TW200511328A - Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure - Google Patents

Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure

Info

Publication number
TW200511328A
TW200511328A TW093119096A TW93119096A TW200511328A TW 200511328 A TW200511328 A TW 200511328A TW 093119096 A TW093119096 A TW 093119096A TW 93119096 A TW93119096 A TW 93119096A TW 200511328 A TW200511328 A TW 200511328A
Authority
TW
Taiwan
Prior art keywords
conductive
particle
coated
anisotropic conductive
anisotropic
Prior art date
Application number
TW093119096A
Other languages
Chinese (zh)
Other versions
TWI276117B (en
Inventor
Yasuhiro Hasegawa
Original Assignee
Natoco Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Natoco Co Ltd filed Critical Natoco Co Ltd
Publication of TW200511328A publication Critical patent/TW200511328A/en
Application granted granted Critical
Publication of TWI276117B publication Critical patent/TWI276117B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a coated conductive particle, which is composed of a metal-coated particle and a thermoplastic resin layer strongly bonded to a metal layer of the particle. The thermoplastic resin layer of this coated conductive particle is not dissolved in a solvent, and is not melted when heated. A coated conductive particle comprises a base fine particle, a metal coating layer applied onto the base fine particle, and a resin layer which is formed on the metal coating layer and composed of a thermoplastic polymer. The thermoplastic polymer is chemically bonded with an organic compound introduced in the metal coating layer.
TW093119096A 2003-07-04 2004-06-29 Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure TWI276117B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003191704 2003-07-04

Publications (2)

Publication Number Publication Date
TW200511328A true TW200511328A (en) 2005-03-16
TWI276117B TWI276117B (en) 2007-03-11

Family

ID=33562373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119096A TWI276117B (en) 2003-07-04 2004-06-29 Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure

Country Status (5)

Country Link
JP (1) JP4412669B2 (en)
KR (1) KR100740920B1 (en)
CN (1) CN1332400C (en)
TW (1) TWI276117B (en)
WO (1) WO2005004171A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381399B (en) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc Enhanced performance conductive filler and conductive polymers made therefrom

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4674119B2 (en) * 2005-06-06 2011-04-20 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and connection structure
JP4941554B2 (en) * 2007-05-09 2012-05-30 日立化成工業株式会社 Film-like circuit connection material and circuit member connection structure
JP2009170414A (en) * 2007-12-18 2009-07-30 Hitachi Chem Co Ltd Insulation-coated conductive particle, anisotropic conductive adhesive film, and their manufacturing method
JP5549069B2 (en) * 2008-04-22 2014-07-16 日立化成株式会社 Particulate conductive material for anisotropic conductive adhesive, method for producing the same, and anisotropic conductive adhesive
JP2012003917A (en) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
JP5619675B2 (en) * 2010-08-16 2014-11-05 株式会社日本触媒 Conductive fine particles and anisotropic conductive materials
JP5576231B2 (en) * 2010-09-30 2014-08-20 積水化学工業株式会社 Conductive particles, anisotropic conductive materials, and connection structures
CN102136313B (en) * 2010-12-06 2013-07-24 苏州纳微生物科技有限公司 Compound microsphere, anisotropic conductive material, anisotropic conductive film and conductive structure
KR101368577B1 (en) * 2012-02-21 2014-02-28 세키스이가가쿠 고교가부시키가이샤 Conductive particle, conductive particle manufacturing method, conductive material and connection structure
TWI570208B (en) * 2012-09-07 2017-02-11 日立化成股份有限公司 Circuit connecting material and connection body
KR102095823B1 (en) * 2012-10-02 2020-04-01 세키스이가가쿠 고교가부시키가이샤 Conductive particle, conductive material and connecting structure
KR20170090353A (en) * 2014-11-20 2017-08-07 세키스이가가쿠 고교가부시키가이샤 Conductive particles, method for manufacturing conductive particles, conductive material, and connection structure
WO2016133113A1 (en) * 2015-02-19 2016-08-25 積水化学工業株式会社 Electroconductive paste and connection structure
WO2018151139A1 (en) * 2017-02-17 2018-08-23 日立化成株式会社 Adhesive film
CN108928056B (en) * 2018-08-01 2020-06-05 京东方科技集团股份有限公司 Membrane material, preparation method thereof and display substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100832282B1 (en) 2000-10-23 2008-05-26 세키스이가가쿠 고교가부시키가이샤 Coated particle
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP2003157717A (en) * 2001-11-20 2003-05-30 C Uyemura & Co Ltd Conductive particle and conductive connecting member, and conductive connection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381399B (en) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc Enhanced performance conductive filler and conductive polymers made therefrom

Also Published As

Publication number Publication date
WO2005004171A1 (en) 2005-01-13
JP4412669B2 (en) 2010-02-10
KR20060040572A (en) 2006-05-10
CN1332400C (en) 2007-08-15
TWI276117B (en) 2007-03-11
CN1706008A (en) 2005-12-07
JPWO2005004171A1 (en) 2006-08-17
KR100740920B1 (en) 2007-07-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees