JP2004128357A5 - - Google Patents

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Publication number
JP2004128357A5
JP2004128357A5 JP2002292868A JP2002292868A JP2004128357A5 JP 2004128357 A5 JP2004128357 A5 JP 2004128357A5 JP 2002292868 A JP2002292868 A JP 2002292868A JP 2002292868 A JP2002292868 A JP 2002292868A JP 2004128357 A5 JP2004128357 A5 JP 2004128357A5
Authority
JP
Japan
Prior art keywords
electrode
substrate
metal nanoparticles
composite metal
produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002292868A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004128357A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002292868A priority Critical patent/JP2004128357A/ja
Priority claimed from JP2002292868A external-priority patent/JP2004128357A/ja
Priority to KR1020047000955A priority patent/KR20050040812A/ko
Priority to PCT/JP2003/011797 priority patent/WO2004026526A1/en
Priority to CNB038009056A priority patent/CN100337782C/zh
Priority to DE60326760T priority patent/DE60326760D1/de
Priority to US10/484,454 priority patent/US20040245648A1/en
Priority to EP03788702A priority patent/EP1578559B1/en
Priority to TW092125572A priority patent/TWI284581B/zh
Publication of JP2004128357A publication Critical patent/JP2004128357A/ja
Publication of JP2004128357A5 publication Critical patent/JP2004128357A5/ja
Pending legal-status Critical Current

Links

JP2002292868A 2002-09-18 2002-10-04 電極配設基体及びその電極接合方法 Pending JP2004128357A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2002292868A JP2004128357A (ja) 2002-10-04 2002-10-04 電極配設基体及びその電極接合方法
TW092125572A TWI284581B (en) 2002-09-18 2003-09-17 Bonding material and bonding method
DE60326760T DE60326760D1 (de) 2002-09-18 2003-09-17 Verfahren zum verbinden
PCT/JP2003/011797 WO2004026526A1 (en) 2002-09-18 2003-09-17 Bonding material and bonding method
CNB038009056A CN100337782C (zh) 2002-09-18 2003-09-17 接合材料
KR1020047000955A KR20050040812A (ko) 2002-09-18 2003-09-17 본딩물질 및 본딩방법
US10/484,454 US20040245648A1 (en) 2002-09-18 2003-09-17 Bonding material and bonding method
EP03788702A EP1578559B1 (en) 2002-09-18 2003-09-17 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002292868A JP2004128357A (ja) 2002-10-04 2002-10-04 電極配設基体及びその電極接合方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008002999A Division JP2008098683A (ja) 2008-01-10 2008-01-10 電極配設基体の電極接合方法

Publications (2)

Publication Number Publication Date
JP2004128357A JP2004128357A (ja) 2004-04-22
JP2004128357A5 true JP2004128357A5 (enExample) 2005-08-25

Family

ID=32283993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002292868A Pending JP2004128357A (ja) 2002-09-18 2002-10-04 電極配設基体及びその電極接合方法

Country Status (1)

Country Link
JP (1) JP2004128357A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4378239B2 (ja) 2004-07-29 2009-12-02 株式会社日立製作所 半導体装置及びそれを使用した電力変換装置並びにこの電力変換装置を用いたハイブリッド自動車。
JP4815800B2 (ja) * 2004-12-28 2011-11-16 株式会社大真空 圧電振動デバイス
JP4635230B2 (ja) * 2005-01-20 2011-02-23 日産自動車株式会社 接合方法及び接合構造
JP2006202938A (ja) 2005-01-20 2006-08-03 Kojiro Kobayashi 半導体装置及びその製造方法
JP2006211089A (ja) * 2005-01-26 2006-08-10 Daishinku Corp 圧電振動デバイス
US7615476B2 (en) * 2005-06-30 2009-11-10 Intel Corporation Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
EP2012352A4 (en) 2006-04-24 2012-07-25 Murata Manufacturing Co ELECTRONIC COMPONENT, ELECTRONIC COMPONENT DEVICE THEREFOR AND METHOD OF MANUFACTURING THEREOF
JP4743002B2 (ja) * 2006-06-13 2011-08-10 日産自動車株式会社 接合方法
JP4873160B2 (ja) * 2007-02-08 2012-02-08 トヨタ自動車株式会社 接合方法
JP5006081B2 (ja) * 2007-03-28 2012-08-22 株式会社日立製作所 半導体装置、その製造方法、複合金属体及びその製造方法
WO2009098831A1 (ja) * 2008-02-07 2009-08-13 Murata Manufacturing Co., Ltd. 電子部品装置の製造方法
US10177079B2 (en) 2010-03-19 2019-01-08 Furukawa Electric Co., Ltd. Conductive connecting member and manufacturing method of same
JP5863323B2 (ja) * 2011-08-11 2016-02-16 古河電気工業株式会社 半導体装置、及び半導体装置の製造方法
EP3016135A4 (en) 2013-06-28 2017-09-20 Furukawa Electric Co., Ltd. Connection structure and semiconductor device
JP6387048B2 (ja) * 2016-06-09 2018-09-05 ローム株式会社 半導体装置の製造方法
KR101898647B1 (ko) * 2017-05-11 2018-09-14 서울과학기술대학교 산학협력단 은코팅 구리 호일을 이용한 접합 소재 및 이를 이용한 접합 방법
JP6927490B2 (ja) * 2017-05-31 2021-09-01 株式会社応用ナノ粒子研究所 放熱構造体
JP2021072304A (ja) * 2019-10-29 2021-05-06 ミクロン電気株式会社 Ｐｔｃサーミスタの接合方法

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