JP2007035573A5 - - Google Patents

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Publication number
JP2007035573A5
JP2007035573A5 JP2005221025A JP2005221025A JP2007035573A5 JP 2007035573 A5 JP2007035573 A5 JP 2007035573A5 JP 2005221025 A JP2005221025 A JP 2005221025A JP 2005221025 A JP2005221025 A JP 2005221025A JP 2007035573 A5 JP2007035573 A5 JP 2007035573A5
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Japan
Prior art keywords
fine particles
conductive
base
particle
conductive fine
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JP2005221025A
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Japanese (ja)
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JP2007035573A (en
JP4718926B2 (en
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Priority to JP2005221025A priority Critical patent/JP4718926B2/en
Priority claimed from JP2005221025A external-priority patent/JP4718926B2/en
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Publication of JP2007035573A5 publication Critical patent/JP2007035573A5/ja
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Claims (6)

基材微粒子と、前記基材微粒子の表面に形成されたニッケルからなる導電層とからなる導電性微粒子であって、前記導電層は、表面にパラジウム金属又はその金属酸化物を芯物質とする突起を有することを特徴とする導電性微粒子。 A base particle, a conductive particles composed of a conductive layer made of the surface form nickel of the base particle, said conductive layer is a palladium metal or a metal oxide as a core material surface protrusions Conductive fine particles characterized by comprising: 芯物質の８０％以上が、基材微粒子に接触しているか又は前記基材微粒子との距離が５ｎｍ以内であることを特徴とする請求項１記載の導電性微粒子。 The conductive fine particles according to claim 1, wherein 80% or more of the core substance is in contact with the base fine particles, or the distance from the base fine particles is within 5 nm. 基材微粒子は、樹脂微粒子であることを特徴とする請求項１又は２記載の導電性微粒子。 The conductive fine particles according to claim 1, wherein the substrate fine particles are resin fine particles. 突起の平均高さが、基材微粒子の平均粒子径の０．５〜２５％であることを特徴とする請求項１、２又は３記載の導電性微粒子。 The conductive fine particles according to claim 1, 2, or 3, wherein the average height of the protrusions is 0.5 to 25% of the average particle diameter of the substrate fine particles. 更に、導電層の表面に金層が形成されていることを特徴とする請求項１、２、３又は４記載の導電性微粒子。 5. The conductive fine particle according to claim 1, wherein a gold layer is formed on the surface of the conductive layer. 請求項１、２、３、４又は５記載の導電性微粒子が樹脂バインダーに分散されてなることを特徴とする異方性導電材料。 6. An anisotropic conductive material, wherein the conductive fine particles according to claim 1, 2, 3, 4 or 5 are dispersed in a resin binder.
JP2005221025A 2005-07-29 2005-07-29 Conductive fine particles and anisotropic conductive material Active JP4718926B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005221025A JP4718926B2 (en) 2005-07-29 2005-07-29 Conductive fine particles and anisotropic conductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005221025A JP4718926B2 (en) 2005-07-29 2005-07-29 Conductive fine particles and anisotropic conductive material

Publications (3)

Publication Number Publication Date
JP2007035573A JP2007035573A (en) 2007-02-08
JP2007035573A5 true JP2007035573A5 (en) 2008-05-15
JP4718926B2 JP4718926B2 (en) 2011-07-06

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Family Applications (1)

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JP2005221025A Active JP4718926B2 (en) 2005-07-29 2005-07-29 Conductive fine particles and anisotropic conductive material

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JP (1) JP4718926B2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007058159A1 (en) * 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
JP5430093B2 (en) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 Conductive particles, anisotropic conductive film, joined body, and connection method
JP5476210B2 (en) * 2010-05-19 2014-04-23 積水化学工業株式会社 Conductive particles, anisotropic conductive materials, and connection structures
JP5940760B2 (en) * 2010-05-19 2016-06-29 積水化学工業株式会社 Conductive particles, anisotropic conductive materials, and connection structures
JP5900535B2 (en) * 2013-05-16 2016-04-06 日立化成株式会社 Conductive particles, insulating coated conductive particles, anisotropic conductive adhesive, and method for producing conductive particles
JP6352103B2 (en) * 2013-08-12 2018-07-04 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP6355474B2 (en) * 2013-08-12 2018-07-11 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP6577723B2 (en) * 2014-03-10 2019-09-18 積水化学工業株式会社 Conductive particles with insulating particles, conductive material, and connection structure
JP6379761B2 (en) * 2014-07-09 2018-08-29 日立化成株式会社 Conductive particle, insulating coated conductive particle, anisotropic conductive adhesive, connection structure, and method for producing conductive particle
JP6523860B2 (en) * 2014-08-07 2019-06-05 積水化学工業株式会社 Conductive particle, conductive material and connection structure
JP6592298B2 (en) * 2014-08-07 2019-10-16 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696429B2 (en) * 1999-02-22 2005-09-21 日本化学工業株式会社 Conductive electroless plating powder, method for producing the same, and conductive material comprising the plating powder
JP2003234020A (en) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd Conductive minute particle
JP2004296322A (en) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd Conductive particulate and liquid crystal display element

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