JP2005149764A5 - - Google Patents

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Publication number
JP2005149764A5
JP2005149764A5 JP2003381658A JP2003381658A JP2005149764A5 JP 2005149764 A5 JP2005149764 A5 JP 2005149764A5 JP 2003381658 A JP2003381658 A JP 2003381658A JP 2003381658 A JP2003381658 A JP 2003381658A JP 2005149764 A5 JP2005149764 A5 JP 2005149764A5
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JP
Japan
Prior art keywords
particle
particles
core
conductive
shell
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JP2003381658A
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Japanese (ja)
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JP2005149764A (en
JP4686120B2 (en
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Priority to JP2003381658A priority Critical patent/JP4686120B2/en
Priority claimed from JP2003381658A external-priority patent/JP4686120B2/en
Publication of JP2005149764A publication Critical patent/JP2005149764A/en
Publication of JP2005149764A5 publication Critical patent/JP2005149764A5/ja
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Publication of JP4686120B2 publication Critical patent/JP4686120B2/en
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Expired - Fee Related legal-status Critical Current

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Claims (6)

表面が導電性を有する金属からなる基材粒子と前記基材粒子を被覆する絶縁性のコアシェル粒子とからなる被覆導電性粒子であって、
前記コアシェル粒子は、コア粒子と前記コア粒子の表面に形成されたシェル層とからなることを特徴とする被覆導電粒子。 Covered conductive particles comprising base particles made of metal having conductive surface and insulating core-shell particles covering the base particles,
The coated conductive particle according to claim 1, wherein the core-shell particle includes a core particle and a shell layer formed on a surface of the core particle. コアシェル粒子は、コア粒子のガラス転移温度又は軟化温度よりもシェル層のガラス転移温度又は軟化温度が高く、及び／又は、コア粒子の融点よりもシェル層の融点が高いものであることを特徴とする請求項１記載の被覆導電粒子。 The core-shell particles are characterized in that the glass transition temperature or softening temperature of the shell layer is higher than the glass transition temperature or softening temperature of the core particles, and / or the melting point of the shell layer is higher than the melting point of the core particles. The coated conductive particles according to claim 1. コアシェル粒子は、基材粒子に対して結合性を有する官能基（Ａ）を介して前記基材粒子の表面を部分的に被覆していることを特徴とする請求項１又は２記載の被覆導電粒子。 The coated conductive according to claim 1 or 2, wherein the core-shell particles partially cover the surface of the base particle through a functional group (A) having binding properties to the base particle. particle. コアシェル粒子によって基材粒子表面が単層で被覆されていることを特徴とする請求項１、２又は３記載の被覆導電粒子。 4. The coated conductive particle according to claim 1, 2 or 3, wherein the surface of the substrate particle is coated with a single layer by the core-shell particle. 請求項１、２、３又は４記載の被覆導電粒子が絶縁性のバインダー樹脂中に分散されていることを特徴とする異方性導電材料。 An anisotropic conductive material, wherein the coated conductive particles according to claim 1, 2, 3 or 4 are dispersed in an insulating binder resin. 請求項１、２、３又は４記載の被覆導電粒子又は請求項５記載の異方性導電材料により導電接続されていることを特徴とする導電接続構造体。 6. A conductive connection structure, wherein the conductive connection structure is conductively connected by the coated conductive particles according to claim 1, 2, 3 or 4, or the anisotropic conductive material according to claim 5 .
JP2003381658A 2003-11-11 2003-11-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure Expired - Fee Related JP4686120B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003381658A JP4686120B2 (en) 2003-11-11 2003-11-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003381658A JP4686120B2 (en) 2003-11-11 2003-11-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure

Publications (3)

Publication Number Publication Date
JP2005149764A JP2005149764A (en) 2005-06-09
JP2005149764A5 true JP2005149764A5 (en) 2006-09-21
JP4686120B2 JP4686120B2 (en) 2011-05-18

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JP2003381658A Expired - Fee Related JP4686120B2 (en) 2003-11-11 2003-11-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure

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JP (1) JP4686120B2 (en)

Families Citing this family (21)

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KR100722493B1 (en) * 2005-09-02 2007-05-28 제일모직주식회사 Insulated Conductive Particles and an Anisotropic Conductive Adhesive Film Using the Same
WO2007145657A2 (en) * 2005-11-01 2007-12-21 Massachusetts Institute Of Technology Initiated chemical vapor deposition of vinyl polymers for the encapsulation of particles
WO2007072912A1 (en) * 2005-12-22 2007-06-28 Sekisui Chemical Co., Ltd. Conductive fine particle and anisotropic conductive material
US20100065311A1 (en) * 2006-07-03 2010-03-18 Hitachi Chemical Company, Ltd. Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member
KR100752533B1 (en) * 2006-11-06 2007-08-29 한국과학기술연구원 Conducting particle complex with polymer microcapsules and preparation thereof
KR100871759B1 (en) 2007-04-13 2008-12-05 엘에스엠트론 주식회사 Conductive ball for anisotropic conductive adhesive
JP5368760B2 (en) * 2008-09-29 2013-12-18 積水化学工業株式会社 Insulating coating conductive particles, anisotropic conductive material, and connection structure
JP5548053B2 (en) * 2010-07-02 2014-07-16 積水化学工業株式会社 Conductive particles with insulating particles, method for producing conductive particles with insulating particles, anisotropic conductive material, and connection structure
JP5672022B2 (en) * 2011-01-25 2015-02-18 日立化成株式会社 Insulating coated conductive particles, anisotropic conductive material, and connection structure
JP2011181525A (en) * 2011-06-09 2011-09-15 Sony Chemical & Information Device Corp Anisotropic conductive material
JP5803393B2 (en) * 2011-08-02 2015-11-04 日立化成株式会社 Insulating coated conductive particles and anisotropic conductive adhesive film
JP6044195B2 (en) * 2011-09-06 2016-12-14 日立化成株式会社 Insulating coating particles, insulating coating conductive particles, anisotropic conductive materials, and connection structures
KR101950516B1 (en) * 2011-09-06 2019-02-20 히타치가세이가부시끼가이샤 Particle for insulation coating, insulating coated conductive particle, anisotropic conductive material, and connecting structure
JP5750342B2 (en) * 2011-09-12 2015-07-22 株式会社日本触媒 Insulating fine particles, insulating fine particle-coated conductive fine particles, anisotropic conductive adhesive composition, and anisotropic conductive molded body
JP5952553B2 (en) * 2011-12-14 2016-07-13 株式会社日本触媒 Conductive fine particles and anisotropic conductive material containing the same
JP5939063B2 (en) * 2012-07-11 2016-06-22 日立化成株式会社 Insulating coated conductive particles and anisotropic conductive adhesive using the same
CN110520938B (en) * 2017-05-08 2021-10-08 日本化学工业株式会社 Coated particles and method for producing same
CN110574126A (en) * 2017-05-08 2019-12-13 日本化学工业株式会社 Coated particles and method for producing same
KR102500093B1 (en) * 2019-03-26 2023-02-16 후루카와 덴키 고교 가부시키가이샤 Manufacturing method of anisotropic conductive sheet
CN110176588B (en) * 2019-05-28 2022-01-28 中国科学院重庆绿色智能技术研究院 Preparation method of electrode material
WO2022044913A1 (en) 2020-08-24 2022-03-03 日本化学工業株式会社 Coated particles and method for manufacturing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2895872B2 (en) * 1989-09-26 1999-05-24 触媒化成工業株式会社 Anisotropic conductive material, anisotropic conductive adhesive, method for electrically connecting electrodes using the anisotropic conductive adhesive, and electric circuit board formed by the method
JP5060692B2 (en) * 2001-07-13 2012-10-31 株式会社日本触媒 Anisotropic conductive material
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (en) * 2003-05-06 2006-06-14 한화석유화학 주식회사 Anisotropic insulated conductive ball for electric connection, preparing method thereof and product using the same

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