JP2006202604A5 - - Google Patents
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- JP2006202604A5 JP2006202604A5 JP2005012779A JP2005012779A JP2006202604A5 JP 2006202604 A5 JP2006202604 A5 JP 2006202604A5 JP 2005012779 A JP2005012779 A JP 2005012779A JP 2005012779 A JP2005012779 A JP 2005012779A JP 2006202604 A5 JP2006202604 A5 JP 2006202604A5
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- JP
- Japan
- Prior art keywords
- metal nanoparticles
- particles
- metal
- storage stability
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
ところで、回路形成用または配線層間用の導電性ペーストとして、ナノサイズの金属粒子（金属ナノ粒子とも言う）を液体中で分散させたものが知られている。金属ナノ粒子は、粒径のより大きな金属粒子に比べて活性が高く、常温で容易に凝集するため、保存安定性に関して問題がある。これを解決するため、金属ナノ粒子に配位結合する分散剤を添加して金属ナノ粒子を保護および安定化し、その後、分散剤を加熱により金属ナノ粒子から除去して酸無水物等の捕捉物質で捕捉することが提案されている（特許文献４を参照のこと）。 By the way, as a conductive paste for forming a circuit or a wiring layer, a paste in which nano-sized metal particles (also referred to as metal nanoparticles) are dispersed in a liquid is known. Metal nanoparticles have a higher activity than metal particles having a larger particle size, and easily aggregate at room temperature, so that there is a problem regarding storage stability. In order to solve this problem, a dispersing agent that coordinates and bonds to the metal nanoparticles is added to protect and stabilize the metal nanoparticles, and then the dispersant is removed from the metal nanoparticles by heating to trap a capturing material such as an acid anhydride. Has been proposed (see Patent Document 4).
しかしながら、比較例１の導電性ペーストの保存安定性は２時間しか持続せず、非常に短かった。これは、ニッケル粒子を用いているために、有機化合物のチオール末端基がニッケル粒子表面に配位せずにフリーで存在し、その結果、保存の間にエポキシ樹脂と反応し、硬化が起こったためであると考えられる。
However, the storage stability of the conductive paste of Comparative Example 1 lasted only 2 hours and was very short. This is because nickel particles are used, so that the thiol end groups of the organic compound exist freely without being coordinated to the surface of the nickel particles, and as a result, they react with the epoxy resin during storage and curing occurs. It is thought that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005012779A JP4510649B2 (en) | 2005-01-20 | 2005-01-20 | WIRING BOARD, MULTILAYER BOARD AND ELECTRONIC COMPONENT MOUNTING METHOD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005012779A JP4510649B2 (en) | 2005-01-20 | 2005-01-20 | WIRING BOARD, MULTILAYER BOARD AND ELECTRONIC COMPONENT MOUNTING METHOD |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006202604A JP2006202604A (en) | 2006-08-03 |
| JP2006202604A5 true JP2006202604A5 (en) | 2008-01-24 |
| JP4510649B2 JP4510649B2 (en) | 2010-07-28 |
Family
ID=36960419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005012779A Expired - Fee Related JP4510649B2 (en) | 2005-01-20 | 2005-01-20 | WIRING BOARD, MULTILAYER BOARD AND ELECTRONIC COMPONENT MOUNTING METHOD |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4510649B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4505825B2 (en) * | 2006-09-15 | 2010-07-21 | 国立大学法人大阪大学 | Method for sintering metal nanoparticles and method for forming wiring on a substrate using the sintering method |
| JP4979542B2 (en) * | 2007-11-05 | 2012-07-18 | パナソニック株式会社 | Mounting structure and manufacturing method thereof |
| JP5169171B2 (en) * | 2007-11-26 | 2013-03-27 | パナソニック株式会社 | Bonding method of electronic parts |
| JP2009134030A (en) * | 2007-11-29 | 2009-06-18 | Seiko Epson Corp | Actuator, optical scanner and image forming apparatus |
| JP2009139600A (en) * | 2007-12-05 | 2009-06-25 | Seiko Epson Corp | Actuator, optical scanner and image forming apparatus |
| JP5207281B2 (en) * | 2008-01-17 | 2013-06-12 | 国立大学法人大阪大学 | Conductive paste |
| JP2011054892A (en) * | 2009-09-04 | 2011-03-17 | Nihon Superior Co Ltd | Solder bonding using conductive paste |
| KR20130125944A (en) | 2012-05-10 | 2013-11-20 | 삼성전기주식회사 | Conductive paste composition for internal electrode, laminated ceramic electronic parts and fabricating method thereof |
| EP3583151B1 (en) | 2017-02-15 | 2021-06-09 | 3M Innovative Properties Company | Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05274911A (en) * | 1992-03-25 | 1993-10-22 | Furukawa Electric Co Ltd:The | Conductive resin paste |
| JP2001302881A (en) * | 2000-04-18 | 2001-10-31 | Three M Innovative Properties Co | Stabilized cationic polymerizable composition and adhesive film and conductive circuit using the same |
| ATE525730T1 (en) * | 2000-10-25 | 2011-10-15 | Harima Chemicals Inc | ELECTROCONDUCTIVE METAL PASTE AND METHOD FOR PRODUCING IT |
| JP2004189954A (en) * | 2002-12-13 | 2004-07-08 | Ricoh Co Ltd | Thermoset electroconductive adhesive |
-
2005
- 2005-01-20 JP JP2005012779A patent/JP4510649B2/en not_active Expired - Fee Related
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