JP2007324138A5 - - Google Patents

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Publication number
JP2007324138A5
JP2007324138A5 JP2007189278A JP2007189278A JP2007324138A5 JP 2007324138 A5 JP2007324138 A5 JP 2007324138A5 JP 2007189278 A JP2007189278 A JP 2007189278A JP 2007189278 A JP2007189278 A JP 2007189278A JP 2007324138 A5 JP2007324138 A5 JP 2007324138A5
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JP
Japan
Prior art keywords
fine particles
conductive
core material
base particle
conductive fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007189278A
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Japanese (ja)
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JP2007324138A (en
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Publication date
Application filed filed Critical
Priority to JP2007189278A priority Critical patent/JP2007324138A/en
Priority claimed from JP2007189278A external-priority patent/JP2007324138A/en
Publication of JP2007324138A publication Critical patent/JP2007324138A/en
Publication of JP2007324138A5 publication Critical patent/JP2007324138A5/ja
Pending legal-status Critical Current

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Claims (7)

基材微粒子の表面に、導電性物質を用いて構成されている粒子状の芯物質を有し、前記基材微粒子及び前記芯物質がメッキ被膜により被覆されており、前記芯物質が被覆されていることによって、前記メッキ被膜の表面が隆起した複数の突起を有することを特徴とする、導電性微粒子。   The surface of the substrate fine particles has a particulate core material composed of a conductive material, the substrate fine particles and the core material are coated with a plating film, and the core material is coated The conductive fine particles are characterized in that the surface of the plating film has a plurality of raised protrusions. 前記基材微粒子の表面に存在する前記芯物質の少なくとも８０％以上が、前記基材微粒子に接触又は前記基材微粒子から５ｎｍ以内の距離に存在することを特徴とする、請求項１記載の導電性微粒子。 Or at least 80% of the core material on the surface of the base particle, characterized in that present in the distance the contact or from the base particle within 5nm to said base particle, conductive of claim 1, wherein Fine particles. 前記メッキ被膜の最外側表面が金層であることを特徴とする、請求項１または２に記載の導電性微粒子。 Wherein the outermost surface of the plating film is a gold layer, a conductive particle according to claim 1 or 2. 前記芯物質は、少なくとも１種以上の金属を用いて構成されていることを特徴とする、請求項１〜３のいずれか１項に記載の導電性微粒子。 The core material is characterized by being formed using at least one or more kinds of metals, conductive fine particles according to any one of claims 1-3. 前記基材微粒子は、樹脂微粒子であることを特徴とする、請求項１〜４のいずれか１項に記載の導電性微粒子。 The base particle is characterized by a resin fine particles, the conductive fine particles according to any one of claims 1-4. 前記隆起した突起部分の平均高さが、導電性微粒子の平均粒子径の０．５％以上であることを特徴とする、請求項１〜５のいずれか１項に記載の導電性微粒子。 The conductive fine particles according to any one of claims 1 to 5 , wherein an average height of the protruding protrusions is 0.5% or more of an average particle diameter of the conductive fine particles. 請求項１〜６のいずれか１項に記載の導電性微粒子が樹脂バインダーに分散されていることを特徴とする、異方性導電材料。
An anisotropic conductive material, wherein the conductive fine particles according to any one of claims 1 to 6 are dispersed in a resin binder.
JP2007189278A 2004-01-30 2007-07-20 Conductive particulate and anisotropic conductive material Pending JP2007324138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007189278A JP2007324138A (en) 2004-01-30 2007-07-20 Conductive particulate and anisotropic conductive material

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004024063 2004-01-30
JP2004241571 2004-08-20
JP2007189278A JP2007324138A (en) 2004-01-30 2007-07-20 Conductive particulate and anisotropic conductive material

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005517472A Division JP4243279B2 (en) 2004-01-30 2005-01-27 Conductive fine particles and anisotropic conductive materials

Publications (2)

Publication Number Publication Date
JP2007324138A JP2007324138A (en) 2007-12-13
JP2007324138A5 true JP2007324138A5 (en) 2008-02-14

Family

ID=38856713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007189278A Pending JP2007324138A (en) 2004-01-30 2007-07-20 Conductive particulate and anisotropic conductive material

Country Status (1)

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JP (1) JP2007324138A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5430093B2 (en) 2008-07-24 2014-02-26 デクセリアルズ株式会社 Conductive particles, anisotropic conductive film, joined body, and connection method
KR101704856B1 (en) * 2010-03-08 2017-02-08 세키스이가가쿠 고교가부시키가이샤 Electroconductive particle, anisotropic electroconductive material and connecting structure
JP5580729B2 (en) * 2010-12-28 2014-08-27 積水化学工業株式会社 Conductive particles, anisotropic conductive materials, and connection structures
JP5941328B2 (en) * 2012-04-10 2016-06-29 日本化学工業株式会社 Conductive particles and conductive material containing the same
CN104471650A (en) * 2012-10-02 2015-03-25 积水化学工业株式会社 Conductive particle, conductive material and connecting structure
JP6379761B2 (en) * 2014-07-09 2018-08-29 日立化成株式会社 Conductive particle, insulating coated conductive particle, anisotropic conductive adhesive, connection structure, and method for producing conductive particle

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2504057B2 (en) * 1987-06-02 1996-06-05 日立化成工業株式会社 Conductive particles
JP3420809B2 (en) * 1993-12-16 2003-06-30 信越ポリマー株式会社 Conductive particles and anisotropic conductive adhesive using the same
JP3741841B2 (en) * 1997-10-30 2006-02-01 信越ポリマー株式会社 Anisotropic conductive adhesive
KR101131229B1 (en) * 2004-01-30 2012-03-28 세키스이가가쿠 고교가부시키가이샤 Conductive particle and anisotropic conductive material

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