JP2006228475A5 - - Google Patents

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Publication number
JP2006228475A5
JP2006228475A5 JP2005038271A JP2005038271A JP2006228475A5 JP 2006228475 A5 JP2006228475 A5 JP 2006228475A5 JP 2005038271 A JP2005038271 A JP 2005038271A JP 2005038271 A JP2005038271 A JP 2005038271A JP 2006228475 A5 JP2006228475 A5 JP 2006228475A5
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JP
Japan
Prior art keywords
metal plating
conductive
phosphorus
plating film
fine particles
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JP2005038271A
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Japanese (ja)
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JP4860163B2 (en
JP2006228475A (en
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Priority to JP2005038271A priority Critical patent/JP4860163B2/en
Priority claimed from JP2005038271A external-priority patent/JP4860163B2/en
Publication of JP2006228475A publication Critical patent/JP2006228475A/en
Publication of JP2006228475A5 publication Critical patent/JP2006228475A5/ja
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Publication of JP4860163B2 publication Critical patent/JP4860163B2/en
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Claims (3)

基材微粒子の表面がニッケル及びリンを含有する金属メッキ被膜層と最表面を金層とする多層の導電性膜で被覆されており、前記導電性膜は表面に隆起した突起を有する導電性微粒子であって、
前記金属メッキ被膜はリンを１０重量％以上含有し、
前記導電性膜の表面の隆起した突起は、導電性物質を芯物質とすることを特徴とする導電性微粒子。 The surface of the substrate fine particles is coated with a multi-layered conductive film having a metal plating film layer containing nickel and phosphorus and the outermost surface as a gold layer, and the conductive film has conductive protrusions having protrusions raised on the surface. Because
The metal plating film contains 10% by weight or more of phosphorus,
Conductive fine particles, wherein the raised protrusions on the surface of the conductive film have a conductive substance as a core substance. 金属メッキ被膜中において、基材微粒子側から金属メッキ被膜膜厚の２０％以下の領域で金属メッキ組成中に１０〜２０重量％のリンを含有し、金属メッキ被膜表面側から金属メッキ被膜膜厚の１０％以下の領域で金属メッキ組成中に１〜１０重量％のリンを含有することを特徴とする請求項１記載の導電性微粒子。In the metal plating film, the metal plating composition contains 10 to 20% by weight of phosphorus in the region of 20% or less of the metal plating film thickness from the substrate fine particle side, and the metal plating film thickness from the metal plating film surface side. The conductive fine particles according to claim 1, wherein 1 to 10% by weight of phosphorus is contained in the metal plating composition in an area of 10% or less. ビッカース硬度による、芯物質の硬度に対する導電性膜の硬度の硬度比が、０．２〜０．７であることを特徴とする請求項１または２に記載の導電性微粒子。The conductive fine particles according to claim 1 or 2, wherein the hardness ratio of the hardness of the conductive film to the hardness of the core substance by Vickers hardness is 0.2 to 0.7.
JP2005038271A 2005-02-15 2005-02-15 Method for producing conductive fine particles Active JP4860163B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005038271A JP4860163B2 (en) 2005-02-15 2005-02-15 Method for producing conductive fine particles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005038271A JP4860163B2 (en) 2005-02-15 2005-02-15 Method for producing conductive fine particles

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011174943A Division JP5323147B2 (en) 2011-08-10 2011-08-10 Conductive fine particles and anisotropic conductive materials

Publications (3)

Publication Number Publication Date
JP2006228475A JP2006228475A (en) 2006-08-31
JP2006228475A5 true JP2006228475A5 (en) 2007-11-29
JP4860163B2 JP4860163B2 (en) 2012-01-25

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ID=36989679

Family Applications (1)

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JP2005038271A Active JP4860163B2 (en) 2005-02-15 2005-02-15 Method for producing conductive fine particles

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JP (1) JP4860163B2 (en)

Families Citing this family (25)

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JP4877230B2 (en) * 2005-11-18 2012-02-15 日立化成工業株式会社 Adhesive composition, circuit connection material, connection structure, and circuit member connection method
EP2284829A1 (en) 2006-08-24 2011-02-16 Sharp Kabushiki Kaisha Liquid crystal display device
KR101088667B1 (en) * 2007-02-26 2011-12-01 세키스이가가쿠 고교가부시키가이샤 Conductive fine particle and anisotropic conductive material
KR20110019392A (en) * 2008-07-01 2011-02-25 히다치 가세고교 가부시끼가이샤 Circuit connection material and circuit connection structure
JP5591475B2 (en) * 2009-01-29 2014-09-17 アルプス電気株式会社 Elastic contact and manufacturing method thereof, and contact substrate and manufacturing method thereof
JP5375374B2 (en) * 2009-07-02 2013-12-25 日立化成株式会社 Circuit connection material and circuit connection structure
JP5358328B2 (en) 2009-07-16 2013-12-04 デクセリアルズ株式会社 Conductive particles, anisotropic conductive film, joined body, and connection method
JP4957838B2 (en) * 2009-08-06 2012-06-20 日立化成工業株式会社 Conductive fine particles and anisotropic conductive materials
JP5518747B2 (en) * 2009-11-16 2014-06-11 日立化成株式会社 Circuit connection material and circuit member connection structure using the same
JP5410387B2 (en) 2010-08-31 2014-02-05 デクセリアルズ株式会社 Conductive particles, method for producing the same, anisotropic conductive film, joined body, and connection method
KR101815336B1 (en) * 2010-09-30 2018-01-04 세키스이가가쿠 고교가부시키가이샤 Conductive particles, anisotropic conductive material and connection structure
BR112013029413B1 (en) * 2011-05-18 2021-08-10 Hitachi Chemical Company, Ltd. CIRCUIT CONNECTION MATERIAL, CIRCUIT ELEMENT CONNECTION STRUCTURE AND CIRCUIT ELEMENT CONNECTION STRUCTURE MANUFACTURING METHOD
JP6049461B2 (en) 2011-12-21 2016-12-21 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
WO2013108740A1 (en) * 2012-01-19 2013-07-25 積水化学工業株式会社 Conductive particles, conductive material and connection structure
WO2013108843A1 (en) * 2012-01-20 2013-07-25 積水化学工業株式会社 Conductive particles, conductive material and connection structure
JP6165625B2 (en) * 2012-01-20 2017-07-19 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP5917318B2 (en) * 2012-07-02 2016-05-11 株式会社日本触媒 Conductive fine particles
JP5368611B1 (en) * 2012-07-12 2013-12-18 ナトコ株式会社 Conductive fine particles
JP5636118B2 (en) 2012-10-02 2014-12-03 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP6478308B2 (en) * 2012-11-28 2019-03-06 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
KR101298101B1 (en) * 2012-12-26 2013-08-20 덕산하이메탈(주) Conductive particles, manufacturing method of the same, and conductive materials including the same
JP6357347B2 (en) * 2013-05-14 2018-07-11 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP6340876B2 (en) * 2014-03-31 2018-06-13 日立化成株式会社 Conductive particles
JP6592298B2 (en) * 2014-08-07 2019-10-16 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP2018104751A (en) * 2016-12-26 2018-07-05 日華化学株式会社 Method of producing composite particle dispersion

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118866A (en) * 1993-10-21 1995-05-09 Nippon Chem Ind Co Ltd Spherical electroless-plated powder or electrically conductive material having excellent dispersibility and its production
JP3696429B2 (en) * 1999-02-22 2005-09-21 日本化学工業株式会社 Conductive electroless plating powder, method for producing the same, and conductive material comprising the plating powder
JP3716903B2 (en) * 1999-11-29 2005-11-16 信越化学工業株式会社 Gold-plated silica and method for producing the same

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