JP2012003917A - Conductive particle, anisotropic conductive material and connection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive particle and a connection structure using the conductive particle, which has a conductive layer less prone to rust, is capable of keeping its conductivity high for a long time, enhanced in its hydrophilic property and increased in its dispersibility in an oxygen-containing resin such as an epoxy resin.SOLUTION: A conductive particle 1 according to the invention comprises: a conductive particle body 2 having a resin particle 11 and a conductive layer 12 provided on the surface of the resin particle 11; and a covering layer 3 covering the surface of the conductive particle body 2. The covering layer 3 is formed by causing an organosilicon compound to crosslink. The connection structure according to the invention comprises: a first connection target member; a second connection target member; and a connection part connecting between the first and second connection target members. The connection part is formed by the conductive particles 1 or an anisotropic conductive material containing the conductive particles 1 and a binder resin.

Description

  The present invention relates to, for example, conductive particles that can be used for electrical connection between electrodes, and an anisotropic conductive material and a connection structure using the conductive particles.

  Anisotropic conductive materials such as anisotropic conductive pastes, anisotropic conductive inks, anisotropic conductive adhesives, anisotropic conductive films and anisotropic conductive sheets are widely known. In these anisotropic conductive materials, conductive particles are dispersed in paste, ink, or resin.

  The anisotropic conductive material is used for connection between an IC chip and a flexible printed circuit board, connection between an IC chip and a circuit board having an ITO electrode, and the like. For example, after disposing an anisotropic conductive material between the electrode of the IC chip and the electrode of the circuit board, these electrodes can be electrically connected by heating and pressing.

  As an example of the conductive particles, Patent Document 1 listed below covers conductive particles having a polar group on at least a part of the surface, and covers at least a part of the surface of the conductive particles, and has an insulating property. Conductive particles with insulating particles having an insulating material containing particles are disclosed. Specifically, the insulating material includes a polymer electrolyte that can adsorb the polar group, and inorganic oxide particles that can adsorb the polymer electrolyte. The inorganic oxide particles are insulating particles.

  Moreover, although it is not the electroconductive particle used for the electrical connection between electrodes, the following patent document 2 is disclosing the particle | grains by which the metal fine particle was encapsulated with the insulating resin. Examples of insulating resins include acidic group-containing resins and cross-linked resins. Patent Document 2 also describes particles in which metal fine particles are treated with a silane ring agent containing nitrogen.

  Furthermore, although it is not the electroconductive particle used for the electrical connection between electrodes, the following patent document 3 uses the dispersion liquid containing several electroconductive fine particles and water, and a hydrolyzable organosilicon compound. Thus, there are disclosed particles in which a plurality (for example, 3 to 20) of conductive fine particles are linked in a chain by a cross-linked product of a hydrolyzable organosilicon compound.

JP 2008-120990 A JP 2002-231053 A JP 2006-339113 A

  In the conventional conductive particles as described in Patent Document 1, at least a part of the conductive layer is exposed. For this reason, rust tends to be generated on the surface of the conductive layer by a corrosive gas in the atmosphere or a corrosive substance in the anisotropic conductive material. For this reason, high conductivity may not be sufficiently maintained over a long period of time. Further, when the electrodes are connected using conductive particles in which rust is generated in the conductive layer, the electrodes may not be electrically connected reliably or the connection resistance between the electrodes may be increased.

  As described above, the particles described in Patent Documents 2 and 3 are not used for electrical connection between electrodes. Specifically, the particles described in Patent Document 2 are merely used to form a wiring pattern. The particles connected in a chain form described in Patent Document 3 are only used to form a transparent conductive film.

  Further, in the particles described in Patent Document 2, depending on the type of insulating resin covering the surface of the metal fine particles, when the particles are added to a solvent such as a binder resin, the particles are not sufficiently dispersed, Particles may settle inside.

  In addition, the metal fine particles constituting the particles described in Patent Document 2 and the conductive fine particles connected in a chain shape described in Patent Document 3 are entirely formed of metal. For this reason, even if the particles described in Patent Documents 2 and 3 are used for electrical connection between the electrodes, the particles are not sufficiently deformed when the electrodes are pressure-bonded via the particles. There is a problem that the contact area between the electrode and the electrode becomes small. For this reason, the conduction | electrical_connection reliability between electrodes becomes low.

  It is an object of the present invention to prevent rust from being generated in the conductive layer, to maintain high conductivity over a long period of time, to further improve hydrophilicity, and to improve dispersibility with respect to an oxygen-containing resin such as an epoxy resin. It is to provide a conductive particle, and an anisotropic conductive material and a connection structure using the conductive particle.

  A limited object of the present invention is conductive particles with insulating particles, which can enhance the adhesion of insulating particles, and anisotropic conductive materials and connections using the conductive particles It is to provide a structure.

  According to a wide aspect of the present invention, there is provided a conductive particle body having resin particles, a conductive layer provided on the surface of the resin particles, and a coating layer covering the surface of the conductive particle body. Provided is a conductive particle in which the coating layer is formed by crosslinking an organosilicon compound.

  The conductive particles according to the present invention are preferably conductive particles used for electrical connection between electrodes.

  On the specific situation with the electroconductive particle which concerns on this invention, the electroconductive particle is further equipped with the insulating particle adhering on the surface of the said coating layer, and is an electroconductive particle with an insulating particle.

  In another specific aspect of the conductive particles according to the present invention, insulating particles are not attached on the surface of the coating layer.

  In another specific aspect of the conductive particle according to the present invention, the organosilicon compound does not contain nitrogen.

  In another specific aspect of the conductive particle according to the present invention, the conductive layer has a protrusion on the outer surface.

  The anisotropic conductive material according to the present invention includes conductive particles configured according to the present invention and a binder resin.

  The connection structure according to the present invention includes a first connection target member, a second connection target member, and a connection portion connecting the first and second connection target members, and the connection The portion is formed of conductive particles configured according to the present invention or an anisotropic conductive material including the conductive particles and a binder resin.

  The conductive particle according to the present invention includes a conductive particle body in which a conductive layer is provided on the surface of a resin particle, and a coating layer that covers the surface of the conductive particle body, and further includes the coating layer. However, since it is formed by crosslinking an organic silicon compound, rust is hardly generated in the conductive layer. Therefore, when the electrodes are connected using the conductive particles according to the present invention, the reliability of conduction between the electrodes can be improved.

  Furthermore, in the electroconductive particle which concerns on this invention, since the coating layer is formed by bridge | crosslinking an organosilicon compound, the hydrophilic property of a surface can be improved and with respect to oxygen-containing resin like an epoxy resin Dispersibility can be increased.

FIG. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing conductive particles according to the second embodiment of the present invention. FIG. 3 is a cross-sectional view showing conductive particles according to the third embodiment of the present invention. 4 is a front cross-sectional view schematically showing a connection structure using the conductive particles shown in FIG.

  Details of the present invention will be described below.

  The electroconductive particle which concerns on this invention is equipped with an electroconductive particle main body and the coating layer which has coat | covered the surface of an electroconductive particle main body. The conductive particle body includes resin particles and a conductive layer provided on the surface of the resin particles. The coating layer is formed by crosslinking an organosilicon compound. By adopting such a configuration, rust hardly occurs in the conductive layer, and high conductivity can be maintained over a long period of time. Therefore, when the electrodes are connected using the conductive particles according to the present invention, the reliability of conduction between the electrodes can be improved.

  Furthermore, in the electroconductive particle which concerns on this invention, the coating layer is formed by bridge | crosslinking the organosilicon compound containing oxygen like a hydroxyl group or an alkoxy group. For this reason, the oxygen of the coating layer can be hydrogen-bonded. Therefore, in the conductive particles according to the present invention, the hydrophilicity of the surface can be increased and the dispersibility can be increased with respect to an oxygen-containing resin such as an epoxy resin. Furthermore, in the electroconductive particle which concerns on this invention, the hydrophilic property of a surface can be improved and adhesiveness can also be improved with respect to oxygen-containing resin like an epoxy resin. In addition, since the coating layer is formed by crosslinking an organic silicon compound containing oxygen such as a hydroxy group or an alkoxy group, water molecules hardly erode the metal surface, and thus the surface is high while being hydrophilic. Reliability can be maintained.

  Hereinafter, the present invention will be clarified by describing specific embodiments and examples of the present invention with reference to the drawings.

(Conductive particles)
FIG. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention.

  A conductive particle 1 shown in FIG. 1 includes a conductive particle body 2 and a coating layer 3 that covers the surface of the conductive particle body 2. The conductive particles 1 are spherical. The coating layer 3 covers the entire surface of the conductive particle body 2. The covering layer 3 is formed by crosslinking an organosilicon compound. Insulating particles are not adhered on the surface of the covering layer 3. In this embodiment, a silane coupling agent is used as the organosilicon compound.

  The conductive particle body 2 includes resin particles 11 and a conductive layer 12 provided on the surface of the resin particles 11. The covering layer 3 covers the outer surface of the conductive layer 12. The conductive particle body 2 is a coated particle in which the surface of the resin particle 11 is coated with the conductive layer 12. The coating layer 3 covers the surface of the conductive particle body 2 so as to be in contact with the conductive layer 12.

  FIG. 2 is a cross-sectional view showing conductive particles according to the second embodiment of the present invention.

  The conductive particle 21 shown in FIG. 2 includes a conductive particle body 2, a coating layer 3 covering the surface of the conductive particle body 2, and a plurality of insulating particles attached on the surface of the coating layer 3. 22. The conductive particles 21 are conductive particles with insulating particles. A covering layer 3 is disposed between the conductive particle body 2 and the insulating particles 22. The conductive particles 21 are configured in the same manner as the conductive particles 1 except that the insulating particles 22 are provided.

  The insulating particles 22 are formed of an insulating material. Only a part of the insulating particles 22 is attached to the coating layer 3, and the coating layer 3 does not cover the surface of the insulating particles 22. Some regions of the insulating particles 22 may be embedded in the coating layer 3.

  In the conductive particles 21, a plurality of insulating particles 22 are attached to the surface of the coating layer 3. Instead of the insulating particles 22 being attached, the outer surface of the covering layer 3 may be covered with an insulating layer formed of an insulating material. In this case, the entire outer surface of the covering layer 3 may not be covered with the insulating layer, and at least a part of the outer surface of the covering layer may be covered with the insulating layer.

  FIG. 3 is a cross-sectional view showing conductive particles according to the third embodiment of the present invention.

  3 includes a conductive particle body 32, a coating layer 33 covering the surface of the conductive particle body 32, and a plurality of insulating particles attached on the surface of the coating layer 33. 22. The conductive particles 31 are conductive particles with insulating particles.

  The conductive particle main body 32 includes resin particles 11 and a conductive layer 34 provided on the surface of the resin particles 11. The conductive particle main body 32 has a plurality of core substances 35 on the surface of the resin particles 11. The conductive layer 34 covers the resin particles 11 and the core material 35. By covering the core substance 35 with the conductive layer 34, the conductive layer 34 has a plurality of protrusions 36 on the outer surface. The outer surface of the conductive layer 34 is particled by the core material 35, and a plurality of protrusions 36 are formed. Therefore, the conductive particle body 32 has a plurality of protrusions on the surface. The covering layer 33 also has a plurality of protrusions on the outer surface.

  Like the conductive particles 31, the conductive particles may have protrusions. In the conductive particles 31, a plurality of insulating particles 22 are attached to the surface of the coating layer 33. The conductive particles 31 may not have the insulating particles 22. The outer surface of the covering layer 33 may be covered with an insulating layer formed of an insulating material.

  In the electroconductive particle which concerns on this invention, the electroconductive particle main body by which the conductive layer was provided on the surface of the resin particle instead of the electroconductive particle main body formed entirely with the metal is used. When connecting between electrodes using electroconductive particle, after arrange | positioning electroconductive particle between electrodes, generally electroconductive particle is compressed. When the core of the conductive particle main body is a resin particle, the conductive particle is easily deformed by compression, and the contact area between the conductive particle and the electrode can be increased. For this reason, the conduction | electrical_connection reliability between electrodes can be improved. In general, conductive particles used for forming a wiring pattern or forming a transparent conductive coating are generally metal particles formed of metal.

  Examples of the resin for forming the resin particles include polyolefin resin, acrylic resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polysulfone, and polyphenylene. Examples thereof include oxides, polyacetals, polyimides, polyamideimides, polyetheretherketones, and polyethersulfones. Since the conductive particles can be appropriately deformed by compression, the resin particles are formed of a polymer obtained by polymerizing one or more polymerizable monomers having an ethylenically unsaturated group. Is preferred.

  The particle diameter of the resin particles is preferably in the range of 1 to 100 μm. The particle diameter of the resin particles is more preferably 2 μm or more, more preferably 50 μm or less, still more preferably 30 μm or less, and particularly preferably 5 μm or less. When the particle diameter of the resin particles is equal to or more than the above lower limit, the contact area between the conductive particles and the electrodes is sufficiently large, and the conduction reliability between the electrodes is further enhanced. Furthermore, when providing a conductive layer, it becomes difficult to form aggregated conductive particles. The space | interval between electrodes can be made small as the particle diameter of a resin particle is below the said upper limit. The particle diameter of the resin particle indicates a diameter when the resin particle is a true sphere, and indicates a maximum diameter when the resin particle is not a true sphere.

  The particle diameter of the resin particles is preferably in the range of 2 to 5 μm. When the particle diameter of the resin particles is in the range of 2 to 5 μm, the size is suitable for the conductive particles in the anisotropic conductive material, and the distance between the electrodes is further reduced.

  The conductive layer may have a single layer structure or a multilayer structure in which a plurality of layers are stacked. Examples of the metal for forming the conductive layer include gold, silver, palladium, copper, platinum, zinc, iron, lead, tin, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, germanium, cadmium, Examples include palladium, bismuth, thallium, tin-lead alloy, tin-copper alloy, tin-silver alloy, and tin-lead-silver alloy. In addition, tin-doped indium oxide (ITO) may be used as the metal. As for the said metal, only 1 type may be used, 2 or more types may be used together, and an alloy may be sufficient as it.

  The conductive layer is preferably a nickel layer, a palladium layer, a copper layer, or a gold layer, and more preferably a nickel layer, a copper layer, or a gold layer. By using the conductive particles having these preferable conductive layers for the connection between the electrodes, the connection resistance between the electrodes can be further reduced.

  The method for forming the conductive layer on the surface of the resin particles is not particularly limited. Examples of the method for forming the conductive layer include a method by electroless plating, a method by electroplating, a method by physical vapor deposition, and a method of coating the surface of resin particles with a metal powder or a paste containing a metal powder and a binder. Is mentioned. Especially, since formation of a conductive layer is simple, the method by electroless plating is preferable. Examples of the method by physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering.

  In the method of forming by electroless plating, generally, a catalyzing step and an electroless plating step are performed.

  Like the electroconductive particle 31, it is preferable that the electroconductive particle which concerns on this invention has a processus | protrusion on the outer surface of a conductive layer. The conductive particles preferably have a plurality of protrusions on the outer surface of the conductive layer. An oxide film is often formed on the surface of the electrode connected by the conductive particles. Furthermore, an oxide film may be formed on the surface of the conductive layer of the conductive particle body. By using the conductive particles having protrusions, the oxide film is effectively eliminated by the protrusions by placing the conductive particles between the electrodes and then pressing them. For this reason, an electrode and the protrusion of electroconductive particle can be made to contact still more reliably, and the connection resistance between electrodes can be made low. Furthermore, when the conductive particles have insulating particles or an insulating layer on the surface, or when the conductive particles are dispersed in a binder resin and used as an anisotropic conductive material, the conductive particles are projected by the protrusions of the conductive particles. The binder resin between the protrusions of the conductive particles and the electrode can be effectively eliminated. For this reason, the conduction | electrical_connection reliability between electrodes can be improved.

  As a method of forming protrusions on the surface of the conductive layer, a method of forming a conductive layer by electroless plating after attaching a core substance to the surface of the resin particle, and a method of forming a conductive layer by electroless plating on the surface of the resin particle. Examples of the method include forming a conductive layer by electroless plating after the core material is attached.

  The thickness of the conductive layer is preferably in the range of 5 to 1000 nm. The thickness of the conductive layer is more preferably 10 nm or more, further preferably 50 nm or more, more preferably 500 nm or less, and still more preferably 300 nm or less. When the thickness of the conductive layer is not less than the above lower limit, the conductivity of the conductive particles can be sufficiently increased. When the thickness of the conductive layer is not more than the above upper limit, the difference in coefficient of thermal expansion between the resin particles and the conductive layer becomes small, and the conductive layer is difficult to peel from the resin particles.

  The thickness of the conductive layer is particularly preferably in the range of 50 to 300 nm. Furthermore, it is particularly preferable that the particle diameter of the resin particles is 2 to 5 μm, and the thickness of the conductive layer is 50 to 300 nm. In this case, the conductive particles can be suitably used for applications in which a large current flows. Furthermore, when the conductive particles are compressed to connect the electrodes, it is possible to further suppress the electrodes from being damaged.

  As a method for attaching the core substance to the surface of the resin particles, for example, a conductive substance as a core substance is added to the dispersion of the resin particles, and the core substance is applied to the surface of the resin particles, for example, van der Waals force. And a method of adding a conductive substance as a core substance to a container containing resin particles, and attaching a core substance to the surface of the resin particles by mechanical action such as rotation of the container, etc. Is mentioned. Among these, since the amount of the core substance to be attached is easily controlled, a method of accumulating and attaching the core substance on the surface of the resin particles in the dispersion is preferable.

  Examples of the conductive material for forming the core material include conductive non-metals such as metals, metal oxides, and graphite, and conductive polymers. Examples of the conductive polymer include polyacetylene. Among them, metal is preferable because conductivity can be increased.

  Examples of the metal include gold, silver, copper, platinum, zinc, iron, lead, tin, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium and cadmium, and tin-lead. Examples include alloys composed of two or more metals such as alloys, tin-copper alloys, tin-silver alloys, and tin-lead-silver alloys. Of these, nickel, copper, silver or gold is preferable. The metal for forming the core material may be the same as or different from the metal for forming the conductive layer. In particular, when the conductive layer is a nickel layer, the metal for forming the core substance is more preferably nickel that is optimal for promoting the epitaxial growth of the nickel layer.

  The shape of the core material is not particularly limited. The shape of the core substance is preferably a lump. Examples of the core substance include a particulate lump, an agglomerate in which a plurality of fine particles are aggregated, and an irregular lump.

  In the conductive particles according to the present invention, the coating layer is formed by crosslinking an organosilicon compound. Specifically, the coating layer can be formed by hydrolyzing and polycondensing the organosilicon compound. The coating layer formed by the crosslinking of the organosilicon compound has a plurality of silanol groups on the surface. For this reason, it is thought that the hydrophilicity of a coating layer becomes high.

  On the other hand, in order to suppress the occurrence of rust on the surface of the conductive layer of the conductive particle body, the surface of the conductive layer may be subjected to a rust prevention treatment with a phosphoric acid compound such as alkyl metaphosphoric acid or alkyl phosphate ester. is there. When the coating layer is formed of a phosphoric acid compound instead of an organosilicon compound, the hydrophilicity of the conductive particles cannot be sufficiently increased.

  In order to increase the hydrophilicity of the surface of the conductive particles, the organosilicon compound preferably has a hydroxy group or an alkoxy group. As said organosilicon compound, the organosilicon compound represented by following formula (1) is mentioned. However, an organosilicon compound other than the organosilicon compound represented by the following formula (1) may be used. As for the organosilicon compound, only 1 type may be used and 2 or more types may be used together.

Si (X) _p (R) _4-p (1)
In said formula (1), X represents a hydrolysable group, R represents a C1-C30 non-hydrolyzable organic group, and p represents the integer of 1-4. When p is 2 to 4, a plurality of X may be the same or different. When p is 1 or 2, the plurality of R may be the same or different.

  Examples of the hydrolyzable group include an alkoxy group. Specific examples of the alkoxy group include an alkoxy group having 1 to 6 carbon atoms. Examples of the alkoxy group having 1 to 6 carbon atoms include a methoxy group, an ethoxy group, and a propoxy group.

  The hydrolyzable group may be a hydrolyzable group other than an alkoxy group. Specific examples of the hydrolyzable group other than the alkoxy group include a halogen group such as chlorine or bromine, an acetyl group, a hydroxyl group, and an isocyanate group.

  Examples of the non-hydrolyzable organic group include organic groups having 1 to 30 carbon atoms that are hardly hydrolyzed and are stable hydrophobic groups.

  Examples of the organic group having 1 to 30 carbon atoms include an alkyl group having 1 to 30 carbon atoms, a halogenated alkyl group, an aromatic substituted alkyl group, an aryl group, a group containing a vinyl group, an organic group containing an epoxy group, and an amino group. And an organic group containing a thiol group.

  Examples of the alkyl group having 1 to 30 carbon atoms include methyl group, ethyl group, propyl group, butyl group, hexyl group, cyclohexyl group, octyl group, pentyl group, decyl group, dodecyl group, tetradecyl group, hexadecyl group, and octadecyl group. And an eicosyl group. Examples of the halogenated alkyl group include a fluorinated group of an alkyl group, a chlorinated group of an alkyl group, and a bromide group of an alkyl group. Specific examples of the halogenated alkyl group include, for example, 3-chloropropyl group, 6-chloropropyl group, 6-chlorohexyl group, 6,6,6-trifluorohexyl group and the like. Examples of the aromatic substituted alkyl group include a benzyl group and a halogen-substituted benzyl group. Examples of the halogen-substituted benzyl group include 4-chlorobenzyl group and 4-bromobenzyl group. Examples of the aryl group include a phenyl group, a tolyl group, a mesityl group, and a naphthyl group.

  Specific examples of the organosilicon compound include, for example, triphenylethoxysilane, trimethylethoxysilane, triethylethoxysilane, triphenylmethoxysilane, triethylmethoxysilane, ethyldimethylmethoxysilane, methyldiethylmethoxysilane, ethyldimethylethoxysilane, methyl Diethylethoxysilane, phenyldimethylmethoxysilane, phenyldiethylmethoxysilane, phenyldimethylethoxysilane, phenyldiethylethoxysilane, methyldiphenylmethoxysilane, ethyldiphenylmethoxysilane, methyldiphenylethoxysilane, ethyldiphenylethoxysilane, tert-butoxytrimethylsilane, Butoxytrimethylsilane, dimethylethoxysilane, methoxydimethylvinylsila , Ethoxydimethylvinylsilane, diphenyldiethoxysilane, phenyldiethoxysilane, dimethyldimethoxysilane, diacetoxymethylsilane, diethoxymethylsilane, 3-chloropropyldimethoxymethylsilane, chloromethyldiethoxymethylsilane, diethoxydimethylsilane, di Acetoxymethylvinylsilane, diethoxymethylvinylsilane, diethoxydiethylsilane, dimethyldipropoxysilane, dimethoxymethylphenylsilane, methyltrimethoxysilane, methyltriethoxysilane, methyl-tri-n-propoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane Ethoxysilane, ethyl-tri-n-propoxysilane, propyltrimethoxysilane, propyltriethoxysilane, propyl-tri-n- Roxyxysilane, butyltrimethoxysilane, butyltriethoxysilane, butyltripropoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, isobutyltripropoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-hexyltri Propoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, cyclohexyltripropoxysilane, octyltrimethoxysilane, octyltriethoxysilane, octyltripropoxysilane, dodecyltrimethoxysilane, dodecyltriethoxysilane, dodecyltripropoxysilane, tetradecyl Trimethoxysilane, tetradecyltriethoxysilane, tetradecyltripropoxysilane, hexa Decyltrimethoxysilane, hexadecyltriethoxysilane, hexadecyltripropoxysilane, octadecyltrimethoxysilane, octadecyltriethoxysilane, octadecyltripropoxysilane, eicosyldecyltrimethoxysilane, eicosyltriethoxysilane, eicosyltripropoxysilane , 6-chlorohexyltrimethoxysilane, 6,6,6-trifluorohexyltrimethoxysilane, benzyltrimethoxysilane, 4-chlorobenzyltrimethoxysilane, 4-bromobenzyltri-n-propoxysilane, phenyltrimethoxysilane , Phenyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3- Lysidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltri Methoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N- 2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-isocyanatopropyltriethoxysilane, triethoxysilane, trimethoxysilane, triisopropoxysilane, tri-n-propoxysilane, triacetoxysilane, tetramethoxy Examples thereof include silane, tetraethoxysilane, tetra-n-propoxysilane, tetraisopropoxysilane, and tetraacetoxysilane.

  The organosilicon compound may not contain nitrogen. Even if the organosilicon compound does not contain nitrogen, the hydrophilicity of the conductive particles can be sufficiently increased.

  The thickness of the coating layer is preferably in the range of 0.5 to 500 nm. The thickness of the coating layer is more preferably 1 nm or more, further preferably 3 nm or more, more preferably 400 nm or less, and still more preferably 300 nm or less. The hydrophilicity of electroconductive particle can be improved further as the thickness of a coating layer is more than the said minimum. The electroconductivity of electroconductive particle can be improved further as the thickness of an electroconductive layer is below the said upper limit.

  Like the electroconductive particle 21 and 31, the electroconductive particle which concerns on this invention is provided with the insulating particle adhering on the surface of a coating layer. In this case, when the conductive particles are used for connection between the electrodes, a short circuit between adjacent electrodes can be prevented. Specifically, when a plurality of conductive particles are in contact with each other, since insulating particles exist between the plurality of electrodes, it is possible to prevent a short circuit between electrodes adjacent in the lateral direction instead of between the upper and lower electrodes. . In addition, the insulating particle between an electroconductive particle main body and an electrode can be easily excluded by pressurizing electroconductive particle with two electrodes in the case of the connection between electrodes. When the conductive particles have protrusions on the surface of the conductive layer, the insulating particles between the conductive particle main body and the electrode can be more easily eliminated.

  Specific examples of the material for forming the insulating particles include polyolefins, (meth) acrylate polymers, (meth) acrylate copolymers, block polymers, thermoplastic resins, crosslinked thermoplastic resins, and thermosetting. Resin, water-soluble resin, and the like.

  Examples of the polyolefins include polyethylene, ethylene-vinyl acetate copolymer, and ethylene-acrylic acid ester copolymer. Examples of the (meth) acrylate polymer include polymethyl (meth) acrylate, polyethyl (meth) acrylate, and polybutyl (meth) acrylate. Examples of the block polymer include polystyrene, styrene-acrylic acid ester copolymer, SB type styrene-butadiene block copolymer, SBS type styrene-butadiene block copolymer, and hydrogenated compounds thereof. Examples of the thermoplastic resin include vinyl polymers and vinyl copolymers. As said thermosetting resin, an epoxy resin, a phenol resin, a melamine resin, etc. are mentioned. Examples of the water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinyl pyrrolidone, polyethylene oxide, and methyl cellulose. Of these, water-soluble resins are preferable, and polyvinyl alcohol is more preferable.

  Examples of a method for attaching insulating particles on the surface of the coating layer include a chemical method and a physical or mechanical method. Examples of the chemical method include an interfacial polymerization method, a suspension polymerization method in the presence of particles, and an emulsion polymerization method. Examples of the physical or mechanical method include spray drying, hybridization, electrostatic adhesion, spraying, dipping, and vacuum deposition. Among these, from the viewpoint of suppressing unintentional peeling of the insulating particles, a method of attaching the insulating particles to the surface of the coating layer through a chemical bond is preferable.

(Anisotropic conductive material)
The anisotropic conductive material according to the present invention includes the above-described conductive particles and a binder resin. The anisotropic conductive material is preferably an anisotropic conductive material obtained by adding conductive particles including a coating layer to a binder resin.

  The conductive particles may be used by being dispersed in an aqueous solvent or used by being dispersed in a binder resin depending on the application. The conductive particles according to the present invention are not only excellent in dispersibility in the binder resin, but also excellent in dispersibility in an aqueous solvent, and thus can be applied to a wide range of uses. The conductive particles according to the present invention have a high affinity for an aqueous solvent and can be easily dispersed in an aqueous solvent. Moreover, the electroconductive particle which concerns on this invention is hard to settle in an aqueous solvent. Therefore, the anisotropic conductive material according to the present invention preferably contains an aqueous solvent. Furthermore, the conductive particles according to the present invention can be used by being dispersed in a binder resin. The conductive particles according to the present invention may contain an aqueous solvent and a binder resin different from the aqueous solvent.

  Examples of the aqueous solvent include water and a mixture of water and a hydrophilic solvent other than water (a solvent miscible with water). Examples of the hydrophilic solvent include hydrophilic organic solvents. Examples of the hydrophilic organic solvent include alcohols such as acetone, methanol and ethanol, ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol mono-t-butyl ether and isopropyl alcohol.

  The binder resin is not particularly limited. In general, an insulating resin is used as the binder resin. Examples of the binder resin include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers. As for the said binder resin, only 1 type may be used and 2 or more types may be used together.

  Examples of the vinyl resin include vinyl acetate resin, acrylic resin, and styrene resin. Examples of the thermoplastic resin include polyolefin resins, ethylene-vinyl acetate copolymers, and polyamide resins. Examples of the curable resin include an epoxy resin, a urethane resin, a polyimide resin, and an unsaturated polyester resin. The curable resin may be a room temperature curable resin, a thermosetting resin, a photocurable resin, or a moisture curable resin. The curable resin may be used in combination with a curing agent. Examples of the thermoplastic block copolymer include a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a hydrogenated product of a styrene-butadiene-styrene block copolymer, and a styrene-isoprene. -Hydrogenated product of a styrene block copolymer. Examples of the elastomer include styrene-butadiene copolymer rubber and acrylonitrile-styrene block copolymer rubber.

  The binder resin is preferably an epoxy resin. In the conductive particles according to the present invention, oxygen in the coating layer can be hydrogen-bonded, and the hydrophilicity of the surface is increased, and the dispersibility and adhesion to an oxygen-containing resin such as an epoxy resin are increased. Can do.

  In addition to the conductive particles and the binder resin, the anisotropic conductive material includes, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, light, and the like. Various additives such as a stabilizer, an ultraviolet absorber, a lubricant, an antistatic agent and a flame retardant may be contained.

  The method for dispersing the conductive particles in the binder resin is not particularly limited, and a conventionally known dispersion method can be used. Examples of the method for dispersing the conductive particles in the binder resin include a method in which the conductive particles are added to the binder resin and then kneaded and dispersed with a planetary mixer or the like. The conductive particles are dispersed in water or organic. After uniformly dispersing in a solvent using a homogenizer, etc., adding to a binder resin, kneading and dispersing with a planetary mixer, etc., and after diluting the binder resin with water or an organic solvent, the above conductive And the like, and the like.

  The anisotropic conductive material according to the present invention can be used as an anisotropic conductive paste, anisotropic conductive ink, anisotropic conductive adhesive, anisotropic conductive film, or anisotropic conductive sheet. When the anisotropic conductive material according to the present invention is used as a film-like adhesive such as an anisotropic conductive film or an anisotropic conductive sheet, the film-like adhesive containing the conductive particles, A film-like adhesive that does not contain conductive particles may be laminated.

  The anisotropic conductive material according to the present invention is preferably an anisotropic conductive paste. By using the conductive particles according to the present invention, in the anisotropic conductive paste, the dispersibility of the conductive particles is increased, and the conductive particles are less likely to settle.

  In 100% by weight of the anisotropic conductive material, the content of the binder resin is preferably in the range of 10 to 99.99% by weight. The content of the binder resin in 100% by weight of the anisotropic conductive material is more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, more preferably 99.9% by weight or less. It is. When the content of the binder resin is not less than the above lower limit and not more than the upper limit, the conductive particles can be efficiently arranged between the electrodes, and the conduction reliability of the connection target member connected by the anisotropic conductive material is further enhanced. Can do.

  In 100% by weight of the anisotropic conductive material, the content of the conductive particles is preferably in the range of 0.01 to 20% by weight. The content of conductive particles in 100% by weight of the anisotropic conductive material is more preferably 0.1% by weight or more, more preferably 15% by weight or less, and still more preferably 10% by weight or less. When the content of the conductive particles is not less than the above lower limit and not more than the upper limit, the conduction reliability between the electrodes can be further improved.

(Connection structure)
A connection structure can be obtained by connecting the connection target member using the conductive particles of the present invention or an anisotropic conductive material containing the conductive particles and a binder resin.

  The connection structure includes a first connection target member, a second connection target member, and a connection portion that electrically connects the first and second connection target members. The connection structure is preferably formed of the conductive particles of the invention or an anisotropic conductive material containing the conductive particles and a binder resin. The connection part is preferably formed of an anisotropic conductive material containing the conductive particles of the present invention and a binder resin. In the case where conductive particles are used, the connection portion itself is conductive particles. That is, the first and second connection target members are connected by the conductive particles.

  In FIG. 4, the connection structure using the electroconductive particle which concerns on the 1st Embodiment of this invention is typically shown with front sectional drawing.

  4 includes a first connection target member 52, a second connection target member 53, and a connection portion 54 that connects the first and second connection target members 52 and 53. Prepare. The connection portion 54 is formed by curing an anisotropic conductive material including the conductive particles 1. In FIG. 4, the conductive particles 1 are schematically shown for convenience of illustration.

  A plurality of electrodes 52 b are provided on the upper surface 52 a of the first connection target member 52. A plurality of electrodes 53 b are provided on the lower surface 53 a of the second connection target member 53. The electrode 52 b and the electrode 53 b are electrically connected by one or a plurality of conductive particles 1. Therefore, the first and second connection target members 52 and 53 are electrically connected by the conductive particles 1.

  The manufacturing method of the connection structure is not particularly limited. As an example of a method for manufacturing a connection structure, the anisotropic conductive material is disposed between a first connection target member and a second connection target member to obtain a laminate, and then the laminate is heated and The method of pressurizing is mentioned.

The pressure of the said pressurization is about 9.8-10 < ⁴ > -4.9 * 10 < ⁶ > Pa. The temperature of the said heating is about 120-220 degreeC.

  Specific examples of the connection target member include electronic components such as semiconductor chips, capacitors, and diodes, and circuit boards such as printed boards, flexible printed boards, and glass boards.

  Examples of the electrode provided on the connection target member include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a molybdenum electrode, and a tungsten electrode. When the connection object member is a flexible printed board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode. In addition, when the said electrode is an aluminum electrode, the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated | stacked on the surface of the metal oxide layer may be sufficient. Examples of the metal oxide include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited only to the following examples.

Example 1
(1) Production of Conductive Particle Body A divinylbenzene copolymer resin particle (“Micropearl SP-205” manufactured by Sekisui Chemical Co., Ltd.) having a particle diameter of 5.0 μm was prepared.

  After dispersing 10 parts by weight of the resin particles in 100 parts by weight of an alkaline solution containing 5% by weight of a palladium catalyst solution using an ultrasonic disperser, the resin particles were taken out by filtering the solution. Next, the resin particles were added to 100 parts by weight of a 1% by weight dimethylamine borane solution to activate the surface of the resin particles. The resin particles whose surface was activated were sufficiently washed with water, and then added to 500 parts by weight of distilled water and dispersed to obtain a suspension.

  Further, a nickel plating solution (pH 8.5) containing 0.23 mol / L of nickel sulfate, 0.92 mol / L of dimethylamine borane, and 0.5 mol / L of sodium citrate was prepared.

  While stirring the obtained suspension at 60 ° C., the nickel plating solution was gradually added dropwise to the suspension to perform electroless nickel plating. When a conductive layer (nickel-boron conductive layer containing nickel and boron) having a thickness of about 0.08 μm was formed on the surface of the resin particles, dropping of the electroless plating solution was terminated. Thereafter, by filtering the suspension, the particles are taken out, washed with water, and dried, so that the conductive particles provided with a nickel-boron conductive layer (thickness 0.1 μm) on the surface of the resin particles are made conductive. Obtained as particle body A.

(2) Production of conductive particles To 150 parts by weight of 95% by weight ethanol water, 5 parts by weight of the obtained conductive particle main body A and 1.5 parts by weight of methyltriethoxysilane which is an organosilicon compound are added, and 30 Heating at 30 ° C. for 30 minutes to crosslink the organosilicon compound yielded conductive particles in which the entire surface of the conductive particle body was covered with a coating layer (thickness 5 nm).

(Example 2)
When the conductive particles were produced, the entire surface of the conductive particle main body was covered with a coating layer (thickness 5 nm) except that the organosilicon compound was changed to 1.5 parts by weight of phenyltriethoxysilane. ) To obtain conductive particles coated.

(Example 3)
When the conductive particles were produced, the entire surface of the conductive particle main body was the same as in Example 1 except that the organosilicon compound was changed to 1.5 parts by weight of 3-glycidoxypropyltriethoxysilane. Conductive particles coated with a coating layer (thickness 5 nm) were obtained.

Example 4
When the conductive particles were produced, the entire surface of the conductive particle main body was covered with a coating layer (thickness of 5 nm), except that the organosilicon compound was changed to 1.5 parts by weight of hexyltriethoxysilane. ) To obtain conductive particles coated.

(Example 5)
The entire surface of the conductive particle body was covered in the same manner as in Example 1 except that the organosilicon compound was changed to 1.5 parts by weight of 3-methacryloxypropyltriethoxysilane when producing the conductive particles. Conductive particles coated with a layer (thickness 5 nm) were obtained.

(Example 6)
(1) Preparation of electroconductive particle (1-1) Palladium adhesion process The divinylbenzene resin particle ("Micropearl SP-205" by Sekisui Chemical Co., Ltd.) whose particle diameter is 5.0 micrometers was prepared. The resin particles were etched and washed with water. Next, resin particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash | cleaned. Resin particles were added to 0.5 wt% dimethylamine borane solution at pH 6 to obtain resin particles to which palladium was attached.

(1-2) Core substance adhesion step The resin particles to which palladium was adhered were stirred and dispersed in 300 mL of ion exchange water for 3 minutes to obtain a dispersion. Next, 1 g of metal nickel particle slurry (average particle diameter 200 nm) was added to the dispersion over 3 minutes to obtain resin particles to which the core substance was adhered.

(1-3) Electroless Nickel Plating Step 500 mL of ion-exchanged water was added to the resin particles to which the core substance was adhered, and the resin particles were sufficiently dispersed to obtain a suspension. While stirring this suspension, an electroless nickel plating solution having a pH of 5.0 containing nickel sulfate hexahydrate 50 g / L, dimethylamine borane 0.32 g / L and citric acid 50 g / L was gradually added. Electroless nickel plating was performed. In this way, a nickel-boron conductive layer (thickness 0.1 μm) is provided on the surface of the resin particle, and the conductive particle having a protrusion on the outer surface of the nickel-boron conductive layer is used as the conductive particle body B. Obtained.

(2) Production of conductive particles When producing the conductive particles, the entire surface of the conductive particle main body was the same as in Example 1 except that the conductive particle main body A was changed to the conductive particle main body B. Conductive particles coated with a coating layer (thickness 5 nm) were obtained.

(Example 7)
(1) Preparation of insulating particles A 1000 mL separable flask equipped with a four-neck separable cover, a stirring blade, a three-way cock, a condenser tube and a temperature probe was charged with 100 mmol methyl methacrylate and N, N, N-trimethyl. Ion-exchanged water containing a monomer composition containing 1 mmol of -N-2-methacryloyloxyethylammonium chloride and 1 mmol of 2,2'-azobis (2-amidinopropane) dihydrochloride so that the solid content is 5% by weight. Then, the mixture was stirred at 200 rpm and polymerized at 70 ° C. for 24 hours under a nitrogen atmosphere. After completion of the reaction, it was freeze-dried to obtain insulating particles having an ammonium group on the surface, an average particle size of 220 nm, and a CV value of 10%.

  The insulating particles were dispersed in ion exchange water under ultrasonic irradiation to obtain a 10 wt% aqueous dispersion of insulating particles.

(2) Production of conductive particles 10 g of the conductive particles obtained in Example 6 were dispersed in 500 mL of ethanol, 4 g of an ethanol dispersion of insulating particles was added, and the mixture was stirred at room temperature for 6 hours. After filtration through a 3 μm mesh filter, the product was further washed with methanol and dried to obtain conductive particles (conductive particles with insulating particles) having insulating particles attached on the surface of the coating layer.

  Observation with a scanning electron microscope (SEM) and calculation of the covering area of insulating particles with respect to the area of 2.5 μm from the center of the conductive particles by image analysis (that is, the projected area of the particle diameter of insulating resin particles) Was 30%.

(Comparative Example 1)
The conductive particle main body A obtained in Example 1 was used as conductive particles.

(Comparative Example 2)
Conductive particles were obtained in the same manner as in Example 1 except that the organosilicon compound was changed to 1.5 parts by weight of 2-ethylhexyl phosphate, which is a phosphoric acid compound, when producing the conductive particles.

(Comparative Example 3)
Conductive particles obtained in Comparative Example 2 and an ethanol dispersion of insulating particles obtained in Example 7 were prepared.

  10 g of the conductive particles obtained in Comparative Example 2 were dispersed in 500 mL of ethanol, 4 g of an ethanol dispersion of insulating particles obtained in Example 7 was added, and the mixture was stirred at room temperature for 6 hours. After filtration through a 3 μm mesh filter, the product was further washed with methanol and dried to obtain conductive particles (conductive particles with insulating particles) having insulating particles attached on the surface of the coating layer.

  Observation with a scanning electron microscope (SEM) and calculation of the covering area of insulating particles with respect to the area of 2.5 μm from the center of the conductive particles by image analysis (that is, the projected area of the particle diameter of insulating resin particles) Was 30%.

(Evaluation)
(1) Dispersibility of conductive particles in aqueous solvent (hydrophilicity of conductive particles)
The obtained conductive particles were added to water and stirred so that the content was 10% by weight. Immediately after preparing the stirring liquid (initial stirring liquid), it was visually observed whether or not the conductive particles were wet dispersed in water or settled in water. The case where it was wet dispersed in water or settled in water was judged as “◯”, and the case where the conductive particles were not wet in water and floated on the water surface was judged as “x”.

  Moreover, after producing a stirring liquid, it stored at 25 degreeC for 72 hours. In the liquid after storage, it was visually observed whether or not the conductive particles were wet dispersed in water or settled in water. The case where the conductive particles were wet dispersed in water or settled in water was judged as “◯”, and the conductive particles were judged as “x” floating on the water surface without getting wet.

(2) Dispersibility of conductive particles in binder resin The obtained conductive particles are added to and dispersed in "Strectbond XN-5A" manufactured by Mitsui Chemicals so that the content is 10% by weight. An anisotropic conductive material which is an anisotropic conductive paste was obtained. Immediately after producing the anisotropic conductive material (initial anisotropic conductive material), it was visually observed whether or not the conductive particles were settled. The case where the conductive particles were not settled was judged as “◯”, and the case where the conductive particles were settled was judged as “x”.

  Moreover, after producing an anisotropic conductive material, it stored at 25 degreeC for 72 hours. In the anisotropic conductive material after storage, it was visually observed whether or not the conductive particles were settled. The case where the conductive particles were not settled was judged as “◯”, and the case where the conductive particles were settled was judged as “x”.

(3) Connection resistance Anisotropic conductive paste is added to and dispersed in "Strectbond XN-5A" manufactured by Mitsui Chemicals so that the content of the obtained conductive particles is 10% by weight. A conductive conductive material (an initial anisotropic conductive material) was obtained. Moreover, after producing an anisotropic conductive material, it stored at 25 degreeC for 72 hours.

  A transparent glass substrate having an ITO electrode pattern with an L / S of 30 μm / 30 μm formed on the upper surface was prepared. Further, a semiconductor chip was prepared in which a copper electrode pattern having L / S of 30 μm / 30 μm was formed on the lower surface.

  On the transparent glass substrate, an initial anisotropic conductive material or an anisotropic conductive material after storage was applied to a thickness of 30 μm to form an anisotropic conductive material layer. Next, the semiconductor chip was stacked on the anisotropic conductive material layer so that the electrodes face each other. Then, while adjusting the temperature of the head so that the temperature of the anisotropic conductive material layer becomes 185 ° C., a pressure heating head is placed on the upper surface of the semiconductor chip and a pressure of 1 MPa is applied to apply the anisotropic conductive material layer. Completely cured at 185 ° C. to obtain a connection structure.

  The connection resistance between the opposing electrodes of the obtained connection structure was measured by the 4-terminal method. The connection resistance was evaluated according to the following evaluation criteria.

[Evaluation criteria for connection resistance]
○○: Connection resistance is 2.0Ω or less ○: Connection resistance exceeds 2.0Ω, 3.0Ω or less △: Connection resistance exceeds 3.0Ω, 5.0Ω or less ×: Connection resistance exceeds 5.0Ω

(4) Rust prevention evaluation (migration evaluation)
The connection structure produced by the evaluation of the connection resistance was left under conditions of 85 ° C. and relative humidity 85%. It was measured with a tester whether or not a leak occurred in 20 adjacent electrodes after 250 hours and 500 hours from the start of standing. A case where no leak occurred was determined as “◯”, and a case where a leak occurred was determined as “×”.

  The results are shown in Table 1 below.

(5) Desorption of insulating particles The conductive particles obtained in Example 7 and Comparative Example 3 were added to ethanol and dispersed so that the content was 10% by weight to obtain an anisotropic conductive material. It was. In the obtained anisotropic conductive material, it was observed whether or not insulating particles were detached from the surface of the coating layer.

  As a result, the anisotropic conductive material using the conductive particles with insulating particles of Example 7 is more conductive than the anisotropic conductive material using the conductive particles with insulating particles of Comparative Example 2. The ratio of insulating particles detached from the surface of the particles was extremely small. This is because in Example 7, since the coating layer was formed by crosslinking the organosilicon compound, the coating layer and the insulating particles were firmly bonded.

DESCRIPTION OF SYMBOLS 1 ... Conductive particle 2 ... Conductive particle main body 3 ... Covering layer 11 ... Resin particle 12 ... Conductive layer 21 ... Conductive particle 22 ... Insulating particle 31 ... Conductive particle 32 ... Conductive particle main body 33 ... Covering layer 34 ... Conductive layer 35 ... core material 36 ... projection 51 ... connection structure 52 ... first connection target member 52a ... upper surface 52b ... electrode 53 ... second connection target member 53a ... lower surface 53b ... electrode 54 ... connection portion

Claims (8)

A conductive particle body having resin particles and a conductive layer provided on the surface of the resin particles;
A coating layer covering the surface of the conductive particle body,
Conductive particles in which the coating layer is formed by crosslinking an organosilicon compound. Conductive particles used for electrical connection between electrodes,
A conductive particle body having resin particles and a conductive layer provided on the surface of the resin particles;
A coating layer covering the surface of the conductive particle body,
Conductive particles in which the coating layer is formed by crosslinking an organosilicon compound. Insulating particles attached on the surface of the coating layer further,
The electroconductive particle of Claim 1 or 2 which is an electroconductive particle with an insulating particle.   The electroconductive particle of Claim 1 or 2 with which the insulating particle has not adhered on the surface of the said coating layer.   The electroconductive particle of any one of Claims 1-4 in which the said organosilicon compound does not contain nitrogen.   The electroconductive particle of any one of Claims 1-5 in which the said electroconductive layer has a processus | protrusion on an outer surface.   An anisotropic conductive material containing the electroconductive particle of any one of Claims 1-5, and binder resin. A first connection target member, a second connection target member, and a connection part connecting the first and second connection target members;
The connection structure in which the said connection part is formed with the anisotropic conductive material containing the electroconductive particle of any one of Claims 1-6, or this electroconductive particle and binder resin.

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