (ja) * | 2011-03-30 | 2012-10-25 | Sony Corp | 導電性粒子、導電性ペースト、及び、回路基板 |
| US20120312369A1 (en) * | 2011-06-13 | 2012-12-13 | E I Du Pont De Nemours And Company | Thick film paste containing bismuth-based oxide and its use in the manufacture of semiconductor devices |
| EP2839511A4 (en) * | 2012-04-18 | 2015-12-02 | Heraeus Precious Metals North America Conshohocken Llc | SOLAR CELL CONTACTS WITH INTERMETALLIC NICKEL COMPOSITIONS |
| WO2015026483A1 (en) * | 2013-08-21 | 2015-02-26 | Gtat Corporation | Using an active solder to couple a metallic article to a photovoltaic cell |
| JP6360157B2 (ja) * | 2014-04-04 | 2018-07-18 | 京セラ株式会社 | 熱硬化性樹脂組成物、半導体装置及び電気・電子部品 |
| US10040717B1 (en) | 2017-09-18 | 2018-08-07 | Jiangxi Jiayin Science and Technology, Ltd. | Thick-film paste with multiple discrete frits and methods for contacting crystalline silicon solar cell emitter surfaces |
| WO2019183931A1 (zh) * | 2018-03-30 | 2019-10-03 | 深圳市首骋新材料科技有限公司 | 晶硅太阳能电池正面导电浆料及其制备方法和太阳能电池 |
| US20200243697A1 (en) * | 2019-01-28 | 2020-07-30 | Dupont Electronics, Inc. | Solar cell |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4625848B1 (enExample) * | 1966-04-15 | 1971-07-26 | ||
| US4874550A (en) * | 1987-08-20 | 1989-10-17 | General Electric Company | Thick-film copper conductor inks |
| US20060001009A1 (en) * | 2004-06-30 | 2006-01-05 | Garreau-Iles Angelique Genevie | Thick-film conductive paste |
| US7556748B2 (en) * | 2005-04-14 | 2009-07-07 | E. I. Du Pont De Nemours And Company | Method of manufacture of semiconductor device and conductive compositions used therein |
| US7435361B2 (en) | 2005-04-14 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
| JP4807063B2 (ja) | 2005-12-20 | 2011-11-02 | ソニー株式会社 | 復号装置、制御方法、およびプログラム |
| JP2007194580A (ja) * | 2005-12-21 | 2007-08-02 | E I Du Pont De Nemours & Co | 太陽電池電極用ペースト |
-
2008
- 2008-10-17 EP EP08839402A patent/EP2191479A1/en not_active Withdrawn
- 2008-10-17 WO PCT/US2008/080254 patent/WO2009052343A1/en not_active Ceased
- 2008-10-20 US US12/254,264 patent/US8187505B2/en active Active
- 2008-10-20 CN CN2008801192618A patent/CN101884074A/zh active Pending
- 2008-10-20 KR KR1020107010745A patent/KR101208136B1/ko not_active Expired - Fee Related
- 2008-10-20 EP EP08839528A patent/EP2191480A1/en not_active Withdrawn
- 2008-10-20 TW TW097140250A patent/TW200937450A/zh unknown
- 2008-10-20 JP JP2010530172A patent/JP2011519112A/ja not_active Withdrawn
- 2008-10-20 WO PCT/US2008/080447 patent/WO2009052474A1/en not_active Ceased
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