JP2013065675A5 - - Google Patents

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Publication number
JP2013065675A5
JP2013065675A5 JP2011203034A JP2011203034A JP2013065675A5 JP 2013065675 A5 JP2013065675 A5 JP 2013065675A5 JP 2011203034 A JP2011203034 A JP 2011203034A JP 2011203034 A JP2011203034 A JP 2011203034A JP 2013065675 A5 JP2013065675 A5 JP 2013065675A5
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JP
Japan
Prior art keywords
electromagnetic wave
wave shielding
black
shielding material
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2011203034A
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Japanese (ja)
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JP2013065675A (en
JP5712095B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011203034A external-priority patent/JP5712095B2/en
Priority to JP2011203034A priority Critical patent/JP5712095B2/en
Priority to TW101129170A priority patent/TWI547236B/en
Priority to KR1020120100925A priority patent/KR101405361B1/en
Priority to CN201510278068.0A priority patent/CN105050314B/en
Priority to CN2012103420250A priority patent/CN103002725A/en
Publication of JP2013065675A publication Critical patent/JP2013065675A/en
Priority to KR1020140045947A priority patent/KR20140063546A/en
Publication of JP2013065675A5 publication Critical patent/JP2013065675A5/ja
Publication of JP5712095B2 publication Critical patent/JP5712095B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (6)

ポリエチレンテレフタレートからなる支持体フィルムの片面の上に、流延塗布された誘電体の薄膜樹脂フィルムからなる基材、アンカーコート層、金属薄膜層、導電性接着剤層、が順に積層されてなり、前記基材が、溶剤可溶性ポリイミドを用いて形成されたポリイミドフィルムからなり、厚みが１〜９μｍであり、前記アンカーコート層が、カーボンブラック、黒鉛、アニリンブラック、シアニンブラック、チタンブラック、黒色酸化鉄、酸化クロム、酸化マンガンからなる群より選択される１種以上の黒色顔料、または有色顔料の１種以上からなる光吸収材を含有することを特徴とするＦＰＣ用電磁波シールド材。 On the one side of the support film made of polyethylene terephthalate, substrate made of a thin resin film casting and coating dielectric, anchor coating layer, the metal thin film layer, the conductive adhesive layer, Ri but name are stacked in this order The base material is made of a polyimide film formed using a solvent-soluble polyimide, has a thickness of 1 to 9 μm, and the anchor coat layer has carbon black, graphite, aniline black, cyanine black, titanium black, black oxide An electromagnetic wave shielding material for FPC, comprising a light absorbing material comprising one or more black pigments selected from the group consisting of iron, chromium oxide and manganese oxide, or one or more of colored pigments . 前記アンカーコート層が、アクリル系樹脂、ポリウレタン系樹脂、ポリエステル系樹脂、セルロース系樹脂、エポキシ系樹脂、ポリアミド系樹脂からなる群の中から選択された１種以上の樹脂を含むことを特徴とする請求項１に記載のＦＰＣ用電磁波シールド材。   The anchor coat layer includes at least one resin selected from the group consisting of acrylic resins, polyurethane resins, polyester resins, cellulose resins, epoxy resins, and polyamide resins. The electromagnetic wave shielding material for FPC according to claim 1. 前記導電性接着剤層が、導電性の微粒子、イオン性化合物、導電性高分子などの導電性材料群の中から選択された１種以上を含有する熱硬化型接着剤であることを特徴とする請求項１又は２に記載のＦＰＣ用電磁波シールド材。   The conductive adhesive layer is a thermosetting adhesive containing one or more selected from the group of conductive materials such as conductive fine particles, ionic compounds, and conductive polymers. The electromagnetic wave shielding material for FPCs according to claim 1 or 2. 前記導電性接着剤層上に、更に、剥離処理された剥離フィルムが貼り合せてなることを特徴とする請求項１から３のいずれかに記載のＦＰＣ用電磁波シールド材。 The electromagnetic shielding material for FPC according to any one of claims 1 to 3 , wherein a release film subjected to a release treatment is further bonded to the conductive adhesive layer. 請求項１から４のいずれかに記載のＦＰＣ用電磁波シールド材が、電磁波遮蔽用の部材として使用されてなる携帯電話。 FPC electromagnetic wave shielding material according to any one of claims 1 to 4 is formed by using as a member of the electromagnetic wave shielding mobile phone. 請求項１から４のいずれかに記載のＦＰＣ用電磁波シールド材が、電磁波遮蔽用の部材として使用されてなる電子機器。 An electronic device in which the electromagnetic wave shielding material for FPC according to any one of claims 1 to 4 is used as an electromagnetic wave shielding member.
JP2011203034A 2011-09-16 2011-09-16 Electromagnetic wave shielding material for FPC Active JP5712095B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011203034A JP5712095B2 (en) 2011-09-16 2011-09-16 Electromagnetic wave shielding material for FPC
TW101129170A TWI547236B (en) 2011-09-16 2012-08-13 Electromagnetic wave shielding material for FPC
KR1020120100925A KR101405361B1 (en) 2011-09-16 2012-09-12 Electromagnetic shielding materials for fpc
CN2012103420250A CN103002725A (en) 2011-09-16 2012-09-14 Electromagnetic wave shielding material for FPC
CN201510278068.0A CN105050314B (en) 2011-09-16 2012-09-14 Electromagnetic shielding materials for fpc
KR1020140045947A KR20140063546A (en) 2011-09-16 2014-04-17 Electromagnetic shielding materials for fpc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011203034A JP5712095B2 (en) 2011-09-16 2011-09-16 Electromagnetic wave shielding material for FPC

Publications (3)

Publication Number Publication Date
JP2013065675A JP2013065675A (en) 2013-04-11
JP2013065675A5 true JP2013065675A5 (en) 2015-03-19
JP5712095B2 JP5712095B2 (en) 2015-05-07

Family

ID=47930680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011203034A Active JP5712095B2 (en) 2011-09-16 2011-09-16 Electromagnetic wave shielding material for FPC

Country Status (4)

Country Link
JP (1) JP5712095B2 (en)
KR (2) KR101405361B1 (en)
CN (2) CN105050314B (en)
TW (1) TWI547236B (en)

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JP2015109404A (en) * 2013-10-24 2015-06-11 信越ポリマー株式会社 Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, and manufacturing method thereof
CN103717050A (en) * 2013-12-03 2014-04-09 明冠新材料股份有限公司 Thin-type flexible thermally-cured electromagnetic shielding glue film
KR102202145B1 (en) 2014-03-28 2021-01-13 삼성디스플레이 주식회사 Display device having cushion pad
JP2015220259A (en) * 2014-05-14 2015-12-07 Tdk株式会社 Magnetism suppression sheet and method of manufacturing the same
KR20150130915A (en) * 2014-05-14 2015-11-24 티디케이가부시기가이샤 Magnetism suppressing sheet and manufacturing method thereof
JP2015220260A (en) * 2014-05-14 2015-12-07 Tdk株式会社 Magnetism suppression sheet and method of manufacturing the same
JP6184025B2 (en) * 2014-09-04 2017-08-23 信越ポリマー株式会社 Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film
JP6381117B2 (en) * 2014-09-04 2018-08-29 信越ポリマー株式会社 Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film
JP6435540B2 (en) * 2014-09-19 2018-12-12 信越ポリマー株式会社 Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof
JP6467701B2 (en) * 2014-10-28 2019-02-13 信越ポリマー株式会社 Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof
JP6028290B2 (en) * 2014-12-11 2016-11-16 東洋インキＳｃホールディングス株式会社 Electromagnetic shielding sheet and printed wiring board
KR101862121B1 (en) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 Electromagnetic wave shielding sheet, printed wiring board and electronic devices
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JP6706654B2 (en) * 2018-10-01 2020-06-10 信越ポリマー株式会社 Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, and methods for manufacturing the same
JP6706655B2 (en) * 2018-10-01 2020-06-10 信越ポリマー株式会社 Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, and methods for manufacturing the same
JP6497477B1 (en) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shield sheet and electronic component mounting board
JP2020064927A (en) * 2018-10-16 2020-04-23 信越ポリマー株式会社 Electromagnetic wave shield film, manufacturing method of the same, and printed wiring board with electromagnetic wave shield film
JP7281888B2 (en) * 2018-10-16 2023-05-26 信越ポリマー株式会社 Electromagnetic wave shielding film and manufacturing method thereof, printed wiring board with electromagnetic wave shielding film and manufacturing method thereof
CN109808267B (en) * 2019-01-31 2021-01-29 常德力元新材料有限责任公司 Electromagnetic shielding composite material and preparation method thereof
WO2020241835A1 (en) * 2019-05-29 2020-12-03 タツタ電線株式会社 Electromagnetic wave shielding film and shielding printed wiring board
CN111073530B (en) * 2019-12-02 2021-03-30 苏州市新广益电子有限公司 Conductive adhesive film for electroplating FPC and production process thereof
CN111669957B (en) * 2020-06-15 2022-08-02 江苏百旭电子新材料科技有限公司 FPC hot-pressing shielding film and production method thereof
CN111968536B (en) * 2020-09-09 2022-06-10 武汉华星光电半导体显示技术有限公司 Shielding belt and preparation method of display module
JP7420062B2 (en) * 2020-12-24 2024-01-23 Dic株式会社 Conductive laminate and conductive adhesive tape
CN114364245A (en) * 2022-01-18 2022-04-15 成都佳驰电子科技股份有限公司 Flexible conductive shielding film and preparation method thereof
CN115734601A (en) * 2022-11-24 2023-03-03 昆山雅森电子材料科技有限公司 High-section-difference electromagnetic interference shielding film and preparation method thereof

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