JP2006054066A5

JP2006054066A5 -

Info

Publication number: JP2006054066A5
Application number: JP2004232957A
Authority: JP
Filing date: 2004-08-10
Publication date: 2007-08-23
Anticipated expiration: 2024-08-10

Description

（１）コア粒子と該コア粒子表面に導電性繊維層を有し、コア粒子が有機ポリマー粒子である導電性粒子。 (1) a core particle and have a conductive fiber layer to the core particle surface, the conductive particle core particles are organic polymer particles.

（７）コア粒子が、熱可塑性樹脂を主成分とする粒子であることを特徴とする（１）〜（６）のいずれか記載の導電性粒子。 (7) The conductive particles according to any one of (1) to (6), wherein the core particles are particles mainly composed of a thermoplastic resin.

（８）熱可塑性樹脂が、ポリアミドであることを特徴とする（７）記載の導電性粒子。 (8) The conductive particle according to (7) , wherein the thermoplastic resin is polyamide.

（９）コア粒子が、グリルアミドおよびエポキシ樹脂を主成分とする有機ポリマー粒子であることを特徴とする（１）〜（６）のいずれか記載の導電性粒子。 (9) The conductive particles according to any one of (1) to (6) , wherein the core particles are organic polymer particles mainly composed of grill amide and epoxy resin.

（１０）コア粒子の平均粒子径が、0.5から1000μmの範囲であることを特徴とする（１）〜（９）のいずれか記載の導電性粒子。 (10) The conductive particles according to any one of (1) to (9) , wherein the average particle diameter of the core particles is in the range of 0.5 to 1000 μm.

（１１）コア粒子の平均粒子径が、5から100μmの範囲であることを特徴とする（１０）記載の導電性粒子。 (11) The conductive particles according to (10) , wherein the average particle diameter of the core particles is in the range of 5 to 100 μm.

（１２）接着性バインダーおよび（１）〜（１１）のいずれか記載の導電性粒子を含有する異方導電性材料用組成物。 (12) An anisotropic conductive material composition containing an adhesive binder and the conductive particles according to any one of (1) to (11) .

（１３）絶縁性熱硬化性樹脂および（１）〜（１１）のいずれか記載の導電性粒子を含有する異方性導電性接着剤。 (13) An anisotropic conductive adhesive containing an insulating thermosetting resin and the conductive particles according to any one of (1) to (11) .

（１４）絶縁性熱硬化性樹脂および（１）〜（１１）のいずれか記載の導電性粒子を含有する絶縁性熱硬化性樹脂フィルム。 (14) An insulating thermosetting resin film containing an insulating thermosetting resin and the conductive particles according to any one of (1) to (11) .

（１５）フィルム表面に導電性粒子から形成された微粒子層を有する（１４）記載の絶縁性熱硬化性樹脂フィルム。 (15) The insulating thermosetting resin film according to (14), which has a fine particle layer formed of conductive particles on the film surface.

１．コア粒子
本発明に用いる、コア粒子としては、無機酸化物粒子、有機無機複合粒子、有機ポリマー粒子などを用いることができるが、ポリマー粒子を用いることを必須とする。無機酸化物粒子としては、シリカ、アルミナ、ジルコニア、チタニア、シリカ・アルミナ、シリカ・ジルコニア等従来公知の単一の無機酸化物粒子、２種以上の複合無機酸化物粒子が挙げられる。有機無機複合粒子としては金属アルコキシドおよび／または金属アルキルアルコキシドを加水分解して得られる従来公知のポリオルガノシロキサン等の粒子が挙げられる。さらに、有機ポリマー粒子としては、ポリアミド樹脂、フェノール樹脂、アミノ樹脂、アクリル樹脂、エチレン−酢酸ビニル樹脂、ポリエステル樹脂、尿素樹脂、メラミン樹脂、アルキド樹脂、ポリイミド樹脂、ウレタン樹脂、エポキシ樹脂等の熱可塑性樹脂、熱硬化性樹脂、有機無機ハイブリッド共重合体等があげられる。また、ここで挙げた材料を２種類以上複合して用いても良い。 1. It used the core particles present invention, as a core particle child, inorganic oxide particles, organic-inorganic composite particles, and the like can be used organic polymer particles, essential to the use of polymer particles. Examples of the inorganic oxide particles include conventionally known single inorganic oxide particles such as silica, alumina, zirconia, titania, silica / alumina, silica / zirconia, and two or more kinds of composite inorganic oxide particles. Examples of the organic / inorganic composite particles include conventionally known polyorganosiloxane particles obtained by hydrolyzing metal alkoxide and / or metal alkyl alkoxide. Furthermore, as organic polymer particles, thermoplastic resins such as polyamide resin, phenol resin, amino resin, acrylic resin, ethylene-vinyl acetate resin, polyester resin, urea resin, melamine resin, alkyd resin, polyimide resin, urethane resin, epoxy resin, etc. Examples thereof include resins, thermosetting resins, and organic-inorganic hybrid copolymers. Further, two or more kinds of the materials mentioned here may be used in combination.

Claims

Have a conductive fiber layer to the core particle and the core particle surface, the conductive particle core particles are organic polymer particles.

The conductive particles according to claim 1, wherein the conductive fibers are composed only of carbon.

Conductive particles of claim 1 or 2 Claims having an adhesive layer between the core particles and the conductive fiber layer.

Core particles, the conductive particles according to any one of claims 1 to 3, characterized in that the particles containing as a main component a thermoplastic resin.

The conductive particles according to claim 4 , wherein the thermoplastic resin is polyamide.

5. The conductive particle according to claim 4 , wherein the core particle is an organic polymer particle mainly composed of grill amide and epoxy resin.

The composition for anisotropic conductive materials containing an adhesive binder and the electroconductive particle of any one of Claim 1 to 6 .

Anisotropic conductive adhesive containing conductive particles according to any one of the insulative thermosetting resin and claims 1 to 7.

Insulating thermosetting resin film containing the conductive particles according to any one of the insulative thermosetting resin and claims 1 to 7.

The insulating thermosetting resin film according to claim 9, further comprising a fine particle layer formed of conductive particles on the film surface.