JP2006302716A5 - - Google Patents
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- Publication number
- JP2006302716A5 JP2006302716A5 JP2005124225A JP2005124225A JP2006302716A5 JP 2006302716 A5 JP2006302716 A5 JP 2006302716A5 JP 2005124225 A JP2005124225 A JP 2005124225A JP 2005124225 A JP2005124225 A JP 2005124225A JP 2006302716 A5 JP2006302716 A5 JP 2006302716A5
- Authority
- JP
- Japan
- Prior art keywords
- particles
- conductive
- particle
- base
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 4
- 239000003381 stabilizer Substances 0.000 claims 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 239000006185 dispersion Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Claims (5)
前記導電層は、表面に塊状微粒子の凝集体からなる突起を有する
ことを特徴とする導電性粒子。 Conductive particles comprising substrate particles and a conductive layer containing nickel or a nickel alloy formed on the surface of the substrate particles,
The conductive particle has a protrusion made of an aggregate of massive fine particles on the surface thereof.
前記工程１のアルカリ溶液の濃度をＡ（重量％）、前記工程３の基材粒子分散液中におけるメッキ安定剤の濃度をＢ（ｍｏｌ／Ｌ）とするとき、ＡとＢとの比（Ｂ／Ａ）が下記式（１）を満たす
ことを特徴とする導電性粒子の製造方法。
５．０×１０−７＜Ｂ／Ａ＜３．０×１０−６ （１） Step 1 of etching the surface of the base particle using an alkaline solution, Step 2 of applying a catalyst to the surface of the etched base particle, and a base particle dispersion containing a plating stabilizer in nickel or Adding a plating solution containing a nickel alloy and a plating stabilizer, and forming a conductive layer on the surface of the base material particles provided with a catalyst, and a method for producing conductive particles comprising:
When the concentration of the alkaline solution in Step 1 is A (% by weight) and the concentration of the plating stabilizer in the base particle dispersion in Step 3 is B (mol / L), the ratio of A to B (B / A) satisfy | fills following formula (1), The manufacturing method of the electroconductive particle characterized by the above-mentioned.
5.0 × 10 −7 <B / A <3.0 × 10 −6 (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005124225A JP4936678B2 (en) | 2005-04-21 | 2005-04-21 | Conductive particles and anisotropic conductive materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005124225A JP4936678B2 (en) | 2005-04-21 | 2005-04-21 | Conductive particles and anisotropic conductive materials |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012002383A Division JP5529901B2 (en) | 2012-01-10 | 2012-01-10 | Conductive particles and anisotropic conductive materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006302716A JP2006302716A (en) | 2006-11-02 |
| JP2006302716A5 true JP2006302716A5 (en) | 2008-03-06 |
| JP4936678B2 JP4936678B2 (en) | 2012-05-23 |
Family
ID=37470762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005124225A Active JP4936678B2 (en) | 2005-04-21 | 2005-04-21 | Conductive particles and anisotropic conductive materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4936678B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4877230B2 (en) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | Adhesive composition, circuit connection material, connection structure, and circuit member connection method |
| WO2008105355A1 (en) * | 2007-02-26 | 2008-09-04 | Sekisui Chemical Co., Ltd. | Conductive fine particle and anisotropic conductive material |
| JP5358328B2 (en) | 2009-07-16 | 2013-12-04 | デクセリアルズ株式会社 | Conductive particles, anisotropic conductive film, joined body, and connection method |
| WO2011111152A1 (en) * | 2010-03-08 | 2011-09-15 | 積水化学工業株式会社 | Electroconductive particle, anisotropic electroconductive material and connecting structure |
| JP5410387B2 (en) | 2010-08-31 | 2014-02-05 | デクセリアルズ株式会社 | Conductive particles, method for producing the same, anisotropic conductive film, joined body, and connection method |
| JP5184612B2 (en) | 2010-11-22 | 2013-04-17 | 日本化学工業株式会社 | Conductive powder, conductive material containing the same, and method for producing the same |
| KR101298101B1 (en) * | 2012-12-26 | 2013-08-20 | 덕산하이메탈(주) | Conductive particles, manufacturing method of the same, and conductive materials including the same |
| JP6231374B2 (en) * | 2012-12-31 | 2017-11-15 | 株式会社ドクサンハイメタル | Conductive particles for touch screen panel and conductive material containing the same |
| WO2016080407A1 (en) | 2014-11-17 | 2016-05-26 | 積水化学工業株式会社 | Conductive particle, conductive material, and connection structure |
| KR20180120667A (en) * | 2016-03-15 | 2018-11-06 | 세키스이가가쿠 고교가부시키가이샤 | Metal-containing particles, a connecting material, a connecting structure, |
| CN111095441B (en) * | 2017-09-20 | 2021-11-23 | 积水化学工业株式会社 | Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3696429B2 (en) * | 1999-02-22 | 2005-09-21 | 日本化学工業株式会社 | Conductive electroless plating powder, method for producing the same, and conductive material comprising the plating powder |
| JP4832712B2 (en) * | 2003-06-02 | 2011-12-07 | 積水化学工業株式会社 | Conductive fine particles and anisotropic conductive materials |
| JP4387175B2 (en) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | Coated conductive particles, anisotropic conductive material, and conductive connection structure |
-
2005
- 2005-04-21 JP JP2005124225A patent/JP4936678B2/en active Active
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