JP2004128357A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004128357A5 JP2004128357A5 JP2002292868A JP2002292868A JP2004128357A5 JP 2004128357 A5 JP2004128357 A5 JP 2004128357A5 JP 2002292868 A JP2002292868 A JP 2002292868A JP 2002292868 A JP2002292868 A JP 2002292868A JP 2004128357 A5 JP2004128357 A5 JP 2004128357A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- metal nanoparticles
- composite metal
- produced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Claims (9)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002292868A JP2004128357A (en) | 2002-10-04 | 2002-10-04 | Electrode arranged substrate and its electrode connection method |
US10/484,454 US20040245648A1 (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
DE60326760T DE60326760D1 (en) | 2002-09-18 | 2003-09-17 | PROCESS FOR CONNECTING |
KR1020047000955A KR20050040812A (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
PCT/JP2003/011797 WO2004026526A1 (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
TW092125572A TWI284581B (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
CNB038009056A CN100337782C (en) | 2002-09-18 | 2003-09-17 | Joining material and joining method |
EP03788702A EP1578559B1 (en) | 2002-09-18 | 2003-09-17 | Bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002292868A JP2004128357A (en) | 2002-10-04 | 2002-10-04 | Electrode arranged substrate and its electrode connection method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008002999A Division JP2008098683A (en) | 2008-01-10 | 2008-01-10 | Electrode connection method of electrode arrangement base |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004128357A JP2004128357A (en) | 2004-04-22 |
JP2004128357A5 true JP2004128357A5 (en) | 2005-08-25 |
Family
ID=32283993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002292868A Pending JP2004128357A (en) | 2002-09-18 | 2002-10-04 | Electrode arranged substrate and its electrode connection method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2004128357A (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4378239B2 (en) | 2004-07-29 | 2009-12-02 | 株式会社日立製作所 | A semiconductor device, a power conversion device using the semiconductor device, and a hybrid vehicle using the power conversion device. |
JP4815800B2 (en) * | 2004-12-28 | 2011-11-16 | 株式会社大真空 | Piezoelectric vibration device |
JP4635230B2 (en) * | 2005-01-20 | 2011-02-23 | 日産自動車株式会社 | Joining method and joining structure |
JP2006202938A (en) | 2005-01-20 | 2006-08-03 | Kojiro Kobayashi | Semiconductor device and its manufacturing method |
JP2006211089A (en) * | 2005-01-26 | 2006-08-10 | Daishinku Corp | Piezoelectric vibration device |
US7615476B2 (en) * | 2005-06-30 | 2009-11-10 | Intel Corporation | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
JP5305148B2 (en) | 2006-04-24 | 2013-10-02 | 株式会社村田製作所 | Electronic component, electronic component device using the same, and manufacturing method thereof |
JP4743002B2 (en) * | 2006-06-13 | 2011-08-10 | 日産自動車株式会社 | Joining method |
JP4873160B2 (en) * | 2007-02-08 | 2012-02-08 | トヨタ自動車株式会社 | Joining method |
JP5006081B2 (en) * | 2007-03-28 | 2012-08-22 | 株式会社日立製作所 | Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof |
CN101933129B (en) * | 2008-02-07 | 2012-03-28 | 株式会社村田制作所 | Method for manufacturing electronic component device |
CN102812543B (en) * | 2010-03-19 | 2016-03-30 | 古河电气工业株式会社 | The manufacture method of conductive connecting element and conductive connecting element |
JP5863323B2 (en) * | 2011-08-11 | 2016-02-16 | 古河電気工業株式会社 | Semiconductor device and manufacturing method of semiconductor device |
JP6178850B2 (en) | 2013-06-28 | 2017-08-09 | 古河電気工業株式会社 | Connection structure and semiconductor device |
JP6387048B2 (en) * | 2016-06-09 | 2018-09-05 | ローム株式会社 | Manufacturing method of semiconductor device |
KR101898647B1 (en) * | 2017-05-11 | 2018-09-14 | 서울과학기술대학교 산학협력단 | Bonding material of a Cu foil coated with Ag and bonding method using the Cu foil with coated Ag |
JP6927490B2 (en) * | 2017-05-31 | 2021-09-01 | 株式会社応用ナノ粒子研究所 | Heat dissipation structure |
JP2021072304A (en) * | 2019-10-29 | 2021-05-06 | ミクロン電気株式会社 | Joining method of ptc thermistor |
-
2002
- 2002-10-04 JP JP2002292868A patent/JP2004128357A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004128357A5 (en) | ||
TWI579865B (en) | Anisotropic conductive film, connecting method and joined structure | |
JP2008508718A5 (en) | ||
JP2004528992A5 (en) | ||
JP2011023574A5 (en) | ||
JP2004536722A5 (en) | ||
WO2013125604A1 (en) | Oxygen source-containing composite nanometal paste and joining method | |
TW200701275A (en) | Ceramic electronic component and manufacturing method thereof | |
WO2001065603A1 (en) | Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound | |
JP2008520195A5 (en) | ||
JP2007035573A5 (en) | ||
JP2004130371A5 (en) | ||
JP2009004487A5 (en) | ||
JP2004241770A5 (en) | ||
JP2006202604A5 (en) | ||
CN105679725B (en) | A kind of preparation method of radiator for laser display | |
JP2008538225A5 (en) | ||
JP2004528328A5 (en) | ||
WO2015011849A1 (en) | Electronic device and manufacturing method for same | |
TWI737643B (en) | Bonding composition and electronic component assembly | |
JP2005536602A5 (en) | ||
JP2006228804A (en) | Ceramic substrate for semiconductor module and its manufacturing method | |
JP2005311199A5 (en) | ||
JP2006512765A5 (en) | ||
JP2009286939A5 (en) | Nanomaterial-containing porous body, method for producing the same, laminate, and method for producing the same |